Patents by Inventor Hwanwoo KIM

Hwanwoo KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SEMICONDUCTOR STRUCTURE HAVING COMPOSITE MOLD LAYER
    Publication number: 20220223604
    Abstract: A semiconductor structure of the inventive concepts includes a chip region comprising a plurality of semiconductor chips on the substrate; and a peripheral region at a periphery of the chip region, the peripheral region including a mold structure. The mold structure may include a base mold layer on the substrate, and a composite mold layer on the base mold layer, the composite mold layer comprising at least one bowing sacrificial layer and at least one bowing prevention layer.
    Type: Application
    Filed: September 8, 2021
    Publication date: July 14, 2022
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Hwanyeol PARK, Hwanwoo KIM, Jongkyu LEE, Chulhwan CHOI