Patents by Inventor Hye Won Jung
Hye Won Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240126074Abstract: The present disclosure provides a waveguide display apparatus. The waveguide waveguide display apparatus of the present disclosure is a waveguide display apparatus for correcting curved surface reflection distortion, the waveguide display apparatus including a waveguide for guiding light inputted from the outside; a first diffractive optical element disposed at the waveguide, and diffracting the light inputted from the outside to the inside of the waveguide; and a second diffractive optical element disposed at the waveguide, and diffracting the light guided by the waveguide to output a plurality of diffracted lights in a direction of a curved surface reflector located outside, wherein the second diffractive optical element has a structure of a diffraction grating corresponding to a curvature of the curved surface reflector such that the diffracted lights are reflected at different locations of the curved surface reflector in directions parallel to each other.Type: ApplicationFiled: September 30, 2022Publication date: April 18, 2024Applicant: LG Chem, Ltd.Inventors: Jae Jin Kim, Bo Ra Jung, Hye Won Hwang, Yeon Jae Yoo, Joon Young Lee, Bu Gon Shin, Min Soo Song
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Patent number: 11476034Abstract: A coil electronic component includes a body having a multilayer structure formed by stacking a plurality of sheets and external electrodes disposed on outer surfaces of the body. A coil pattern is printed on each of the plurality of sheets. The coil pattern includes a coil body and a corner pattern spaced apart from the coil pattern and coupled to the external electrodes. An inner edge of the second coil pattern facing the coil body is formed as a curved line or a linear line.Type: GrantFiled: July 6, 2018Date of Patent: October 18, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dae Hui Jo, Hye Won Jung, Sa Yong Lee
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Patent number: 11315718Abstract: A coil component includes a body including a plurality of pattern layers and a via electrode layer connecting the respective conductive pattern layers to each other, and external electrodes disposed on an external surface of the body. A cross-sectional shape of the via electrode layer is divided into an upper region and a lower region, a side surface of the upper region has a tapered shape, and a lower surface of the lower region includes a curved portion.Type: GrantFiled: August 9, 2018Date of Patent: April 26, 2022Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventor: Hye Won Jung
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Patent number: 10849226Abstract: A printed circuit board includes: an insulating layer having a via hole formed therein; a single layer metal pad disposed in the insulating layer and having a center portion that is exposed by the via hole, the center portion of the pad having a higher roughness than peripheral portions of the pad; and a via formed in the via hole and connected to the center portion of the pad.Type: GrantFiled: October 25, 2019Date of Patent: November 24, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Mi-Sun Hwang, Hye-Won Jung, Jae-Sung Sim, Byung-Duk Na, Hee-Joon Chun, Sun-A Kim, Deok-Man Kang
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Patent number: 10779409Abstract: A printed circuit board including: an insulating material; a metal layer stacked on a surface of the insulating material; and a via hole passing through the metal layer and the insulating material. The metal layer decreases in thickness in a region adjacent to the via hole, and an interface between the insulating material and the metal layer includes a region that is directed toward the via hole.Type: GrantFiled: November 5, 2019Date of Patent: September 15, 2020Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Byung-Duk Na, Hye-Won Jung, Jae-Sung Sim, Mi-Sun Hwang, Hee-Joon Chun, Deok-Man Kang, Sun-A Kim
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Publication number: 20200178392Abstract: A printed circuit board includes: an insulating layer having a via hole formed therein; a single layer metal pad disposed in the insulating layer and having a center portion that is exposed by the via hole, the center portion of the pad having a higher roughness than peripheral portions of the pad; and a via formed in the via hole and connected to the center portion of the pad.Type: ApplicationFiled: October 25, 2019Publication date: June 4, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Mi-Sun HWANG, Hye-Won JUNG, Jae-Sung SIM, Byung-Duk NA, Hee-Joon CHUN, Sun-A KIM, Deok-Man KANG
