Patents by Inventor Hwee Chew

Hwee Chew has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20070029261
    Abstract: A method and a device for treating water using an electromagnetic field. The method comprising the steps of subjecting the water to the electromagnetic field generated utilising an inductor coil; and varying a frequency of a driving signal for the inductor coil such that the generated electromagnetic field has a varying frequency.
    Type: Application
    Filed: September 30, 2005
    Publication date: February 8, 2007
    Inventor: Hwee Chew
  • Publication number: 20060180888
    Abstract: A semiconductor package for optical sensing and method of manufacture thereof is disclosed. The semiconductor package comprises a substrate for transmitting radiation and an integrated circuit chip for sensing the radiation. A plurality of connectors for electrical transmission is disposed on the substrate and a plurality of pillars for facilitating electrical communication between the plurality of connectors and the integrated circuit chip is disposed between at least one of the plurality of connectors and the integrated circuit chip.
    Type: Application
    Filed: February 14, 2005
    Publication date: August 17, 2006
    Applicant: Advanpack Solutions Pte Ltd
    Inventors: Teck Tan, Hwee Chew
  • Publication number: 20060094339
    Abstract: A water jet handler (200) has a loading location (205), a cutting location (210), and an unloading location (215); and two movable mounts (240 and a 245). As a first movable mount (240) receives a molded substrate at the loading location (205), and transport it to the cutting location (210), a second movable mount (245) transports singulated semiconductor packages of a previously singulated molded substrate from the cutting location (210) to the unloading location (215). As the molded substrate on the first movable mount (240) is cut in the X direction (232) by a water jet, the singulated semiconductor packages are unloaded. The molded substrate is then transferred to the second movable mount (245) on which it is cut in the Y direction (272) to produce singulated semiconductor packages, as the first movable mount (240) returns to the loading location (205), when another molded substrate is loaded.
    Type: Application
    Filed: August 29, 2003
    Publication date: May 4, 2006
    Inventors: Jimmy Hwee Chew, Kok Yeow Lim, Fulin Liu