Patents by Inventor Hye Hun Park

Hye Hun Park has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240135141
    Abstract: A method and apparatus for predicting a recipe property reflecting similarity between chemical materials are provided. The method of predicting a recipe property reflecting similarity between chemical materials, the method includes substituting a plurality of input materials with vector data, respectively, through material embedding and generating recipe data including pieces of vector data selected by considering a correlation between materials, and inputting the recipe data to an artificial neural network (ANN) prediction model and deriving a property prediction result on the recipe data from the ANN prediction model.
    Type: Application
    Filed: September 26, 2023
    Publication date: April 25, 2024
    Inventors: HYE RIM BAE, han byeol Park, MINGYU PARK, DOHEE KIM, KI HUN KIM
  • Publication number: 20240136632
    Abstract: A battery module has improved assemblability and safety. A battery module includes at least one battery cell, and a module frame including a plurality of unit frames that are inserted and coupled to each other, an inner space in which the cell assembly is accommodated, and a venting channel provided in an overlapping portion formed through the insertion.
    Type: Application
    Filed: December 22, 2022
    Publication date: April 25, 2024
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Ju-Hun PARK, Jun-Yeob SEONG, Hye-Mi JUNG
  • Publication number: 20240100779
    Abstract: Provided is a method for regenerating a tool path on the basis of output data feedback in order to improve 3D printing output reliability. A tool path regeneration system according to an embodiment of the present invention comprises: a slicing unit for configuring a process parameter for 3D printing and performing slicing for 3D model data on the basis of the configured process parameter to generate a job file; and an output unit for performing 3D printing on the basis of the generated job file and collecting output data that is output while the 3D printing is performed, wherein the slicing unit comprises an output data analysis module for performing monitoring on the basis of the output data received from the output unit and determining whether to correct the process parameter on the basis of the result of the monitoring.
    Type: Application
    Filed: November 3, 2021
    Publication date: March 28, 2024
    Applicant: Korea Electronics Technology Institute
    Inventors: Hwa Seon SHIN, Sung Hun PARK, Hye In LEE, Sung Hwan CHUN
  • Publication number: 20240029945
    Abstract: A coil component includes: a body; a coil disposed within the body; and an insulating film covering at least a portion of the coil in the body, wherein the insulating film includes a copolymer including a repeating unit derived from a monomer containing an unsaturated bond and a repeating unit derived from a parylene monomer.
    Type: Application
    Filed: January 6, 2023
    Publication date: January 25, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ju Hwan Yang, Jae Hun Kim, Doo Ho Park, Hye Hun Park, In Young Kang, Ki Young Yoo, Boum Seock Kim
  • Patent number: 11721485
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and an internal electrode, an electrode layer connected to the internal electrode, and a conductive resin layer disposed on the electrode layer. The conductive resin layer includes a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin. The metal having the lower melting point than the conductive metal is tin (Sn). The conductive metal of the conductive resin layer includes at least one of copper (Cu), nickel (Ni), silver (Ag), and silver-palladium (Ag—Pd).
    Type: Grant
    Filed: March 25, 2022
    Date of Patent: August 8, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Hun Park, Won Kuen Oh, Tae Gyeom Lee, Ji Hong Jo
  • Patent number: 11676766
    Abstract: A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.
    Type: Grant
    Filed: March 29, 2022
    Date of Patent: June 13, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Kuen Oh, Hye Hun Park, Tae Gyeom Lee
  • Patent number: 11600442
    Abstract: A multilayer ceramic electronic component including: a ceramic body including a dielectric layer and first and second internal electrodes; a first external electrode including a first base electrode disposed to be in contact with the ceramic body and a first conductive layer disposed on the first base electrode; and a second external electrode including a second base electrode disposed to be in contact with the ceramic body and a second conductive layer disposed on the second base electrode, wherein the first conductive layer and the second conductive layer include silver (Ag) and palladium (Pd) and distribution positions of silver (Ag) and palladium (Pd) in central portions of the first conductive layer and the second conductive layer match at 95% or more according to a result of TEM mapping.
    Type: Grant
    Filed: September 14, 2021
    Date of Patent: March 7, 2023
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Kuen Oh, Hye Hun Park, Gyu Ho Yeon, Sung Hyun Kang
  • Patent number: 11393629
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric and an internal electrode, an electrode layer electrically connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal, a graphene platelet, and a base resin.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: July 19, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Kuen Oh, Tae Gyeom Lee, Hang Kyu Cho, Hye Hun Park, Han Seong Jung
  • Publication number: 20220223348
    Abstract: A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.
    Type: Application
    Filed: March 29, 2022
    Publication date: July 14, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Kuen Oh, Hye Hun Park, Tae Gyeom Lee
  • Publication number: 20220223347
    Abstract: A multilayer ceramic electronic component includes a ceramic body having a dielectric layer and an internal electrode, an electrode layer connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin. The conductive carbon is included in the conductive resin layer in an amount of 0.5 to 5.0 parts by weight based on 100 parts by weight of the conductive metal.
