Patents by Inventor Hyan-Jung Lee

Hyan-Jung Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10665490
    Abstract: A first edge ring is removed from a substrate support within a process module using a transfer robot. The transfer robot is then used to place a second edge ring on the substrate support. An image sensor (e.g., a disk-shaped wireless image sensor) is positioned over the second edge ring using the transfer robot. The image sensor generates image information, which is analyzed to determine alignment of the second edge ring.
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: May 26, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Ja-Woo Lee, Keon-Woo Kim, Sun-Ho Kim, Eung-Su Kim, Bo-Ra Yoon, Hyan-Jung Lee, Tae-Il Cho
  • Publication number: 20200013657
    Abstract: A first edge ring is removed from a substrate support within a process module using a transfer robot. The transfer robot is then used to place a second edge ring on the substrate support. An image sensor (e.g., a disk-shaped wireless image sensor) is positioned over the second edge ring using the transfer robot. The image sensor generates image information, which is analyzed to determine alignment of the second edge ring.
    Type: Application
    Filed: January 4, 2019
    Publication date: January 9, 2020
    Inventors: Ja-Woo Lee, Keon-Woo Kim, Sun-Ho Kim, Eung-Su Kim, Bo-Ra Yoon, Hyan-Jung Lee, Tae-Il Cho