Patents by Inventor Hye Kyung SO

Hye Kyung SO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Polishing composition and polishing method using the same
    Patent number: 11008482
    Abstract: The present invention relates to a polishing composition, and more particularly, to a chemical mechanical polishing (CMP) composition used to chemically and mechanically polish a semiconductor wafer. The polishing composition of the present invention, by comprising anion-modified silica polishing particles in which the zeta potential (?) is ??10 mV, can exhibit excellent polishing performance, and more specifically, which can achieve a high polishing rate with respect to an indium-containing polishing substrate, while improving the dispersibility of the composition and reducing residual defects on the substrate.
    Type: Grant
    Filed: December 20, 2018
    Date of Patent: May 18, 2021
    Inventors: Hye Kyung So, Myeong Hoon Han
  • POLISHING COMPOSITION AND POLISHING METHOD USING THE SAME
    Publication number: 20200165487
    Abstract: The present invention relates to a polishing composition, and more particularly, to a chemical mechanical polishing (CMP) composition used to chemically and mechanically polish a semiconductor wafer. The polishing composition of the present invention, by comprising anion-modified silica polishing particles in which the zeta potential (?) is ??10 mV, can exhibit excellent polishing performance, and more specifically, which can achieve a high polishing rate with respect to an indium-containing polishing substrate, while improving the dispersibility of the composition and reducing residual defects on the substrate.
    Type: Application
    Filed: December 20, 2018
    Publication date: May 28, 2020
    Inventors: Hye Kyung SO, Myeong Hoon HAN