Patents by Inventor Hwi Jun Kim

Hwi Jun Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 9347117
    Abstract: Provided is a Nd-based two-phase separation amorphous alloy by adding an element having a big difference in heat of mixing in a Nd-based alloy with a superior amorphous formability through an inherent characteristic of compositional elements and consideration of thermodynamics, at the time of forming amorphous phase, to thereby enable two-phase separation amorphous alloy during solidification.
    Type: Grant
    Filed: February 10, 2009
    Date of Patent: May 24, 2016
    Assignee: Yonsei University
    Inventors: Eun Soo Park, Hye Jung Chang, Do Hyang Kim, Eun Young Jeong, Jin Kyu Lee, Hwi Jun Kim, Jung Chan Bae
  • Publication number: 20090260720
    Abstract: Provided is a Nd-based two-phase separation amorphous alloy by adding an element having a big difference in heat of mixing in a Nd-based alloy with a superior amorphous formability through an inherent characteristic of compositional elements and consideration of thermodynamics, at the time of forming amorphous phase, to thereby enable two-phase separation amorphous alloy during solidification.
    Type: Application
    Filed: February 10, 2009
    Publication date: October 22, 2009
    Inventors: Eun Soo Park, Hye Jung Chang, Do Hyang Kim, Eun Young Jeong, Jin Kyu Lee, Hwi Jun Kim, Jung Chan Bae
  • Publication number: 20070258846
    Abstract: Provided is a Nd-based two-phase separation amorphous alloy by adding an element having a big difference in heat of mixing in a Nd-based alloy with a superior amorphous formability through an inherent characteristic of compositional elements and consideration of thermodynamics, at the time of forming amorphous phase, to thereby enable two-phase separation amorphous alloy during solidification.
    Type: Application
    Filed: February 27, 2007
    Publication date: November 8, 2007
    Inventors: Eun Soo Park, Hye Jung Chang, Do Hyang Kim, Eun Young Jeong, Jin Kyu Lee, Hwi Jun Kim, Jung Chan Bae