Abstract: The invention is a special designed pattern heterogeneous substrate, which is epitaxially deposited on a heterogeneous substrate by two step growth, and a thermal cycle annealing is added to reduce the lattice mismatch between the layers and the difference in thermal expansion coefficient, thereby obtaining a better stress. The quality of the semiconductor epitaxial layer is improved, and the present invention can easily grasp the timing of stress release when the semiconductor is grown on the heterogeneous substrate, avoid cracks in the semiconductor epitaxial layer, and form a crack free zone in the middle of the semiconductor epitaxial layer.

Abstract: A method for fabricating an electrochromic device includes: depositing a first transparent film on a first substrate; depositing a first mesh structure on the first transparent film; depositing a second transparent film on the first mesh structure; depositing an electrochromic layer of WO3 or MoO3 on the second transparent film by an arc-plasma process to form a first electrode structure; depositing a third transparent film on a second substrate; depositing a second mesh structure on the third transparent film; depositing a fourth transparent film on the second mesh structure; forming an ion storage layer of PB on the fourth transparent film to produce a second electrode structure; binding the first and second electrode structures by having the electrochromic layer to face the ion storage layer; and, forming an electrolyte layer between the first and second electrode structures to produce the electrochromic device. In addition, an electrochromic device is also provided.

Abstract: The invention is a special designed pattern heterogeneous substrate, which is epitaxially deposited on a heterogeneous substrate by two step growth, and a thermal cycle annealing is added to reduce the lattice mismatch between the layers and the difference in thermal expansion coefficient, thereby obtaining a better stress. The quality of the semiconductor epitaxial layer is improved, and the present invention can easily grasp the timing of stress release when the semiconductor is grown on the heterogeneous substrate, avoid cracks in the semiconductor epitaxial layer, and form a crack free zone in the middle of the semiconductor epitaxial layer.

Abstract: The present invention discloses an electrical inspection method for solar cells, comprising steps of supplying a voltage and a current to a solar cell for stimulating the solar cell and giving a ray of light; filtering the light to give a ray of light having a predetermined wavelength; and measuring an optical power value of the light having a predetermined wavelength. The electrical inspection method adopts a low-cost apparatus to replace the solar simulators according to the prior art. In addition to saving costly equipment, filter adjustment, and the maintenance fee for replacing lamps, the defect inspection flow for solar cells can be further integrated and hence improving the efficiency.

Abstract: The present invention uses a power supply to splay a forward bias to a concentrating solar cell. Then the solar cell will emit red light (electroluminescence). After passing the secondary optical device packaged on the solar cell, the red light will exhibit specific light distribution. According to the light distribution, the accuracy of the packaging location of the solar cell, the forming precision of the secondary optical device, and whether the optical devices are defective can be examined.

Abstract: The present invention uses a power supply to splay a forward bias to a concentrating solar cell. Then the solar cell will emit red light (electroluminescence). After passing the secondary optical device packaged on the solar cell, the red light will exhibit specific light distribution. According to the light distribution, the accuracy of the packaging location of the solar cell, the forming precision of the secondary optical device, and whether the optical devices are defective can be examined.

Abstract: The present invention provides a method for fabricating an InGaP epitaxial layer by metal organic chemical vapor deposition (MOCVD). The method comprises: placing a silicon substrate in a reaction chamber; arranging the reaction chamber to have a first chamber temperature, and growing a first GaP layer with a first thickness on the Si substrate at the first chamber temperature; arranging the reaction chamber to have a second chamber temperature, and growing a second GaP layer with a second thickness on the first GaP layer at the second chamber temperature; arranging the reaction chamber to have a third chamber temperature for a first time interval, and then arranging the reaction chamber to have a fourth chamber temperature for a second time interval; and growing a multi-layered InGaP layer on the second GaP layer.

Abstract: The present invention provides a method for fabricating an InGaP epitaxial layer by metal organic chemical vapor deposition (MOCVD). The method comprises: placing a silicon substrate in a reaction chamber; arranging the reaction chamber to have a first chamber temperature, and growing a first GaP layer with a first thickness on the Si substrate at the first chamber temperature; arranging the reaction chamber to have a second chamber temperature, and growing a second GaP layer with a second thickness on the first GaP layer at the second chamber temperature; arranging the reaction chamber to have a third chamber temperature for a first time interval, and then arranging the reaction chamber to have a fourth chamber temperature for a second time interval; and growing a multi-layered InGaP layer on the second GaP layer.

Abstract: The present embodiment discloses a package structure for ultraviolet LED, which comprises a substrate, an ultraviolet light-emitting diode (LED), and an optical device. The wavelength of the light emitted by the ultraviolet LED is between 200 and 400 nm. The optical device includes amorphous silicon dioxide, and thus enabling the transmittivity of ultraviolet light greater than 80%. In addition, by including a reflective ring and a metal film, the material aging problem of the sealing material can be prevented by blocking direct ultraviolet-light illumination. The package structure according to the present invention overcomes the limitation on planar packaging, so that the applications of backend processes can be extended.

