Abstract: An improved circuit wiring layout provides smooth circuit wiring in a peripheral circuit region adjacent to a memory cell region of a semiconductor memory device, and eliminates a write-speed limiting factor. Forming a metal (instead of a metal silicided polysilicon) wiring layer to be connected to a gate layer, to transmit an electrical signal to the gates of FET (e.g., MOSFET (Metal Oxide Semiconductor Field Effect Transistor) transistors formed in the peripheral circuit region; the metal wiring layer is formed (e.g., using one metal damascene process), on a layer different from a word line layer formed on the gate layer (e.g., using another metal damascene process), thereby obtaining a layout of a peripheral circuit region having a reduced area and without using a silicide process.

Abstract: A line layout structure of semiconductor memory device comprises first metal wire lines forming a bit line coupled to a memory cell, second metal wire lines disposed substantially orthogonal to the first metal wire lines and over the first metal wire lines, the second metal wire lines forming a section word line electrically coupled to the memory cell, and third metal wire lines disposed substantially parallel to the second metal wire lines and over the second metal wire lines, the third metal wire lines forming a first power line or signal line.

Abstract: A semiconductor memory device which includes an internal voltage generator circuit for adjusting an external power supply voltage and generating first and second internal power supply voltages. The first internal power supply voltage is supplied to a memory cell array via a first power supply line, and the second internal power supply voltage is supplied to a peripheral circuit via a second power supply line. A control circuit controls the internal voltage generator circuit so that the levels of the first and second internal power supply voltages vary depending on a mode of operation.

Abstract: An integrated circuit device includes a pin for receiving a DC voltage component signal. The device includes a signal source for applying an AC signal to the pin, a buffer for converting the AC signal into a digital signal, and a digital detector for detecting a frequency of the digital signal and outputting a predetermined detection signal. The predetermined detection signal is activated when the frequency of the digital signal is greater than or equal to a predetermined frequency. The predetermined detection signal is used as a signal for setting predetermined functional modes. The device further includes registers or a differential amplifier and a decoder for generating a plurality of functional mode signals.

Abstract: The invention is directed to data input/output organization system and method in a semiconductor memory device. The memory device has a plurality of memory arrays, in one embodiment, an odd number of memory arrays. The arrays are divided into blocks, and the blocks are divided into segments. A control circuit provides control signals to the memory arrays such that data is input and/or output to and from the memory device in multiples of nine bits. The data bits are input or output simultaneously without the need for multiplexing circuitry. This results in reduced power consumption and increased memory processing speed.

Abstract: Disclosed is a semiconductor integrated circuit device which includes a test element group circuit connected between a first and a second pad. The test element group circuit includes a plurality of semiconductor devices connected in series between the first and second pads. At least two adjacent ones of the semiconductor devices are connected to each other via a signal path that is formed by a multi-layer interconnection structure.

Abstract: The layout structure of a dual port SRAM (Static Random Access Memory) includes a read bit line adjacently positioned to a complementary read bit line, and a write bit line positioned adjacent to a complementary write bit line, to provide a shield between the read and write lines for preventing cross-talk caused during read and write operations.

Abstract: Disclosed is a semiconductor integrated circuit device which includes a test element group circuit connected between a first and a second pad. The test element group circuit includes a plurality of semiconductor devices connected in series between the first and second pads. At least two adjacent ones of the semiconductor devices are connected to each other via a signal path that is formed by a multi-layer interconnection structure.

Abstract: A layout structure of column pass transistors of a semiconductor memory device, in which the area occupied with the transistors is reduced. Thus, in spite of high integration of the semiconductor memory device and miniaturization of memory cells, column path transistors can be arranged efficiently. In the aforementioned layout structure, the active regions of the column path transistors are longitudinally in perpendicular to the bit line pairs to reduce the area occupied with the total number of memory cells.

Abstract: An integrated circuit device comprises a pin for receiving a DC voltage component signal. The device comprises a signal source for applying an AC signal to the pin, a buffer for converting the AC signal into a digital signal, and a digital detector for detecting a frequency of the digital signal and outputting a predetermined detection signal. The predetermined detection signal is activated when the frequency of the digital signal is greater than or equal to a predetermined frequency. The predetermined detection signal is used as a signal for setting predetermined functional modes. The device further comprises registers or a differential amplifier and a decoder for generating a plurality of functional mode signals.

