Abstract: There is provided a photoelectric conversion module in which an optical device and an optical waveguide are arrayed in a horizontal direction, thereby improving the optical coupling efficiency and therefore, reducing light loss.

Abstract: There is provided a photoelectric conversion module in which an optical device and an optical waveguide are arrayed in a horizontal direction, thereby improving the optical coupling efficiency and therefore, reducing light loss.

Abstract: A fabricating method for optical multilayer thin film structure is disclosed wherein a QWOT stacked film structure is formed on a substrate from which a deposition rate is analyzed, and a non-QWOT stacked film structure is formed using the analyzed deposition rate, and the analyzed deposition rate is applied to the non-QWOT stacked film structure, and wherein thin film thickness control layers having a QWOT are periodically formed on an optical multilayer thin film structure and a deposition rate thereof is applied to a non-QWOT stacked film structure fabricated thereafter, such that thickness of a non-QWOT stacked film structure can be accurately controlled and a multilayer bandpass filter having a pass band desired by an optical device can be embodied.

Abstract: The present invention relates to a method of packaging optical parts for optical communication. According to the method of the present invention, there are advantages in that a packaging process for optical parts is automated to improve productivity and to obtain price competitiveness and uniformity of quality, and a high frequency heater for locally transferring heat to only a solder preform is used to minimize thermal deformation of areas except a soldering area, thereby achieving highly reliable packaging of the optical parts.

Abstract: The present invention relates to a method of packaging optical parts for optical communication. According to the method of the present invention, there are advantages in that a packaging process for optical parts is automated to improve productivity and to obtain price competitiveness and uniformity of quality, and a high frequency heater for locally transferring heat to only a solder preform is used to minimize thermal deformation of areas except a soldering area, thereby achieving highly reliable packaging of the optical parts.

Abstract: Disclosed is a tap coupler which comprises a ferrule comprising first and second optical fibers symmetrically positioned with respect to an optical axis for transmitting optical signals; and a graded index (GRIN) lens converting a part of the optical signals provided by one of the optical fibers of the ferrule into parallel beams and outputting the same, and reflecting the remaining part of the optical signals and outputting the same to another optical fiber of the ferrule, and having an uncoated beam outputting surface. The tap coupler can easily extract a part of the transmitted optical signals with low production cost and a smaller size.

Abstract: Disclosed is a tap coupler which comprises a ferrule comprising first and second optical fibers symmetrically positioned with respect to an optical axis and transmitting optical signals; and a graded index (GRIN) lens converting a part of the optical signals provided by one of the optical fibers of the ferrule into parallel beams and outputting the same, and reflecting the remaining part of the optical signals and outputting the same to another optical fiber of the ferrule, and having an uncoated beam outputting surface of the GRIN lens. The tap coupler can easily extract a part of the transmitted optical signals with low production cost and a smaller size.