Patents by Inventor Hye-yeon Kim

Hye-yeon Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240104756
    Abstract: An apparatus for measuring a depth of a tread groove may include: a camera module capturing a video including an upper end portion of a tire while rotating around an upper end portion of the tire having a plurality of tread grooves, the video including a plurality of frames; a control module obtaining, based on the plurality of frames, a cross-sectional width of the tire in units of pixels by adding widths and depths of each of the plurality of tread grooves in units of pixels, a width of an inner block in units of pixels, and a width of an outer block in units of pixels, the inner and outer blocks are disposed on the tire; and a conversion module converting the depth of the tread groove in units of pixels into the depth in units of pixels.
    Type: Application
    Filed: January 6, 2023
    Publication date: March 28, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, AJOU UNIVERSITY INDUSTRY-ACADEMIC COOPERATION FOUNDATION
    Inventors: Jung Mo KOO, Kyoung Soo WE, Hye Yeon LEE, Gwang Jin KIM, Hyung Il KOO
  • Publication number: 20240084969
    Abstract: The liquefied gas storage tank includes a primary barrier, a primary insulation wall, a secondary barrier, and a secondary insulation wall. In a state where unit elements are arranged adjacent to each other, each of the unit elements being formed by stacking the secondary insulation wall, the secondary barrier, and a fixed insulation wall which is a part of the primary insulation wall, the primary insulation wall may comprise: a connection insulation wall provided in the space between the adjacent fixed insulation walls; first slits formed between the fixed insulation walls and the connection insulation wall when the connection insulation wall is inserted and installed between the adjacent fixed insulation walls; a plurality of second slits formed in a lengthwise direction and a widthwise direction of the fixed insulation walls; and a first insulating filler material for filling the first slits.
    Type: Application
    Filed: December 15, 2021
    Publication date: March 14, 2024
    Inventors: Seong Bo PARK, Won Seok HEO, Hye Min CHO, Ki Joong KIM, Cheon Jin PARK, Min Kyu PARK, Jung Kyu PARK, Byeong Jin JEONG, Dong Woo KIM, Sung Kyu HONG, Gwang Soo GO, Jee Yeon HEO
  • Patent number: 11925547
    Abstract: The present invention relates to a coating composition for an in-vivo implantable prosthesis including a photoinitiator, a crosslinking agent, and a phosphorylcholine (pc) monomer having an acrylate group, a method of coating an in-vivo implantable prosthesis using the coating composition, and a cosmetic prosthesis coated with the crosslinked polyphosphorylcholine. An in-vivo implantable prosthesis coated with crosslinked polyphosphorylcholine may be manufactured by a simple method of applying a coating composition including a photoinitiator, a crosslinking agent, and a phosphorylcholine (pc) monomer having an acrylate group according to the present invention, and then irradiating uv rays. The crosslinked polyphosphorylcholine coating may provide hydrophilicity for the surface and may also remarkably reduce adsorption of proteins and fibroblasts, which may cause side effects such as capsular contracture.
    Type: Grant
    Filed: August 25, 2021
    Date of Patent: March 12, 2024
    Assignee: SEOUL NATIONAL UNIVERSITY R&DB FOUNDATION
    Inventors: Tae Hyun Choi, Yan Lee, Ji Ung Park, Ji Yeon Ham, Hee Jin Kim, Suk Wha Kim, Hye Jeong Min
  • Publication number: 20240076663
    Abstract: The present invention relates to a novel-structured nucleic acid complex having a blood-brain barrier penetration ability and a composition comprising same and, more specifically, to a nucleic acid complex in which a bioactive nucleic acid is complementarily bound to a carrier peptide nucleic acid modified to be generally positively charged, and to a composition for blood-brain barrier penetration comprising same. The nucleic acid complex according to the present invention can penetrate the blood-brain barrier at excellent efficiency, and especially, the conjugation of a drug into the nucleic acid complex increases the blood-brain barrier penetration ability of the drug, and thus is very useful in treatment or diagnosis of diseases.
    Type: Application
    Filed: October 15, 2020
    Publication date: March 7, 2024
    Inventors: Min-Jung PARK, Hye Joo KIM, Ji-Yeon YU, Hee Kyung PARK
  • Patent number: 11913117
    Abstract: Disclosed is a hot-stamping component, which includes a base steel plate; and a plated layer on the base steel plate and including a first layer, a second layer, and an intermetallic compound portion having an island shape in the second layer, wherein the first layer and the second layer are sequentially stacked, and an area fraction of the intermetallic compound portion with respect to the second layer is an amount of 20% to 60%.
