Patents by Inventor Hwei P. Hsu

Hwei P. Hsu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 4186286
    Abstract: To reduce the breakdown potential magnitude of the distributor gap between the output tip surface of an ignition distributor rotor output segment and each of the output electrodes of the distributor cap, a layer of a thermoset silicone dielectric material is bonded to at least a portion of the surface area of the rotor output segment and is so located that the interface between the dielectric material and the metal of the rotor output segment nearest the output tip surface is no further than 0.040 inch radially inwardly from the output tip surface.
    Type: Grant
    Filed: October 10, 1978
    Date of Patent: January 29, 1980
    Assignee: General Motors Corporation
    Inventors: Wey-Chaung Kuo, Hwei P. Hsu