Patents by Inventor Hwi Dae KIM

Hwi Dae KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20190115134
    Abstract: An inductor includes: a body having a stack of a plurality of insulating layers, each of which has a coil pattern disposed thereon; and first and second external electrodes disposed on an external surface of the body, wherein the plurality of coil patterns are connected to each other by a coil connection portion and form a coil having both end portions connected to the first and second external electrodes through a coil lead portion, and the plurality of coil patterns are composed of coil patterns disposed in outermost positions and coil patterns disposed inwardly of the coil patterns disposed in the outermost positions of the body, a thickness of at least one of the coil patterns disposed inwardly being thicker than that of the coil patterns disposed in the outermost positions.
    Type: Application
    Filed: June 22, 2018
    Publication date: April 18, 2019
    Inventors: Sang Soo Park, Young Ghyu Ahn, Hwi Dae Kim
  • Patent number: 10104777
    Abstract: A multilayer capacitor include dielectric layers stacked in a direction perpendicular to a mounting surface of a capacitor body, and internal electrodes and an equivalent series inductance (ESL) control pattern formed on upper and lower portions of the dielectric layers, respectively. The internal electrodes have an area larger than that of the ESL control pattern, and the ESL control pattern is exposed to a mounting surface of a capacitor body.
    Type: Grant
    Filed: December 28, 2016
    Date of Patent: October 16, 2018
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Min Cheol Park, Hwi Dae Kim, Young Ghyu Ahn
  • Publication number: 20180158614
    Abstract: A multilayer ceramic electronic component includes a body with a plurality of first and second internal electrodes alternately arranged with dielectric layers interposed therebetween. There may be M each of third and fourth external electrodes on opposing sides of the body, where M is greater than or equal to 3 and all external electrodes have different polarities than the adjacent external electrodes. There may be N via electrodes penetrating through the body, where N is greater than or equal to 3 and the via electrodes are connected to either of the first or second internal electrodes. The multilayer ceramic electronic component may achieve low equivalent series inductance (ESL) characteristics and may reduce the mounting area on the circuit board.
    Type: Application
    Filed: July 17, 2017
    Publication date: June 7, 2018
    Inventors: Sang Soo PARK, Young Ghyu AHN, Hwi Dae KIM
  • Publication number: 20170372833
    Abstract: An inductor includes first and second coil patterns disposed in a single chip, and at least one common lead terminal electrically connected to respective end portions of the first and second coil patterns. The first and second coil patterns operate independently of each other, such that a range of a current passing through the first coil pattern and a range of a current passing through the second coil pattern are different from each other. The first and second coil patterns are coil patterns having different electrical characteristics.
    Type: Application
    Filed: March 13, 2017
    Publication date: December 28, 2017
    Inventors: Young Su JANG, Bum Sik WANG, Jin Hwan KIM, Hwi Dae KIM, Min Ha HWANG
  • Publication number: 20170367186
    Abstract: A multilayer capacitor include dielectric layers stacked in a direction perpendicular to a mounting surface of a capacitor body, and internal electrodes and an equivalent series inductance (ESL) control pattern formed on upper and lower portions of the dielectric layers, respectively. The internal electrodes have an area larger than that of the ESL control pattern, and the ESL control pattern is exposed to a mounting surface of a capacitor body.
    Type: Application
    Filed: December 28, 2016
    Publication date: December 21, 2017
    Inventors: Min Cheol PARK, Hwi Dae KIM, Young Ghyu AHN