Abstract: A semiconductor memory device which includes an internal voltage generator circuit for adjusting an external power supply voltage and generating first and second internal power supply voltages. The first internal power supply voltage is supplied to a memory cell array via a first power supply line, and the second internal power supply voltage is supplied to a peripheral circuit via a second power supply line. A control circuit controls the internal voltage generator circuit so that the levels of the first and second internal power supply voltages vary depending on a mode of operation.

Abstract: The invention is directed to data input/output organization system and method in a semiconductor memory device. The memory device has a plurality of memory arrays, in one embodiment, an odd number of memory arrays. The arrays are divided into blocks, and the blocks are divided into segments. A control circuit provides control signals to the memory arrays such that data is input and/or output to and from the memory device in multiples of nine bits. The data bits are input or output simultaneously without the need for multiplexing circuitry. This results in reduced power consumption and increased memory processing speed.

Abstract: Disclosed is a semiconductor integrated circuit device which includes a test element group circuit connected between a first and a second pad. The test element group circuit includes a plurality of semiconductor devices connected in series between the first and second pads. At least two adjacent ones of the semiconductor devices are connected to each other via a signal path that is formed by a multi-layer interconnection structure.

Abstract: An electrostatic discharge (ESD) protection transistor for discharging current from an ESD event present on an input/output pad. The ESD protection transistor is capable of improved discharging of excessive current without damage to the semiconductor device and to the ESD protection transistor itself. The ESD protection transistor includes a first conductive line connecting an input/output pad to the source and drain of the transistor at multiple points preventing the convergence of an excessive current at a certain point and ESD damage to the transistor. The transistor also includes a second conductive line formed on an insulating layer such that it does not overlap with the first conductive line.

Abstract: The invention relates to a layout structure of a semiconductor device and more particularly to a layout structure of column pass transistors in a semiconductor memory device where the area occupied with the transistors is reduced to the minimum allowable. Thus, in spite of high integration of the semiconductor memory device and miniaturization of memory cells, the column path transistors can be kept in an efficient arrangement. In the aforementioned layout structure, the active regions of the column path transistors are longitudinally in perpendicular to the bit line pairs, thereby making it possible to reduce the area occupied in terms of the total number of memory cells.

Abstract: A vertical or parallel interconnection structure in a semiconductor device wherein a shielding means is provided to prevent signal coupling between signal lines having small swing signals and noise sensitive signals. The shielding means is disposed between the signal lines and parallel with them and driven by power source of stable level, for example a ground voltage, a power supply voltage, or a DC voltage of arbitrary level.

Abstract: Semiconductor memory devices include a plurality of word line reverse diodes located at alternating ends of a plurality of parallel word lines. A plurality of well bias tapping regions are also located at alternating ends of the plurality of parallel word lines, but at opposite ends of the word lines from the plurality of reverse diodes. A compact semiconductor memory device is thereby provided.

Abstract: A semiconductor memory device conserves chip area by jointly connecting transistors which are respectively connected to pads adjacent to each other. The device includes first and second electrostatic discharge protection MOSFET transistors which have drains respectively connected to pads adjacent to each other and which define a first active area. A common source is arranged between the first and second transistors areas and defines a second active area in common to both transistors. The device is connected to a single power supply at the gates and sources thereof. The transistors also share common active ground lines.

Abstract: An electrostatic discharge structure of a semiconductor device is provided. The structure includes a semiconductor substrate doped with P-type impurities; an N-type well formed in a predetermined region of the semiconductor substrate; a P-type pocket well formed in a predetermined region of the N-type well; an N-type active guardline formed in the surface of the N-type well and doped to a concentration higher than that of the N-type well; a P-type active guardline formed in the surface of the P-type pocket well and doped to a concentration higher than that of the P-type pocket well; and an NMOS transistor formed in a surface of the P-type pocket well. Accordingly, even though a negative voltage due to electrostatic charge is temporarily applied to the drain region of the NMOS transistor, a malfunction of an internal circuitry formed in a P-type semiconductor substrate can be prevented.