Abstract: A cover plate for an electronic device may include: a first layer including a first surface facing a first direction, a second surface facing a second direction opposite to the first direction, and a specified type of fiber disposed between the first and second surfaces; and a second layer having a specified RF shielding effectiveness and disposed in the second direction with respect to the first layer. Various other embodiments are also possible.

Abstract: An electronic device includes a housing including a translucent ceramic member; and a printing film provided on the housing, wherein the printing film includes: an adhesive layer provided on the ceramic member; a base layer including a first surface facing the adhesive layer and a second surface opposite to the first surface; a printing layer provided on the first surface or the second surface of the base layer, the printing layer being viewable through the ceramic member and the adhesive layer; and a shielding printing layer facing the second surface of the base layer.

Abstract: An electronic device according to various embodiments of the disclosure may include a housing including a first plate forming an outer face. The first plate may include a glass plate including a first surface outwardly facing the housing and a second surface inwardly facing the housing, a coating layer including an anti-reflection coating and/or an anti-finger coating above the first surface while forming the outer face, a first layer formed between the first surface of the first glass plate and the coating layer, having a first thickness, and including a first inorganic material, a second layer formed between the first layer and the coating layer, having a second thickness, and including a second inorganic material different from the first inorganic material, a third layer formed between the second layer and the coating layer, having a third thickness thicker than each of the first thickness and the second thickness, and including a third inorganic material, and an opaque layer formed on the second surface.

Abstract: A cover member of an electronic device according to various embodiments of the present disclosure may comprise: a substrate film layer; a metal oxide layer disposed on the upper surface of the substrate film layer and formed by sputtering; a transparent member attached/disposed on the upper surface of the metal oxide layer; a primer layer disposed on the lower surface of the substrate film layer and made of a semi-transparent material; and a photocurable resin layer disposed on the lower surface of the primer layer, the photocurable resin layer comprising, on a surface thereof, a pattern structure in a designated stereoscopic shape. Other embodiments are also possible.