Patents by Inventor HYE BIN BAEK

HYE BIN BAEK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230288811
    Abstract: The inventive concept provides an apparatus and method for treating a substrate with a gas. The apparatus includes a chamber having a process space in which the substrate is treated, a substrate support unit that supports the substrate in the process space, a gas supply unit that supplies a hydrophobic gas onto the substrate supported on the substrate support unit, and a controller that controls the substrate support unit and the gas supply unit. The substrate support unit includes a support plate on which the substrate is placed and a pin assembly that raises the substrate off the support plate or lowers the substrate onto the support plate, and the controller controls a degree of hydrophobization of a surface of the substrate by adjusting the pin assembly.
    Type: Application
    Filed: May 2, 2023
    Publication date: September 14, 2023
    Applicant: SEMES CO, LTD.
    Inventors: Moon Hyung BAE, Hye Bin BAEK, Youngseo AN, Euntark LEE, Min Jung PARK, Seunghan LEE, Jung-Hyun LEE
  • Publication number: 20230051256
    Abstract: Disclosed is an apparatus for treating a substrate, which includes: a first unit configured to perform a coating process of forming a film on a substrate; a transfer unit including a transfer robot transferring a substrate for which the coating process is terminated; and a controller controlling the first unit and the transfer unit, in which the controller controls the substrate for which the coating process is terminated in the first unit to rotate at a first rotational velocity until the substrate is transferred by the transfer unit.
    Type: Application
    Filed: August 11, 2022
    Publication date: February 16, 2023
    Applicant: SEMES CO., LTD.
    Inventors: Sung-Gyu LEE, Jung-Hyun LEE, Hye Bin BAEK, Dae Woon LEE, Dongwoon PARK
  • Patent number: 11148150
    Abstract: The inventive concept relates to a liquid dispensing nozzle and an apparatus for treating a substrate. The liquid dispensing nozzle includes a first fluid channel that is formed in the nozzle and through which a processing liquid flows and a second fluid channel in communication with the first fluid channel, the second fluid channel being connected to a dispensing end of the nozzle. The second fluid channel has a larger width than the first fluid channel, and a central axis of the first fluid channel and a central axis of the second fluid channel are connected with each other in a straight line.
    Type: Grant
    Filed: October 21, 2019
    Date of Patent: October 19, 2021
    Assignee: SEMES CO., LTD.
    Inventors: Byoungdoo Choi, Yangyeol Ryu, Dong Sub Oh, Hye Bin Baek
  • Publication number: 20210132499
    Abstract: The inventive concept provides an apparatus and method for treating a substrate with a gas. The apparatus includes a chamber having a process space in which the substrate is treated, a substrate support unit that supports the substrate in the process space, a gas supply unit that supplies a hydrophobic gas onto the substrate supported on the substrate support unit, and a controller that controls the substrate support unit and the gas supply unit. The substrate support unit includes a support plate on which the substrate is placed and a pin assembly that raises the substrate off the support plate or lowers the substrate onto the support plate, and the controller controls a degree of hydrophobization of a surface of the substrate by adjusting the pin assembly.
    Type: Application
    Filed: October 30, 2020
    Publication date: May 6, 2021
    Applicant: SEMES CO., LTD.
    Inventors: Moon Hyung BAE, Hye Bin BAEK, Youngseo AN, Euntark LEE, Min Jung PARK, Seunghan LEE, Jung-Hyun LEE
  • Publication number: 20200122165
    Abstract: The inventive concept relates to a liquid dispensing nozzle and an apparatus for treating a substrate. The liquid dispensing nozzle includes a first fluid channel that is formed in the nozzle and through which a processing liquid flows and a second fluid channel in communication with the first fluid channel, the second fluid channel being connected to a dispensing end of the nozzle. The second fluid channel has a larger width than the first fluid channel, and a central axis of the first fluid channel and a central axis of the second fluid channel are connected with each other in a straight line.
    Type: Application
    Filed: October 21, 2019
    Publication date: April 23, 2020
    Inventors: BYOUNGDOO CHOI, YANGYEOL RYU, DONG SUB OH, HYE BIN BAEK