Patents by Inventor Hwi Jae CHA

Hwi Jae CHA has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230332079
    Abstract: The present disclosure relates to a biomimetic chip for three-dimensionally simulating an endometrium, and an endometrium simulating method using the biomimetic chip. The biomimetic chip according to an embodiment of the present disclosure is a three-dimensional biomimetic chip including a plate, a plurality of chambers, and a plurality of posts, which are arranged between the plurality of chambers, wherein the plurality of chambers include channels in which different cells are cultured, are arranged on the plate to be parallel to each other in one direction, and are arranged adjacent to each other such that at least some sections communicate with each other.
    Type: Application
    Filed: June 23, 2021
    Publication date: October 19, 2023
    Applicants: CHA UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION, SUNGKWANG MEDICAL FOUNDATION
    Inventors: Youn Jung KANG, Jung Ho AHN, Min Ji YOON, Hwi Jae CHA, Seon Hwa HONG