Patents by Inventor Hwee Lun Goh

Hwee Lun Goh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240025161
    Abstract: Provided are laminates including polyethylene and an extruded web layer. The laminates can be adhesiveless and fully compatible with polyethylene recycling streams. They can exhibit improved, maintained, or desirable properties in comparison to existing laminate structures that are not fully compatible with polyethylene recycling streams. The laminate comprises a first film, an extruded web layer, and a second film, where the extruded web layer is between the first film and a lamination layer of the second film and the laminate is formed via extrusion lamination of the extruded web layer.
    Type: Application
    Filed: January 13, 2022
    Publication date: January 25, 2024
    Inventors: Edward L. Lee, Hwee Tatz Thai, Wu Aik Yee, Hwee Lun Goh
  • Patent number: 11833807
    Abstract: Multilayer film embodiments are directed to films produced via thermal lamination without adhesive due to the use of tie layers comprising a blend of ethylene acrylate copolymer and an anhydride grafted ethylene ?-olefin copolymer.
    Type: Grant
    Filed: June 24, 2020
    Date of Patent: December 5, 2023
    Assignee: Dow Global Technologies LLC
    Inventors: Wu Aik Yee, Edward L. Lee, Hwee Tatz Thai, Hwee Lun Goh
  • Publication number: 20230142282
    Abstract: Provided are heat sealing, barrier laminates including polyethylene. The laminates can be adhesiveless and fully compatible with polyethylene recycling streams. They can exhibit improved, maintained, or desirable properties in comparison to existing laminate structures that are not fully compatible with polyethylene recycling streams. The laminate comprises a multilayer film and an oriented film. The oriented film is thermally laminated to the outer layer of the multilayer film to provide the laminate.
    Type: Application
    Filed: April 26, 2021
    Publication date: May 11, 2023
    Inventors: Edward L. Lee, Hwee Tatz Thai, Wu Aik Yee, Hwee Lun Goh
  • Publication number: 20230131094
    Abstract: Provided are barrier laminates including polyethylene which offer heat resistance and a wide sealing window. The laminates can be fully compatible with polyethylene recycling streams and can exhibit improved, maintained, or desirable properties in comparison to existing laminate structures that are not fully compatible with polyethylene recycling streams. The laminate comprises a multilayer film, a polyethylene film, and an adhesive. The adhesive adheres the multilayer film to the polyethylene film to provide the laminate.
    Type: Application
    Filed: April 26, 2021
    Publication date: April 27, 2023
    Inventors: Hwee Lun Goh, Hwee Tatz Thai, Edward L. Lee, Wu Aik Yee
  • Publication number: 20220355574
    Abstract: Multilayer film embodiments are directed to films produced via thermal lamination without adhesive due to the use of tie layers comprising a blend of ethylene acrylate copolymer and an anhydride grafted ethylene ?-olefin copolymer
    Type: Application
    Filed: June 24, 2020
    Publication date: November 10, 2022
    Applicant: Dow Global Technologies LLC
    Inventors: Wu Aik Yee, Edward L. Lee, Hwee Tatz Thai, Hwee Lun Goh
  • Publication number: 20220250363
    Abstract: Multilayer films comprising an outer layer, a sealant layer, and a tie layer positioned between the outer layer and the sealant layer are provided. The outer layer includes one or more of a first polyethylene having a density of greater than 0.945 g/cc and a polyethylene having a density of from 0.910 to 0.940 g/cc. The sealant layer includes one or more of at least one ethylene acid copolymer having from 0.1 to 10 wt % neutralized with a cation source, a polyethylene plastomer having a density below 0.910 g/cc, and an ethylene based polymer having a melting point Tm (DSC) of less than or equal to 108° C. The tie layer includes an adhesive resin selected from the group consisting of anhydride grafted ethylene based polymer, ethylene acid copolymer, and ethylene vinyl acetate.
    Type: Application
    Filed: June 24, 2020
    Publication date: August 11, 2022
    Applicant: Dow Global Technologies LLC
    Inventors: Edward L. Lee, Hwee Tatz Thai, Wu Aik Yee, Hwee Lun Goh
  • Publication number: 20220002048
    Abstract: Embodiments of the present invention relate to sealed multilayer structures, packages formed therefrom, and methods of forming packages. In one aspect, a sealed multilayer structure comprises: (a) a uniaxially oriented multilayer film having a first oriented film thickness, wherein the film is oriented in the machine direction at a draw ratio greater than 1:1 and less than 4:1, and (b) a second multilayer film comprising a sealant layer and having a second film thickness, wherein the sealant layer of the first oriented film is sealed to the sealant layer of the second film, and wherein the total thickness of the sealed films is at least 5 percent greater than the sum of the first oriented film thickness and the second film thickness.
