Patents by Inventor Hye Won Ryoo

Hye Won Ryoo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240290543
    Abstract: A multilayer electronic component includes a body including a dielectric layer and an internal electrode disposed alternately with the dielectric layer in a first direction, and an external electrode disposed on the outside of the body and connected to the internal electrode. The dielectric layer includes a first layer and a second layer stacked in the first direction, and each of the first layer and the second layer includes Ba, Ti, and Si. 1.5?S2/S1?3.0 is satisfied, when a molar ratio of Si to Ti included in the first layer is referred to as Si and a molar ratio of Si to Ti included in the second layer is referred to as S2.
    Type: Application
    Filed: November 27, 2023
    Publication date: August 29, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyung Soon KWON, Hyoung Uk KIM, Han Seong JUNG, Ji Su HONG, Hye Won RYOO, Jae Sung PARK
  • Publication number: 20240282525
    Abstract: A multilayer electronic component includes a body including dielectric layers and internal electrodes; and an external electrode disposed on the body. The body includes a capacitance forming portion including the dielectric layers and the internal electrodes in a first direction, and a cover portion disposed on both end-surfaces of the capacitance forming portion in the first direction. One of the dielectric layers includes a first acceptor element containing Al, a second acceptor element containing at least one of Mg, Mn, or V, and Ti. The one of the dielectric layers and the cover portion include a plurality of dielectric grains, and a ratio (G1/G2) of an average size (G1) of the plurality of dielectric grains included in the one of the dielectric layers relative to an average size (G2) of the plurality of dielectric grains included in the cover portion satisfies 1.00?G1/G2<1.50.
    Type: Application
    Filed: January 17, 2024
    Publication date: August 22, 2024
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Won RYOO, Kyung Sik KIM, Seung In BAIK, Min Young CHOI, Jong Hwan LEE, Hyung Soon KWON
  • Publication number: 20230230768
    Abstract: A multilayer electronic component includes: a body including a plurality of dielectric layers and internal electrodes disposed to face each other with each of the plurality of dielectric layers interposed therebetween; and external electrodes connected to the internal electrodes and disposed on outer surfaces of the body, wherein each of the plurality of dielectric layers includes a BaTiO3-based base material main component and an accessory component including dysprosium (Dy) and terbium (Tb), a content of terbium (Tb) is 0.2 mol or more and less than 1.0 mol based on 100 mol of the base material main component, and the dielectric layer includes a plurality of dielectric crystal grains having a particle size of 60 nm or more and 250 nm or less at a point (D50) at which a cumulative volume is 50% in a cumulative particle size distribution according to a particle size distribution system.
    Type: Application
    Filed: December 19, 2022
    Publication date: July 20, 2023
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ho In Jun, Kyeong Jun Kim, Mi Kyeong Kim, Eon Ju Noh, Hye Won Ryoo
  • Patent number: 11094468
    Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers disposed therebetween to be exposed to first and second external surfaces of the ceramic body, and first and second external electrodes disposed on the first and second external surfaces of the ceramic body and connected to corresponding internal electrodes, among the first and second internal electrodes, respectively. The dielectric layer includes a portion, disposed between the first and second external electrodes, having a thickness of 3.5 micrometers or more to 3.7 micrometers or less.
    Type: Grant
    Filed: January 23, 2019
    Date of Patent: August 17, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: A Reum Jun, Hye Won Ryoo, Ho In Jun, Seok Keun Ahn, Ji Hye Yu, Gi Seok Jeong
  • Patent number: 11062847
    Abstract: A method for manufacturing a capacitor component includes an operation of sintering under a moderately-or-more reducing atmosphere for hydrogen, a body in which a plurality of dielectric layers having internal electrodes printed thereon are laminated,; a first reoxidation operation of subjecting the sintered body to a first reoxidation heat treatment under an oxidizing atmosphere; and a second reoxidation operation of subjecting the body having undergone the first reoxidation heat treatment to a second reoxidation heat treatment under an oxidizing atmosphere.
    Type: Grant
    Filed: April 14, 2020
    Date of Patent: July 13, 2021
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Won Ryoo, Ji Hong Jo, Ho In Jun, Seok Keun Ahn, Ji Hye Yu, A Reum Jun, Gi Seok Jeong, Seon Young Yoo
  • Publication number: 20200243263
    Abstract: A method for manufacturing a capacitor component includes an operation of sintering under a moderately-or-more reducing atmosphere for hydrogen, a body in which a plurality of dielectric layers having internal electrodes printed thereon are laminated,; a first reoxidation operation of subjecting the sintered body to a first reoxidation heat treatment under an oxidizing atmosphere; and a second reoxidation operation of subjecting the body having undergone the first reoxidation heat treatment to a second reoxidation heat treatment under an oxidizing atmosphere.
    Type: Application
    Filed: April 14, 2020
    Publication date: July 30, 2020
    Inventors: Hye Won Ryoo, Ji Hong Jo, Ho In Jun, Seok Keun Ahn, Ji Hye Yu, A Reum Jun, Gi Seok Jeong, Seon Young Yoo
  • Publication number: 20200168397
    Abstract: A method for manufacturing a capacitor component includes an operation of sintering under a moderately-or-more reducing atmosphere for hydrogen, a body in which a plurality of dielectric layers having internal electrodes printed thereon are laminated,; a first reoxidation operation of subjecting the sintered body to a first reoxidation heat treatment under an oxidizing atmosphere; and a second reoxidation operation of subjecting the body having undergone the first reoxidation heat treatment to a second reoxidation heat treatment under an oxidizing atmosphere.
    Type: Application
    Filed: February 15, 2019
    Publication date: May 28, 2020
    Inventors: Hye Won Ryoo, Ji Hong Jo, Ho In Jun, Seok Keun Ahn, Ji Hye Yu, A Reum Jun, Gi Seok Jeong, Seon Young Yoo
  • Patent number: 10658115
    Abstract: A method for manufacturing a capacitor component includes an operation of sintering under a moderately-or-more reducing atmosphere for hydrogen, a body in which a plurality of dielectric layers having internal electrodes printed thereon are laminated; a first reoxidation operation of subjecting the sintered body to a first reoxidation heat treatment under an oxidizing atmosphere; and a second reoxidation operation of subjecting the body having undergone the first reoxidation heat treatment to a second reoxidation heat treatment under an oxidizing atmosphere.
    Type: Grant
    Filed: February 15, 2019
    Date of Patent: May 19, 2020
    Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hye Won Ryoo, Ji Hong Jo, Ho In Jun, Seok Keun Ahn, Ji Hye Yu, A Reum Jun, Gi Seok Jeong, Seon Young Yoo
  • Publication number: 20200152388
    Abstract: A multilayer ceramic electronic component includes a ceramic body including dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers disposed therebetween to be exposed to first and second external surfaces of the ceramic body, and first and second external electrodes disposed on the first and second external surfaces of the ceramic body and connected to corresponding internal electrodes, among the first and second internal electrodes, respectively. The dielectric layer includes a portion, disposed between the first and second external electrodes, having a thickness of 3.5 micrometers or more to 3.7 micrometers or less.
    Type: Application
    Filed: January 23, 2019
    Publication date: May 14, 2020
    Inventors: A Reum Jun, Hye Won Ryoo, Ho In Jun, Seok Keun Ahn, Ji Hye Yu, Gi Seok Jeong