Patents by Inventor Hwei-Mei Yu

Hwei-Mei Yu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method to make wafer laser marks visable after bumping process
    Patent number: 6784002
    Abstract: A wafer bumping method comprising the following steps of. A wafer having fields is provided. The wafer having at least one wafer identification character formed thereon within one or more of the fields. A dry film resist is formed over the wafer. Portions of the dry film resist are selectively exposed field by field using a mask whereby the mask is shifted over the one or more fields containing the at least one wafer identification character so that the one or more fields containing the at least one wafer identification character is double exposed after the mask shift so that all of the one or more fields containing the at least one wafer identification character is completely exposed. The selectively exposed dry film resist is developed to remove the non-exposed portions of the dry film resist.
    Type: Grant
    Filed: June 21, 2002
    Date of Patent: August 31, 2004
    Assignee: Taiwan Semiconductor Manufacturing Company
    Inventors: Hui-Peng Wang, Kuo-Wei Lin, Hwei-Mei Yu, Ta-Yang Lin, Charles Tseng