    Type: Application
    Filed: December 16, 2019
    Publication date: January 6, 2022
    Inventors: Wu Aik Yee, Eng Kian Ma, Hwee Lun Goh
  • Publication number: 20200047460
    Abstract: Embodiments of laminate structures and flexible packaging materials incorporating same comprise a first film comprising biaxially-oriented polyethylene terephthalate (BOPET), and a second film laminated to the first film and comprising a co-extruded film, wherein the second film comprises a polyamide layer and a polyolefin layer, the polyolefin layer comprising a first composition. The first composition comprises at least one ethylene based polymer, wherein the first composition comprises a Molecular Weighted Comonomer Distribution Index (MWCDI) value greater than 0.9, and a melt index ratio (I10/I2) that meets the following equation: I10/I2?7.0?1.2× log (I2).
    Type: Application
    Filed: April 19, 2018
    Publication date: February 13, 2020
    Applicants: Dow Global Technologies LLC, PT Dow Indonesia
    Inventors: Hoai Son Nguyen, Jian Wang, Hwee-Lun Goh, Falikul Isbah Batubara, Adit Pradhana Jayusman Setyogroho, Rou Hua Chua, Peter Sandkuehler
  • Publication number: 20190366695
    Abstract: A multilayer cast film includes a cling layer, a release layer, and at least one core layer disposed between and contacting the cling layer and the release layer. The cling layer includes an ultra low density polyethylene (ULDPE), a propylene interpolymer, or blends thereof. The release layer includes a first linear low density polyethylene (first LLDPE) having a density of from 0.915 to 0.938 g/cc and a melt index of from 0.5 g/10 min to 10 g/10 min. Each of the core layers includes a second linear low density polyethylene (second LLDPE) having a density of from 0.905 to 0.930 g/cc and a melt index of from 0.5 g/10 min to 10 g/10 min. The multilayer cast film includes from 3 wt % to 7 wt %, based on a total amount of polymers present in the multilayer cast film, of the low density polyethylene (LDPE).
    Type: Application
    Filed: January 19, 2018
    Publication date: December 5, 2019
    Applicants: Dow Global Technologies LLC, Dow Chemical (Malaysia) Sdn. Bhd., PT Dow Indonesia
    Inventors: Edward L. Lee, Eng Kian Ma, Rajen M. Patel, Peter Yap, Hwee Lun Goh, Adit Pradhana Jayusman Setyogroho
  • Patent number: 9206303
    Abstract: A multilayer film is disclosed, having at least two layers. A first layer includes a first interpolymer of ethylene and at least one alpha-olefin. The first interpolymer has a density of less than 0.925 g/cm3, and an average Mv and a valley temperature between the interpolymer and high crystalline fraction, The, such that the average Mv for a fraction above The from ATREF divided by average Mv of the whole polymer from ATREF (Mhc/Mhp) is less than about 1.95 and the first interpolymer has a CDBI of less than 60%. At least one other second layer includes a second inter-polymer of ethylene and at least one alpha-olefin, the second interpolymer having a density from 0.925 to 0.965 g/cm3. The interpolymer of ethylene and at least one alpha-olefin can have a high density fraction and an overall density such that % HD fraction <0.0168x2?29.636x+13036 where x=density in g/cm3.
    Type: Grant
    Filed: December 16, 2009
    Date of Patent: December 8, 2015
    Assignee: Dow Global Technologies LLC
    Inventors: Xiao Bing Yun, Risdianti Wastiani, Hwee Lun Goh, Chang Wu, Mehmet Demirors
  • Publication number: 20110318560
    Abstract: A multilayer film is disclosed, comprising at least two layers, wherein a first layer comprises a first interpolymer of ethylene and at least one alpha-olefin, characterized wherein the first interpolymer has a density of less than 0.925 g/cm3, and an average Mv and a valley temperature between the interpolymer and high crystalline fraction, The, such that the average Mv for a fraction above The from ATREF divided by average Mv of the whole polymer from ATREF (Mhc/Mhp) is less than about 1.95 and wherein the first interpolymer has a CDBI of less than 60%, and wherein at least one other second layer comprises a second inter-polymer of ethylene and at least one alpha-olefin, wherein the second interpolymer has a density from 0.925 to 0.965 g/cm3. The interpolymer of ethylene and at least one alpha-olefin can also be characterized as having a high density (HD) fraction and an overall density such that % HD fraction <0.0168x2?29.636x+13036 where x is the density in grams/cubic centimeter.
    Type: Application
    Filed: December 16, 2009
    Publication date: December 29, 2011
    Applicant: Dow Global Technologies Inc.
    Inventors: Xiao Bing Yun, Risdianti Wastiani, Hwee Lun Goh, Chang Wu, Mehmet Demirors