Patents by Inventor Hyangwon KANG

Hyangwon KANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10193193
    Abstract: A battery pack includes a battery protection circuit module package coupled with a holder. The protection circuit module includes a basic package including a lead frame having a plurality of leads spaced apart from each other, and protection circuit elements provided on the lead frame, and an encapsulant and a holder simultaneously produced by disposing the basic package in a first injection mold and injecting a resin melt into the first injection mold to perform an insert injection molding process. The encapsulant encapsulates the protection circuit elements to expose parts of the lead frame, wherein the encapsulant and the basic package configure the battery protection circuit module package, and wherein the holder is coupled to the battery protection circuit module package due to the insert injection molding process.
    Type: Grant
    Filed: July 18, 2014
    Date of Patent: January 29, 2019
    Assignee: ITM SEMICONDUCTOR CO., LTD
    Inventors: Hyeokhwi Na, Hoseok Hwang, Jongun Bach, Hyangwon Kang, Seungyong Park, Sungho Song, Dawoon Jung
  • Publication number: 20160164146
    Abstract: A battery pack includes a structure of a battery protection circuit module package coupled with a holder, the structure including a basic package including a lead frame consisting of leads spaced apart from each other, and protection circuit elements provided on the lead frame, and an encapsulant and a holder simultaneously produced by disposing the basic package in a first injection mold and injecting a melt of resin into the first injection mold to perform an insert injection molding process, a battery core pack coupled with the structure, and an upper case for casing an upper part of the battery core pack to embed the structure therein. The encapsulant encapsulates the protection circuit elements to expose parts of the lead frame. The encapsulant and the basic package configure the battery protection circuit module package. The holder is coupled to the battery protection circuit module package due to the molding process.
    Type: Application
    Filed: July 18, 2014
    Publication date: June 9, 2016
    Inventors: Hyeokhwi NA, Hoseok HWANG, Jongun BACH, Hyangwon KANG, Seungyong PARK, Sungho SONG, Dawoon JUNG