Abstract: A silicon carbide wafer manufacturing method includes: a bending measuring step of measuring a first edge having the greatest degree of a bending at one surface of a silicon carbide ingot having one surface; a cutting start step of starting a cutting at a second edge having a distance of r×a along an edge of the one surface from the first edge in a direction parallel to or with a predetermined off angle with respect to the one surface through the wire saw, a cutting speed being decreased to a first cutting speed in the cutting start step; a cutting proceeding step in which the first cutting speed is substantially constant within a variation of about ±5% of the first cutting speed; and a finish step in which the cutting speed is increased from the first cutting speed and the cutting of the silicon carbide ingot is completed.

Abstract: A conditioner of a chemical mechanical polishing (CMP) apparatus includes a conditioning part to polish a polishing pad, an arm to rotate the conditioning part, and a flexible connector connecting the conditioning part with the arm, the flexible connector being moveable to allow relative movements of the conditioning part with respect to the arm.

Abstract: An equipment diagnosis system and method, which use abnormal data and normal data of equipment and accurately and effectively perform diagnosis on the equipment, are provided. The equipment diagnosis system includes a data acquisition unit to acquire time series data of equipment, a preprocessing unit convert the time series data into frequency data including a temporal component through a Fourier transform, a deep learning unit to perform deep learning through a convolution neural network (CNN) by using the frequency data, and a diagnosis unit to determine a state of the equipment to be a normal state or a breakdown state based on the deep learning.

Abstract: A method of inspecting a wafer quality includes injecting ions into a wafer using an ion beam in an ion implantation process, collecting data about the ion beam by using a Faraday cup, extracting first data from the data about the ion beam, extracting a wafer section from the first data, calculating a feature value of a wafer from the wafer section, and evaluating a quality of the wafer by comparing the feature value with a predetermined threshold or range.

Abstract: Provided is a load cup including a cup having an internal space, a pedestal provided in the internal space, able to be lifted up and down, and loading a wafer onto or unloading a wafer from a polishing head, and a plurality of arrangement parts having a plurality of fastening portions disposed around the pedestal, and moved horizontally in a direction of a center of the pedestal, and arrangement part bodies coupled to the plurality of fastening portions, respectively, and rotated or reciprocated so as to contact a lateral surface of the polishing head, adjusting a center of the wafer to be aligned with a center of the polishing head. A polishing process may then be performed on a layer formed on the wafer.

Abstract: A method of inspecting a wafer quality includes injecting ions into a wafer using an ion beam in an ion implantation process, collecting data about the ion beam by using a Faraday cup, extracting first data from the data about the ion beam, extracting a wafer section from the first data, calculating a feature value of a wafer from the wafer section, and evaluating a quality of the wafer by comparing the feature value with a predetermined threshold or range.

Abstract: A polishing head includes a carrier body detachably fixed to a drive shaft and having a plurality of first fluid passages penetrating therethrough to extend from an upper surface to a lower surface of the carrier body, upper end portions of the first fluid passages being arranged to be spaced apart from each other in a circumferential direction about a central axis thereof, a flexible membrane clamped to a lower portion of the carrier body to form a plurality of pressurizing chambers, wherein at least one of the pressurizing chambers is divided into a plurality of sub-chambers arranged in a circumferential direction about a central axis of the flexible membrane, the sub-chambers being in fluid communication with lower end portions of the first fluid passages respectively, and a fluid sealing part on the carrier body to support the carrier body to be rotatable and flow a fluid into each of the first fluid passages in a sealed state.

Abstract: A conditioner of a chemical mechanical polishing (CMP) apparatus includes a conditioning part to polish a polishing pad, an arm to rotate the conditioning part, and a flexible connector connecting the conditioning part with the arm, the flexible connector being moveable to allow relative movements of the conditioning part with respect to the arm.

Abstract: An equipment diagnosis system and method, which use abnormal data and normal data of equipment and accurately and effectively perform diagnosis on the equipment, are provided. The equipment diagnosis system includes a data acquisition unit to acquire time series data of equipment, a preprocessing unit convert the time series data into frequency data including a temporal component through a Fourier transform, a deep learning unit to perform deep learning through a convolution neural network (CNN) by using the frequency data, and a diagnosis unit to determine a state of the equipment to be a normal state or a breakdown state based on the deep learning.

Abstract: Provided is a load cup including a cup having an internal space, a pedestal provided in the internal space, able to be lifted up and down, and loading a wafer onto or unloading a wafer from a polishing head, and a plurality of arrangement parts having a plurality of fastening portions disposed around the pedestal, and moved horizontally in a direction of a center of the pedestal, and arrangement part bodies coupled to the plurality of fastening portions, respectively, and rotated or reciprocated so as to contact a lateral surface of the polishing head, adjusting a center of the wafer to be aligned with a center of the polishing head. A polishing process may then be performed on a layer formed on the wafer.

Abstract: A probe card handling carriage is applicable to various working environments. The probe card handling carriage includes a main body provided to be travelable on the ground, a drawer unit provided to be movable in a forward and backward direction with respect to the main body, and a transfer robot installed on the drawer unit to transfer a probe card.

Abstract: Disclosed herein are a near-infrared absorbing and color compensation film composition and a film using the film composition. The film composition comprises i) at least one colorant selected from the group consisting of an ionic compound of a near-infrared absorbing cyanine colorant cation having a maximum absorption wavelength in the range of 820 nm to 950 nm and a metal complex colorant anion, an ionic compound of a near-infrared absorbing diimmonium colorant cation having a maximum absorption wavelength in the range of 950 nm to 1,100 nm and a metal complex colorant anion, and an ionic compound of a selective visible light absorbing cyanine colorant cation having a maximum absorption wavelength in the range of 580 nm to 600 nm and a metal complex colorant anion, and ii) an adhesive; and a film using the film composition. When the film composition is used to produce an adhesive film or an antireflective composite film, the price of raw materials used and the number of production steps can be reduced.

Abstract: Disclosed herein is a composition for use as a film on an image display filter. In some embodiments, the composition includes a cyanine dye exhibiting an absorption maximum in the wavelength region from about 830 to about 880 nm or from about 580 to about 600 nm and an anthraquinone dye comprising an anthraquinone compound substituted with an amino group in one or more positions selected from the 1-, 4-, 5-, and 8-position.

Abstract: Disclosed herein is a low-reflectivity, brightness-enhancing multilayer optical film for enhancing the brightness of an organic light emission diode (OLED) display and imparting anti-reflection performance to the display. The multilayer optical film comprises a transparent substrate, a light diffusion layer formed on the transparent substrate by wet coating and a light-absorbing layer formed on the light diffusion layer by wet coating wherein the substrate has a thickness of 10˜300 ?m, the light diffusion layer contains a resin and spherical particles, and the light-absorbing layer contains 50˜500 parts by weight of core-shell structured light-absorbing particles composed of a light-absorbing agent as a material for the core and a transparent resin as a material for the shell. Further disclosed is an organic light emitting diode (OLED) display using the multilayer optical film.

Abstract: A low/medium speed subscriber multicasting device for an asynchronous mode cell, the device may be constructed with an integrated routing table on which integrated information including the multicasting routing tables necessary for each low/medium speed subscriber's link, is mapped; and a multicasting call processing unit for receiving information from a control process in a higher layer block, for mapping out the virtual path/virtual channel and port number corresponding to the multicasting copy number of a link in the integrated routing table when receiving a multicasting cell, for accessing the routing table using the multicasting copy number and link information for the multicasting cell to read virtual paths/virtual channels for each link, and for transmitting the multicasting cell to the corresponding low/medium speed subscriber's link.