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Publication number: 20200154568Abstract: A printed circuit board including: an insulating material; a metal layer stacked on a surface of the insulating material; and a via hole passing through the metal layer and the insulating material. The metal layer decreases in thickness in a region adjacent to the via hole, and an interface between the insulating material and the metal layer includes a region that is directed toward the via hole.Type: ApplicationFiled: November 5, 2019Publication date: May 14, 2020Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Byung-Duk NA, Hye-Won JUNG, Jae-Sung SIM, Mi-Sun HWANG, Hee-Joon CHUN, Deok-Man KANG, Sun-A KIM
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Publication number: 20190122808Abstract: A coil electronic component includes a body having a multilayer structure formed by stacking a plurality of sheets and external electrodes disposed on outer surfaces of the body. A coil pattern is printed on each of the plurality of sheets. The coil pattern includes a coil body and a corner pattern spaced apart from the coil pattern and coupled to the external electrodes. An inner edge of the second coil pattern facing the coil body is formed as a curved line or a linear line.Type: ApplicationFiled: July 6, 2018Publication date: April 25, 2019Inventors: Dae Hui JO, Hye Won JUNG, Sa Yong LEE
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Publication number: 20190103208Abstract: A coil component includes a body including a plurality of pattern layers and a via electrode layer connecting the respective conductive pattern layers to each other, and external electrodes disposed on an external surface of the body. A cross-sectional shape of the via electrode layer is divided into an upper region and a lower region, a side surface of the upper region has a tapered shape, and a lower surface of the lower region includes a curved portion.Type: ApplicationFiled: August 9, 2018Publication date: April 4, 2019Inventor: Hye Won JUNG
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Patent number: 10021785Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first circuit layer disposed on an upper surface of a substrate, an insulating layer disposed on the substrate and the first circuit layer, a second circuit layer disposed on an upper surface of the insulating layer, and a via configured to connect between the first circuit layer and the second circuit layer, and a lower part of the via is in contact with the upper surface of the substrate.Type: GrantFiled: December 11, 2015Date of Patent: July 10, 2018Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung-Sam Kang, Young-Gwan Ko, Sang-Hoon Kim, Kang-Wook Bong, Hye-Won Jung, Yong-Wan Ji
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Patent number: 9793250Abstract: There are provided a package board, a method for manufacturing the same, and a package on package having the same. The package board according to an exemplary embodiment of the present disclosure includes a first insulating layer formed with a cavity having a penetrating shape; and a first connection pad formed to penetrate through the first insulating layer and formed at one side of the cavity.Type: GrantFiled: April 21, 2015Date of Patent: October 17, 2017Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung Sam Kang, Young Gwan Ko, Hye Jin Kim, Hye Won Jung, Min Jae Seong
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Patent number: 9554466Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an insulating layer including a first resin layer and a second resin layer, circuit layers disposed on upper and lower surfaces of the insulating layer, and a via configured to connect the circuit layer formed on the upper surface to the circuit layer formed on the lower surface, and the second resin layer extends from an upper surface of the first resin layer to a lower surface of the first resin layer by passing through the first resin layer as to contact a side surface of the via.Type: GrantFiled: December 11, 2015Date of Patent: January 24, 2017Assignee: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung-Sam Kang, Young-Gwan Ko, Sang-Hoon Kim, Kang-Wook Bong, Hye-Won Jung, Yong-Wan Ji
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Publication number: 20160192491Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes a first circuit layer disposed on an upper surface of a substrate, an insulating layer disposed on the substrate and the first circuit layer, a second circuit layer disposed on an upper surface of the insulating layer, and a via configured to connect between the first circuit layer and the second circuit layer, and a lower part of the via is in contact with the upper surface of the substrate.Type: ApplicationFiled: December 11, 2015Publication date: June 30, 2016Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung-Sam KANG, Young-Gwan KO, Sang-Hoon KIM, Kang-Wook BONG, Hye-Won JUNG, Yong-Wan JI
