Abstract: A substrate treating apparatus and a cleaning method thereof that can clean a nozzle tip and its surroundings in the presence of a source of contamination are provided. The substrate treating apparatus includes: a substrate support unit supporting a substrate; a spraying unit including a nozzle tip member, which has an outlet formed at an end thereof, and ejecting a treating solution onto the substrate using the nozzle tip member; and a standby port accommodating the nozzle tip member that has completed the ejection of the treating solution, wherein the substrate treating apparatus cleans the nozzle tip member and the inside of the standby port before the nozzle tip member sucks back a second chemical solution.

Abstract: The inventive concept provides an apparatus and method for treating a substrate with a gas. The apparatus includes a chamber having a process space in which the substrate is treated, a substrate support unit that supports the substrate in the process space, a gas supply unit that supplies a hydrophobic gas onto the substrate supported on the substrate support unit, and a controller that controls the substrate support unit and the gas supply unit. The substrate support unit includes a support plate on which the substrate is placed and a pin assembly that raises the substrate off the support plate or lowers the substrate onto the support plate, and the controller controls a degree of hydrophobization of a surface of the substrate by adjusting the pin assembly.

Abstract: Disclosed is an apparatus for treating a substrate, which includes: a first unit configured to perform a coating process of forming a film on a substrate; a transfer unit including a transfer robot transferring a substrate for which the coating process is terminated; and a controller controlling the first unit and the transfer unit, in which the controller controls the substrate for which the coating process is terminated in the first unit to rotate at a first rotational velocity until the substrate is transferred by the transfer unit.

Abstract: The inventive concept relates to a liquid dispensing nozzle and an apparatus for treating a substrate. The liquid dispensing nozzle includes a first fluid channel that is formed in the nozzle and through which a processing liquid flows and a second fluid channel in communication with the first fluid channel, the second fluid channel being connected to a dispensing end of the nozzle. The second fluid channel has a larger width than the first fluid channel, and a central axis of the first fluid channel and a central axis of the second fluid channel are connected with each other in a straight line.

Abstract: The inventive concept provides an apparatus and method for treating a substrate with a gas. The apparatus includes a chamber having a process space in which the substrate is treated, a substrate support unit that supports the substrate in the process space, a gas supply unit that supplies a hydrophobic gas onto the substrate supported on the substrate support unit, and a controller that controls the substrate support unit and the gas supply unit. The substrate support unit includes a support plate on which the substrate is placed and a pin assembly that raises the substrate off the support plate or lowers the substrate onto the support plate, and the controller controls a degree of hydrophobization of a surface of the substrate by adjusting the pin assembly.

Abstract: The inventive concept relates to a liquid dispensing nozzle and an apparatus for treating a substrate. The liquid dispensing nozzle includes a first fluid channel that is formed in the nozzle and through which a processing liquid flows and a second fluid channel in communication with the first fluid channel, the second fluid channel being connected to a dispensing end of the nozzle. The second fluid channel has a larger width than the first fluid channel, and a central axis of the first fluid channel and a central axis of the second fluid channel are connected with each other in a straight line.