Patents by Inventor Hwei-Tseng Wang

Hwei-Tseng Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11144690
    Abstract: Techniques and systems for implementing a general extensible layer mapping approach that maps between integrated circuit (IC) design database layers and process layers are described. A first IC design layout having in-design layers can be converted into a second IC design layout having derived layers, wherein said converting comprises mapping the in-design layers to the derived layers by applying a set of layer derivation rules to shapes in the IC design layout, and wherein the set of layer derivation rules implements a one-to-many mapping between the in-design layers and the derived layers. Next, a one-to-one mapping between the derived layers and process layers used in a parasitic extraction tool can be generated. Parasitic extraction on the IC design layout then be performed by providing the second IC design layout and the one-to-one mapping to the parasitic extraction tool.
    Type: Grant
    Filed: December 18, 2019
    Date of Patent: October 12, 2021
    Assignee: Synopsys, Inc.
    Inventors: Jun Wang, Yun-Jui Li, Bin Xu, Cheng-Ming Wu, Yu Fan Lu, Hu Cai, Yuting Fu, Hwei-Tseng Wang, Sui Zheng, Jeong-Tyng Li
  • Publication number: 20200202061
    Abstract: Techniques and systems for implementing a general extensible layer mapping approach that maps between integrated circuit (IC) design database layers and process layers are described. A first IC design layout having in-design layers can be converted into a second IC design layout having derived layers, wherein said converting comprises mapping the in-design layers to the derived layers by applying a set of layer derivation rules to shapes in the IC design layout, and wherein the set of layer derivation rules implements a one-to-many mapping between the in-design layers and the derived layers. Next, a one-to-one mapping between the derived layers and process layers used in a parasitic extraction tool can be generated. Parasitic extraction on the IC design layout then be performed by providing the second IC design layout and the one-to-one mapping to the parasitic extraction tool.
    Type: Application
    Filed: December 18, 2019
    Publication date: June 25, 2020
    Applicant: Synopsys, Inc.
    Inventors: Jun Wang, Yun-Jui Li, Bin Xu, Cheng-Ming Wu, Yu Fan Lu, Hu Cai, Yuting Fu, Hwei-Tseng Wang, Sui Zheng, Jeong-Tyng Li