Abstract: The present invention discloses a concentrator photovoltaic module and the alignment device and method thereof. A laser source is disposed on a top surface of an alignment device at a tilt angle. According to the optical alignment points on a circuit board, the circuit board and the concentrating lens can be aligned and thus completing assembling a concentrator photovoltaic module. The alignment device and method for concentrator photovoltaic module requires no optically inactive region to complete alignment. Thereby, the utilization of the sunlight and the output power efficiency of the concentrator photovoltaic module can be enhanced.

Abstract: The present invention provides a hybrid solar module, including a back plate, a plurality of photovoltaic cells, a plurality of concentrating photovoltaic cells and a light transmissive protective plate. The photovoltaic cells are arranged as an array pattern on the back plate. Each of the concentrating photovoltaic cells is disposed in a gap area, wherein each gap area lies between four adjacent photovoltaic cells, and each group of four photovoltaic cells includes first to fourth photovoltaic cells, with right, lower right and lower sides of the first photovoltaic cell adjacent to the second, third and fourth photovoltaic cells respectively. The transmissive protective plate is disposed on the photovoltaic cells and the concentrating photovoltaic cells.

Abstract: The present invention discloses a concentrator photovoltaic module and the alignment device and method thereof. A laser source is disposed on a top surface of an alignment device at a tilt angle. According to the optical alignment points on a circuit board, the circuit board and the concentrating lens can be aligned and thus completing assembling a concentrator photovoltaic module. The alignment device and method for concentrator photovoltaic module requires no optically inactive region to complete alignment. Thereby, the utilization of the sunlight and the output power efficiency of the concentrator photovoltaic module can be enhanced.

Abstract: The present invention discloses a concentrator photovoltaic module and the alignment device and method thereof. A laser source is disposed on a top surface of an alignment device at a tilt angle. According to the optical alignment points on a circuit board, the circuit board and the concentrating lens can be aligned and thus completing assembling a concentrator photovoltaic module. The alignment device and method for concentrator photovoltaic module requires no optically inactive region to complete alignment. Thereby, the utilization of the sunlight and the output power efficiency of the concentrator photovoltaic module can be enhanced.

Abstract: The present invention discloses a compound light-concentrating structure, which comprises a concentrating lens and a reflective device. The reflective device is disposed below the concentrating lens with the lower end extending downwards to an extension part. The extension part further hoods a solar cell of a concentrator photovoltaic module. Thereby, after the sunlight passes through the concentrating lens, a portion of light is focused on the solar cell directly, and a portion of light is reflected by the reflective device and to the solar cell. Thereby, the photoenergy loss caused by refraction can be reduced and thus improving the performance of the concentrator photovoltaic module.

Abstract: The present invention discloses a concentrator photovoltaic module and the alignment device and method thereof. A laser source is disposed on a top surface of an alignment device at a tilt angle. According to the optical alignment points on a circuit board, the circuit board and the concentrating lens can be aligned and thus completing assembling a concentrator photovoltaic module. The alignment device and method for concentrator photovoltaic module requires no optically inactive region to complete alignment. Thereby, the utilization of the sunlight and the output power efficiency of the concentrator photovoltaic module can be enhanced.

Abstract: The present invention discloses an electrical inspection method for solar cells, comprising steps of supplying a voltage and a current to a solar cell for stimulating the solar cell and giving a ray of light; filtering the light to give a ray of light having a predetermined wavelength; and measuring an optical power value of the light having a predetermined wavelength. The electrical inspection method adopts a low-cost apparatus to replace the solar simulators according to the prior art. In addition to saving costly equipment, filter adjustment, and the maintenance fee for replacing lamps, the defect inspection flow for solar cells can be further integrated and hence improving the efficiency.

Abstract: The present embodiment discloses a package structure for ultraviolet LED, which comprises a substrate, an ultraviolet light-emitting diode (LED), and an optical device. The wavelength of the light emitted by the ultraviolet LED is between 200 and 400 nm. The optical device includes amorphous silicon dioxide, and thus enabling the transmittivity of ultraviolet light greater than 80%. In addition, by including a reflective ring and a metal film, the material aging problem of the sealing material can be prevented by blocking direct ultraviolet-light illumination. The package structure according to the present invention overcomes the limitation on planar packaging, so that the applications of backend processes can be extended.

Abstract: The present invention relates to a method for packaging solar cell device and the structure thereof. The structure comprises a substrate formed by glass or insulating high polymer, an insulating layer, a plurality of conductive layers, and a plurality of solar cells. A plurality of conductive films are disposed on a surface of the substrate. The insulating layer is disposed on the substrate and comprises a plurality of holes located on the plurality of conductive films. The plurality of conductive layers are disposed in the plurality of holes. A bottom surface of the plurality of conductive layers is connected electrically with the plurality of conductive films. The plurality of solar cells are disposed on the insulating layer and connected electrically with the top surface of the plurality of conductive layer.

Abstract: The present invention relates to a method for packaging secondary optical element. By coating optical glue on the bottom surface of the secondary optical element and on the substrate and by hardening individually, as well as using the technical characteristics of flipping the substrate and the fixture, the secondary optical element can fall naturally and be positioned above an optoelectric device such as a solar cell or a light-emitting diode. No additional fastener is required for supporting the secondary optical element.