Patents by Inventor Hye Hyun Choi

Hye Hyun Choi has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240167711
    Abstract: The simulation system for predicting heating and cooling loads of a building comprises the collection unit collecting measurement data of a target building from a BEMS, the identification unit identifying indoor and outdoor temperature, humidity, and insolation measured in the building in real time based on RTS method, the correlation derivation unit deriving a correlation between energy usage based on the BEMS measurement data collected by the collection unit and the cooling and heating loads according to indoor and outdoor temperature, humidity, and insolation identified by the identification unit, the simulation unit predicting a change in cooling and heating loads according to a change in at least one of pieces of measurement data based on the correlation derived from the correlation derivation unit to perform a simulation, and the information provision unit providing a simulation result from the simulation unit in a visible form to a user terminal.
    Type: Application
    Filed: September 19, 2023
    Publication date: May 23, 2024
    Inventors: Tae Dong LEE, Won Jang PARK, Min Ho CHOI, Soo Hyun YANG, Moo Kyung SEO, Han Sung CHOI, Hye Mi LIM, Ji Hun PARK, So Jeong PARK, Ki Bum HAN, Hyeong Jae JEON
  • Publication number: 20240120287
    Abstract: Provided is an overlay mark. The overlay mark comprises a substrate, a lower overlay in the substrate, a pattern layer on the substrate, and an upper overlay defining an opening on the pattern layer. The lower overlay does not overlap the upper overlay in a thickness direction of the substrate.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 11, 2024
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Sang Won PARK, A Yeong CHA, Byeong-Hwan SON, Hye Jin LEE, Jung Hyun CHOI, Jong Hee HAN
  • Patent number: 11935701
    Abstract: A capacitor component includes a body including dielectric layers, first and second internal electrodes, laminated in a first direction, facing each other, and first and second cover portions, disposed on outermost portions of the first and second internal electrodes, and first and second external electrodes, respectively disposed on both external surfaces of the body in a second direction, perpendicular to the first direction, and respectively connected to the first and second internal electrodes. An indentation including a glass is disposed at at least one of boundaries between the first internal electrodes and the first external electrode or one of boundaries between the second internal electrodes and the second external electrode.
    Type: Grant
    Filed: April 4, 2023
    Date of Patent: March 19, 2024
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jang Yeol Lee, Ji Hong Jo, Yoo Jeong Lee, Myung Jun Park, Jong Ho Lee, Hye Young Choi, Jae Hyun Lee, Hyun Hee Gu
  • Patent number: 11925547
    Abstract: The present invention relates to a coating composition for an in-vivo implantable prosthesis including a photoinitiator, a crosslinking agent, and a phosphorylcholine (pc) monomer having an acrylate group, a method of coating an in-vivo implantable prosthesis using the coating composition, and a cosmetic prosthesis coated with the crosslinked polyphosphorylcholine. An in-vivo implantable prosthesis coated with crosslinked polyphosphorylcholine may be manufactured by a simple method of applying a coating composition including a photoinitiator, a crosslinking agent, and a phosphorylcholine (pc) monomer having an acrylate group according to the present invention, and then irradiating uv rays. The crosslinked polyphosphorylcholine coating may provide hydrophilicity for the surface and may also remarkably reduce adsorption of proteins and fibroblasts, which may cause side effects such as capsular contracture.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: March 12, 2024
    Assignee: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Tae Hyun Choi, Yan Lee, Ji Ung Park, Ji Yeon Ham, Hee Jin Kim, Suk Wha Kim, Hye Jeong Min
  • Patent number: 10728026
    Abstract: A data management method includes decrypting the first encryption key using the second encryption in response to receiving the first encryption key, decrypting the data by using the first encryption key in response to receiving the data encrypted with the first encryption key, and encrypting the data with the third encryption key and transmitting the data externally.
    Type: Grant
    Filed: October 30, 2017
    Date of Patent: July 28, 2020
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Hye Hyun Choi, Bo Gyeong Kang
  • Publication number: 20180145829
    Abstract: A data management method includes decrypting the first encryption key using the second encryption in response to receiving the first encryption key, decrypting the data by using the first encryption key in response to receiving the data encrypted with the first encryption key, and encrypting the data with the third encryption key and transmitting the data externally.
    Type: Application
    Filed: October 30, 2017
    Publication date: May 24, 2018
    Applicant: Samsung Electronics Co, Ltd
    Inventors: Hye Hyun Choi, Bo Gyeong KANG
  • Patent number: D1027640
    Type: Grant
    Filed: November 24, 2022
    Date of Patent: May 21, 2024
    Assignee: KOLMAR KOREA CO., LTD.
    Inventors: Chang Soo Yi, Jong Hyun Park, Hye Jin Jung, Sung Moo Choi
  • Patent number: D1028714
    Type: Grant
    Filed: November 23, 2022
    Date of Patent: May 28, 2024
    Assignee: Kolmar Korea Co., Ltd.
    Inventors: Chang Soo Yi, Jong Hyun Park, Hye Jin Jung, Sung Moo Choi