Patents by Inventor Hye-In Shin

Hye-In Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8758976
    Abstract: The present invention relates to a positive photosensitive polyimide composition that includes polyimide, a polyamic acid, and a photoactive compound. An organic insulating layer for organic light-emitting devices (OLED), which includes the positive photosensitive polyimide composition, may control a taper angle and outgassing, and has excellent adhesion in respects to a substrate, water repellent control ability, and storage stability and the like.
    Type: Grant
    Filed: March 6, 2009
    Date of Patent: June 24, 2014
    Assignee: LG Chem Ltd.
    Inventors: Hye-Ran Seong, Chan-Hyo Park, Dong-Hyun Oh, Hye-In Shin, Kyung-Jun Kim, Se-Jin Shin
  • Publication number: 20110123927
    Abstract: A photosensitive resin composition is provided. The photosensitive resin composition comprises a) an alkali-soluble polyimide resin, b) an alkali-soluble novolak resin, c) a photosensitizer, and d) an organic solvent. The photosensitive resin composition is resistant to heat and can be used to form a pattern whose lateral angles are easily controllable. A large difference in developability between exposed and unexposed portions of the photosensitive resin composition is caused when patterning. The photosensitive resin composition is advantageous in terms of sensitivity, resolution, heat resistance and adhesiveness. Particularly, the lateral angles of the pattern can be easily controlled by varying the contents of the alkali-soluble resins. Therefore, the photosensitive resin composition is useful in the formation of an insulating film pattern of an organic light emitting diode (OLED).
    Type: Application
    Filed: May 20, 2009
    Publication date: May 26, 2011
    Applicant: LG CHEM, LTD.
    Inventors: Chan Hyo Park, Hye In Shin, Hye Ran Seong, Kyung Jun Kim, Dong Hyun Oh
  • Publication number: 20110059397
    Abstract: The present invention relates to a positive photosensitive polyimide composition that includes polyimide, a polyamic acid, and a photoactive compound. An organic insulating layer for organic light-emitting devices (OLED), which includes the positive photosensitive polyimide composition, may control a taper angle and outgassing, and has excellent adhesion in respects to a substrate, water repellent control ability, and storage stability and the like.
    Type: Application
    Filed: March 6, 2009
    Publication date: March 10, 2011
    Applicant: LG CHEM, LTD.
    Inventors: Hye-Ran Seong, Chan-Hyo Park, Dong-Hyun Oh, Hye-In Shin, Kyung-Jun Kim, Se-Jin Shin
  • Publication number: 20100069520
    Abstract: A block copolymer of a polyimide and a polyamic acid is disclosed. Further disclosed are a method for producing the block copolymer and a positive type photosensitive composition comprising the block copolymer. The solubility of the photosensitive composition in an alkaline aqueous solution is controlled to achieve high resolution of a pattern. Further disclosed are a protective film of a semiconductor device and an ITO insulating film of an organic light emitting diode (OLED), which are formed using the block copolymer. The protective film and the ITO insulating film are very stable over time.
    Type: Application
    Filed: July 8, 2009
    Publication date: March 18, 2010
    Applicant: LG CHEM, LTD.
    Inventors: Sang-Woo Kim, Dong-Hyun Oh, Hye-In Shin, Hye-Ran Seong, Chan-Hyo Park, Kyung-Jun Kim