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Publication number: 20160192490Abstract: A printed circuit board and a method of manufacturing the same are provided. The printed circuit board includes an insulating layer including a first resin layer and a second resin layer, circuit layers disposed on upper and lower surfaces of the insulating layer, and a via configured to connect the circuit layer formed on the upper surface to the circuit layer formed on the lower surface, and the second resin layer extends from an upper surface of the first resin layer to a lower surface of the first resin layer by passing through the first resin layer as to contact a side surface of the via.Type: ApplicationFiled: December 11, 2015Publication date: June 30, 2016Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Myung-Sam KANG, Young-Gwan KO, Sang-Hoon KIM, Kang-Wook BONG, Hye-Won JUNG, Yong-Wan JI
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Publication number: 20160100485Abstract: Disclosed are a printed circuit board and a method of manufacturing the printed circuit board, which includes: a first resist layer; a first circuit formed on the first resist layer; an insulation film formed on the first resist layer so as to cover an upper surface and a lateral surface of the first circuit; a ground formed on the insulation film so as to be connected with the first circuit electrically; and an insulation layer formed on the insulation film so as to cover the ground.Type: ApplicationFiled: March 2, 2015Publication date: April 7, 2016Inventors: Hye-Won JUNG, Myung-Sam KANG, Yong-Wan JI, Yong-Jin PARK, Young-Gwan KO, Kang-Wook BONG
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Publication number: 20160081182Abstract: There are provided a package board, a method for manufacturing the same, and a package on package having the same. The package board according to an exemplary embodiment of the present disclosure includes a first insulating layer formed with a cavity having a penetrating shape; and a first connection pad formed to penetrate through the first insulating layer and formed at one side of the cavity.Type: ApplicationFiled: April 21, 2015Publication date: March 17, 2016Inventors: Myung Sam KANG, Young Gwan KO, Hye Jin KIM, Hye Won JUNG, Min Jae SEONG
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Publication number: 20160021749Abstract: There are provided a package board, a method of manufacturing the same, and a stack type package using the same. The package board according to an exemplary embodiment of the present invention includes a first insulating layer formed with a cavity and an external connection terminal formed to penetrate through the first insulating layer and have one end protruding to an outside of one surface of the first insulating layer.Type: ApplicationFiled: June 10, 2015Publication date: January 21, 2016Inventors: Kang Wook BONG, Myung Sam KANG, Yong Wan JI, Hye Won JUNG, Yong Jin PARK, Young Gwan KO
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Publication number: 20150342046Abstract: A printed circuit board connected to one surface of a substrate and a first electronic component is mounted on the one surface. The printed circuit board includes at least one insulating layer and the insulating layer has a cavity accommodating at least a portion of the first electronic component formed therein, and the cavity has an internal surface made of an insulating material.Type: ApplicationFiled: May 21, 2015Publication date: November 26, 2015Inventors: Hye Jin KIM, Hye Won JUNG, Myung Sam KANG, Kang Wook BONG, Young Gwan KO, Min Jae SEONG
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Publication number: 20150114699Abstract: There are provided an insulation material, a printed circuit board using the same, and a method of manufacturing the same. The insulation material includes a via region in which a via is to be formed; and a reinforcement material, wherein the via region and the reinforcement material are formed to be spaced apart from each other.Type: ApplicationFiled: July 28, 2014Publication date: April 30, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Young Gwan Ko, Yong Jin Park, Kang Wook Bong, Hye Won Jung, Young Kuk Ko, Joon Sung Kim
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Publication number: 20140048320Abstract: Disclosed herein are a printed circuit board and a method for manufacturing the same, the printed circuit board including an adhesion promoter (AP) film for enhancing adhesive strength, interposed between a circuit pattern and an insulating layer above a substrate, the AP film containing any one of a first polymer, a second polymer, and an organic compound. According to the method for manufacturing the printed circuit board, there can be provided a printed circuit board having a fine circuit pattern by using the AP film having a low roughness value and having improved adhesive strength with respect to the circuit pattern.Type: ApplicationFiled: December 7, 2012Publication date: February 20, 2014Applicant: Samsung Electro-Mechanics Co., Ltd.Inventors: Yong Jin Park, Yong Gwan Ko, Hye Won Jung, Joon Sung Kim