Patents by Inventor Hwi-Jin Kim

Hwi-Jin Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SINGLE-LAYERED ARCH SUPPORT INSOLE TO BE INSERTED INTO SHOE
    Publication number: 20090145003
    Abstract: Provided is an arch support insole to be inserted into a shoe. The insole should satisfy tasks for a wearer as follows: (1) improvement of wearing feeling by maximally reducing the thickness of the insole, (2) reduction of fatigue on walking by maximally preventing transmission of shocks, and (3) sufficient support of the arch of the wearer by maintaining an original shape of the arch support part. In addition, these tasks should be solved by a minimum number of manufacturing processes and minimum cost.
    Type: Application
    Filed: November 14, 2008
    Publication date: June 11, 2009
    Applicant: UMI SYSTEM CO.
    Inventor: Hwi Jin KIM
  • CMP slurry composition and a method for planarizing semiconductor device using the same
    Patent number: 7029509
    Abstract: The present invention relates to a CMP (chemical mechanical polishing) slurry composition and a method for planarizing a semiconductor device. The CMP composition comprises fumed silica, tetramethyl ammonium hydroxide, phosphates, fluorine compounds and deionized water. The method of planarizing comprises the steps of etching, subsequently laminating and polishing a semiconductor device by said CMP slurry composition.
    Type: Grant
    Filed: February 5, 2001
    Date of Patent: April 18, 2006
    Assignee: Dongbuanam Semiconductor Inc.
    Inventors: Sang-Yong Kim, Kwang-Ha Suh, Tae-Kyu Kim, Hwi-Jin Kim
  • Cmp slurry composition and a method for planarizing semiconductor device using the same
    Publication number: 20040020134
    Abstract: The present invention relates to a CMP (chemical mechanical polishing) slurry composition and a method for planarizing a semiconductor device. The CMP composition comprises fumed silica, tetramethyl ammonium hydroxide, phosphates, fluorine compounds and deionized water. The method of planarizing comprises the steps of etching, subsequently laminating and polishing a semiconductor device by said CMP slurry composition.
    Type: Application
    Filed: April 11, 2003
    Publication date: February 5, 2004
    Inventors: Sang-Yong Kim, Kwang-Ha Suh, Tae-Kyu Kim, Hwi-Jin Kim