Abstract: Described here are systems, devices, and methods useful for high-throughput and automated separation of extracellular matrix bodies using a microfluidic chip. A system for separating extra-cellular matrix bodies (ECMBs) from a biological fluid may comprise a holder configured to receive the biological fluid, a robot configured to transfer the biological fluid from the holder to a microfluidic chip, a chip connector configured to hold at least one microfluidic chip, a manifold coupled to the at least one microfluidic chip, and a negative pressure source coupled to the manifold. The negative pressure source may be configured to apply a negative pressure of between about 10 mm HG and about 760 mm HG to the at least one microfluidic chip.

Abstract: An adhesive film and an organic electronic device including the same are provided. The adhesive film includes: a first bonding layer including a first bonding component layer, a moisture absorbent, and first core shell particles; and a second bonding layer disposed below the first bonding layer and including second core shell particles, which are formed of a different material from the first core shell particles, wherein each of the first core shell particles includes a first shell and a first core surrounded by the first shell and each of the second core shell particles includes a second shell and a second core surrounded by the second shell.

Abstract: An adhesive film and an organic electronic device including the same are provided. The adhesive film includes: a first bonding layer including a first bonding component layer, a moisture absorbent, and first core shell particles; and a second bonding layer disposed below the first bonding layer and including second core shell particles, which are formed of a different material from the first core shell particles, wherein each of the first core shell particles includes a first shell and a first core surrounded by the first shell and each of the second core shell particles includes a second shell and a second core surrounded by the second shell.

Abstract: Disclosed are an adhesive film for an organic electronic device and an encapsulant including the same, wherein the adhesive film can function to remove or block defect causes such as moisture and impurities so that the defect causes do not approach the organic electronic device, and also to minimize problems due to separation of the organic electronic device and the film and/or interfacial film delamination upon moisture removal.