Patents by Inventor Hye Won Ryoo
Hye Won Ryoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240290543Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode disposed alternately with the dielectric layer in a first direction, and an external electrode disposed on the outside of the body and connected to the internal electrode. The dielectric layer includes a first layer and a second layer stacked in the first direction, and each of the first layer and the second layer includes Ba, Ti, and Si. 1.5?S2/S1?3.0 is satisfied, when a molar ratio of Si to Ti included in the first layer is referred to as Si and a molar ratio of Si to Ti included in the second layer is referred to as S2.Type: ApplicationFiled: November 27, 2023Publication date: August 29, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hyung Soon KWON, Hyoung Uk KIM, Han Seong JUNG, Ji Su HONG, Hye Won RYOO, Jae Sung PARK
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Publication number: 20240282525Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes; and an external electrode disposed on the body. The body includes a capacitance forming portion including the dielectric layers and the internal electrodes in a first direction, and a cover portion disposed on both end-surfaces of the capacitance forming portion in the first direction. One of the dielectric layers includes a first acceptor element containing Al, a second acceptor element containing at least one of Mg, Mn, or V, and Ti. The one of the dielectric layers and the cover portion include a plurality of dielectric grains, and a ratio (G1/G2) of an average size (G1) of the plurality of dielectric grains included in the one of the dielectric layers relative to an average size (G2) of the plurality of dielectric grains included in the cover portion satisfies 1.00?G1/G2<1.50.Type: ApplicationFiled: January 17, 2024Publication date: August 22, 2024Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Won RYOO, Kyung Sik KIM, Seung In BAIK, Min Young CHOI, Jong Hwan LEE, Hyung Soon KWON
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Publication number: 20230230768Abstract: A multilayer electronic component includes: a body including a plurality of dielectric layers and internal electrodes disposed to face each other with each of the plurality of dielectric layers interposed therebetween; and external electrodes connected to the internal electrodes and disposed on outer surfaces of the body, wherein each of the plurality of dielectric layers includes a BaTiO3-based base material main component and an accessory component including dysprosium (Dy) and terbium (Tb), a content of terbium (Tb) is 0.2 mol or more and less than 1.0 mol based on 100 mol of the base material main component, and the dielectric layer includes a plurality of dielectric crystal grains having a particle size of 60 nm or more and 250 nm or less at a point (D50) at which a cumulative volume is 50% in a cumulative particle size distribution according to a particle size distribution system.Type: ApplicationFiled: December 19, 2022Publication date: July 20, 2023Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Ho In Jun, Kyeong Jun Kim, Mi Kyeong Kim, Eon Ju Noh, Hye Won Ryoo
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Patent number: 11094468Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers disposed therebetween to be exposed to first and second external surfaces of the ceramic body, and first and second external electrodes disposed on the first and second external surfaces of the ceramic body and connected to corresponding internal electrodes, among the first and second internal electrodes, respectively. The dielectric layer includes a portion, disposed between the first and second external electrodes, having a thickness of 3.5 micrometers or more to 3.7 micrometers or less.Type: GrantFiled: January 23, 2019Date of Patent: August 17, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: A Reum Jun, Hye Won Ryoo, Ho In Jun, Seok Keun Ahn, Ji Hye Yu, Gi Seok Jeong
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Patent number: 11062847Abstract: A method for manufacturing a capacitor component includes an operation of sintering under a moderately-or-more reducing atmosphere for hydrogen, a body in which a plurality of dielectric layers having internal electrodes printed thereon are laminated,; a first reoxidation operation of subjecting the sintered body to a first reoxidation heat treatment under an oxidizing atmosphere; and a second reoxidation operation of subjecting the body having undergone the first reoxidation heat treatment to a second reoxidation heat treatment under an oxidizing atmosphere.Type: GrantFiled: April 14, 2020Date of Patent: July 13, 2021Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Won Ryoo, Ji Hong Jo, Ho In Jun, Seok Keun Ahn, Ji Hye Yu, A Reum Jun, Gi Seok Jeong, Seon Young Yoo
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Publication number: 20200243263Abstract: A method for manufacturing a capacitor component includes an operation of sintering under a moderately-or-more reducing atmosphere for hydrogen, a body in which a plurality of dielectric layers having internal electrodes printed thereon are laminated,; a first reoxidation operation of subjecting the sintered body to a first reoxidation heat treatment under an oxidizing atmosphere; and a second reoxidation operation of subjecting the body having undergone the first reoxidation heat treatment to a second reoxidation heat treatment under an oxidizing atmosphere.Type: ApplicationFiled: April 14, 2020Publication date: July 30, 2020Inventors: Hye Won Ryoo, Ji Hong Jo, Ho In Jun, Seok Keun Ahn, Ji Hye Yu, A Reum Jun, Gi Seok Jeong, Seon Young Yoo
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Publication number: 20200168397Abstract: A method for manufacturing a capacitor component includes an operation of sintering under a moderately-or-more reducing atmosphere for hydrogen, a body in which a plurality of dielectric layers having internal electrodes printed thereon are laminated,; a first reoxidation operation of subjecting the sintered body to a first reoxidation heat treatment under an oxidizing atmosphere; and a second reoxidation operation of subjecting the body having undergone the first reoxidation heat treatment to a second reoxidation heat treatment under an oxidizing atmosphere.Type: ApplicationFiled: February 15, 2019Publication date: May 28, 2020Inventors: Hye Won Ryoo, Ji Hong Jo, Ho In Jun, Seok Keun Ahn, Ji Hye Yu, A Reum Jun, Gi Seok Jeong, Seon Young Yoo
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Patent number: 10658115Abstract: A method for manufacturing a capacitor component includes an operation of sintering under a moderately-or-more reducing atmosphere for hydrogen, a body in which a plurality of dielectric layers having internal electrodes printed thereon are laminated; a first reoxidation operation of subjecting the sintered body to a first reoxidation heat treatment under an oxidizing atmosphere; and a second reoxidation operation of subjecting the body having undergone the first reoxidation heat treatment to a second reoxidation heat treatment under an oxidizing atmosphere.Type: GrantFiled: February 15, 2019Date of Patent: May 19, 2020Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Won Ryoo, Ji Hong Jo, Ho In Jun, Seok Keun Ahn, Ji Hye Yu, A Reum Jun, Gi Seok Jeong, Seon Young Yoo
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Publication number: 20200152388Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers disposed therebetween to be exposed to first and second external surfaces of the ceramic body, and first and second external electrodes disposed on the first and second external surfaces of the ceramic body and connected to corresponding internal electrodes, among the first and second internal electrodes, respectively. The dielectric layer includes a portion, disposed between the first and second external electrodes, having a thickness of 3.5 micrometers or more to 3.7 micrometers or less.Type: ApplicationFiled: January 23, 2019Publication date: May 14, 2020Inventors: A Reum Jun, Hye Won Ryoo, Ho In Jun, Seok Keun Ahn, Ji Hye Yu, Gi Seok Jeong