Patents by Inventor Hye Ran WEE

Hye Ran WEE has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • IMAGE SENSOR PACKAGE
    Publication number: 20200395396
    Abstract: An image sensor package includes a substrate; an image sensor connected to the substrate; a film member disposed on the substrate and defining a hole for exposing an effective image pickup surface of the image sensor; a bonding wire connecting the image sensor to the substrate; and a filter attached to the film member. The film member includes at least one void therein and at least a portion of the bonding wire is contained within the film member.
    Type: Application
    Filed: December 18, 2019
    Publication date: December 17, 2020
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Do Jae YOO, Hye Ran WEE, Soon Kyo LEE, Jong Cheol HONG, Si Joong YANG