    Type: Application
    Filed: March 25, 2022
    Publication date: July 14, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Hun PARK, Won Kuen OH, Tae Gyeom LEE, Ji Hong JO
  • Publication number: 20220208460
    Abstract: A multilayer ceramic electronic component including: a ceramic body including a dielectric layer and first and second internal electrodes; a first external electrode including a first base electrode disposed to be in contact with the ceramic body and a first conductive layer disposed on the first base electrode; and a second external electrode including a second base electrode disposed to be in contact with the ceramic body and a second conductive layer disposed on the second base electrode, wherein the first conductive layer and the second conductive layer include silver (Ag) and palladium (Pd) and distribution positions of silver (Ag) and palladium (Pd) in central portions of the first conductive layer and the second conductive layer match at 95% or more according to a result of TEM mapping.
    Type: Application
    Filed: September 14, 2021
    Publication date: June 30, 2022
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Kuen OH, Hye Hun PARK, Gyu Ho YEON, Sung Hyun KANG
  • Patent number: 11322305
    Abstract: A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.
    Type: Grant
    Filed: January 31, 2020
    Date of Patent: May 3, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Kuen Oh, Hye Hun Park, Tae Gyeom Lee
  • Patent number: 11315733
    Abstract: A multilayer ceramic electronic component includes a ceramic body having a dielectric layer and an internal electrode, an electrode layer connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin. The conductive carbon is included in the conductive resin layer in an amount of 0.5 to 5.0 parts by weight based on 100 parts by weight of the conductive metal.
    Type: Grant
    Filed: August 28, 2020
    Date of Patent: April 26, 2022
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Hun Park, Won Kuen Oh, Tae Gyeom Lee, Ji Hong Jo
  • Publication number: 20210166879
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric and an internal electrode, an electrode layer electrically connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal, a graphene platelet, and a base resin.
    Type: Application
    Filed: January 14, 2021
    Publication date: June 3, 2021
    Inventors: Won Kuen OH, Tae Gyeom LEE, Hang Kyu CHO, Hye Hun PARK, Han Seong JUNG
  • Publication number: 20210090804
    Abstract: A multilayer ceramic electronic component includes a ceramic body having a dielectric layer and an internal electrode, an electrode layer connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin. The conductive carbon is included in the conductive resin layer in an amount of 0.5 to 5.0 parts by weight based on 100 parts by weight of the conductive metal.
    Type: Application
    Filed: August 28, 2020
    Publication date: March 25, 2021
    Inventors: Hye Hun PARK, Won Kuen OH, Tae Gyeom LEE, Ji Hong JO
  • Publication number: 20210065984
    Abstract: A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.
    Type: Application
    Filed: January 31, 2020
    Publication date: March 4, 2021
    Inventors: Won Kuen Oh, Hye Hun Park, Tae Gyeom Lee
  • Patent number: 10923283
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric and an internal electrode, an electrode layer eletrically connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal, a graphene platelet, and a base resin.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: February 16, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Won Kuen Oh, Tae Gyeom Lee, Hang Kyu Cho, Hye Hun Park, Han Seong Jung
  • Patent number: 10734790
    Abstract: A composite electronic component includes an element part and an electrostatic discharge (ESD) protection part disposed on the element part. The ESD protection part includes first and second discharge electrodes having a gap formed therebetween, a discharge layer disposed between the first and second discharge electrodes and in the gap, and a multilayer insulating layer covering the discharge layer and including at least two insulating layers having different breakdown voltage (BDV) values.
    Type: Grant
    Filed: October 9, 2017
    Date of Patent: August 4, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Hun Park, Kwang Jik Lee, Ju Hwan Yang, Jung Wook Seo, Sang Moon Lee
  • Patent number: 10568194
    Abstract: A common mode filter includes a body including a filter portion and an electrostatic protection portion, first to fourth external electrodes disposed on an external surface of the body, a ground electrode disposed on the external surface of the body, a first coil included in the filter portion and electrically connected to the first and second external electrodes, and a second coil included in the filter portion and electrically connected to the third and fourth external electrodes. The electrostatic protection portion includes discharge electrodes electrically connected to at least one of the first to fourth external electrodes and the ground electrode, a discharge part including conductive particles, a first organic-inorganic composite insulating layer disposed on the discharge electrodes and the discharge part, a magnetic cover layer disposed on the first organic-inorganic composite insulating layer, and a first inorganic insulating layer.
    Type: Grant
    Filed: October 24, 2017
    Date of Patent: February 18, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Kwang Jik Lee, Sang Moon Lee, Hye Hun Park, Ju Hwan Yang, Jung Wook Seo
  • Publication number: 20190272955
    Abstract: A multilayer ceramic electronic component includes a ceramic body including a dielectric and an internal electrode, an electrode layer eletrically connected to the internal electrode, and a conductive resin layer disposed on the electrode layer and including a conductive metal, a graphene platelet, and a base resin.
    Type: Application
    Filed: October 29, 2018
    Publication date: September 5, 2019
    Inventors: Won Kuen OH, Tae Gyeom LEE, Hang Kyu CHO, Hye Hun PARK, Han Seong JUNG