    Type: Grant
    Filed: February 23, 2023
    Date of Patent: February 27, 2024
    Assignee: Hyundai Steel Company
    Inventors: Hye Jin Kim, Kyu Yeon Hwang, Hyun Yeong Jung, Jin Ho Lee, Seung Pill Jung
  • Patent number: 11646481
    Abstract: The present disclosure relates to an MIMO antenna apparatus, and in particular, includes a PCB having at least one heat-generation element provided on one surface thereof, a first heat-dissipation part disposed to cover one surface of the PCB, having a through hole formed in a portion corresponding to the position provided with the heat-generation element, and having a plurality of vertical heat-dissipation fins formed to be extended in a direction perpendicular to the outside surface thereof, and a second heat-dissipation part detachably coupled to the through hole to contact one surface of the heat-generation element to receive heat from the heat-generation element and to dissipate heat at a long distance father than the first heat-dissipation part, thereby enhancing heat-dissipation performance and expanding universality of a product.
    Type: Grant
    Filed: October 18, 2019
    Date of Patent: May 9, 2023
    Assignee: KMW INC.
    Inventors: Chang Woo Yoo, In Ho Kim, Min Sik Park, Hye Yeon Kim
  • Publication number: 20230099375
    Abstract: A massive multiple-input multiple-output (MIMO) antenna apparatus and a heat dissipation device therefor are disclosed. The present disclosure according to at least one embodiment provides a massive MIMO antenna apparatus including a board, a first blowing unit, and a second blowing unit. The board has at least one board surface that holds a distributed arrangement of a plurality of heat-generating components, has a width and a length longer than the width, and includes a first section having a first amount of heat generation and a second section having a second amount of heat generation greater than the first amount of heat generation, the first section and the second section being partitioned along a length direction of the board.
    Type: Application
    Filed: December 5, 2022
    Publication date: March 30, 2023
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Kyo Sung JI, Chi Back RYU, Kyu Chul CHOI, Hye Yeon KIM, In Hwa CHOI, Jae Ho JANG, Jae Hyun PARK, Youn Jun CHO, Jeong Hyun CHOI
  • Publication number: 20230047942
    Abstract: A heat dissipation apparatus and antenna assembly using the same is disclosed herein. According to an embodiment of the present disclosure, a heat dissipation apparatus configured to cool a circuit board including at least one heat generation element is provided, the heat dissipation apparatus including: a plate disposed to face the circuit board; a plurality of first heat dissipation fins disposed in a first direction on one surface of the plate spaced apart from the circuit board; and a blowing unit disposed to face the one surface of the plate, the blowing unit including at least one fan configured to discharge air toward the one surface of the plate, wherein a space between two adjacent first heat dissipation fins defines a side flow path configured to guide the air discharged from the at least one fan.
    Type: Application
    Filed: October 28, 2022
    Publication date: February 16, 2023
    Applicant: KMW INC.
    Inventors: Duk Yong KIM, Kyu Chul CHOI, In Hwa CHOI, Youn Jun CHO, Jae Hyun PARK, Kyo Sung JI, Hye Yeon KIM, Chi Back RYU, Jeong Hyun CHOI, Jae Ho JANG
  • Patent number: 11577785
    Abstract: A vehicle front structure includes: a front side member; a fender apron member having a front end portion connected to a front end portion of the front side member; a subframe mounting bracket assembly mounted to the front end portion of the front side member and the front end portion of the fender apron member; and a first subframe disposed under the front side member. In particular, the front end portion of the front side member and the front end portion of the fender apron member are connected side-by-side in a width direction of a vehicle.
    Type: Grant
    Filed: November 16, 2020
    Date of Patent: February 14, 2023
    Assignees: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Hye Yeon Kim, Yong Kew Kim
  • Publication number: 20220200125
    Abstract: An antenna device may include: a main housing configured to house and fix a first board having a plurality of heating elements mounted on a rear surface thereof; at least one U-shaped heat dissipation cluster detachably coupled to the rear surface of the main housing, and filled with a predetermined refrigerant, wherein the refrigerant receives heat from the heating elements and dissipates the heat to the outside while moving along a pattern flow path formed in a distributed manner toward the outside; and at least one heat-collection mediating fixing part configured to collect heat from the heating elements and transfer the collected heat to the U-shaped heat dissipation cluster, while mediating the attachment/detachment of the U-shaped heat dissipation cluster to/from the rear surface of the main housing.
    Type: Application
    Filed: March 11, 2022
    Publication date: June 23, 2022
    Applicant: KMW INC.
    Inventors: Kyo Sung JI, Hye Yeon KIM, Youn Jun CHO
  • Publication number: 20220140869
    Abstract: The present invention relates to a multi-input and multi-output antenna apparatus, and in particular, the antenna apparatus provides an advantage of easy heat dissipation and calibration control by comprising: an antenna unit in which a transmission and reception substrate and an antenna substrate having a plurality of electric elements provided on one surface or the other surface thereof are stacked and arranged in the front-rear direction; a control unit in which a BB substrate and a PSU substrate having a plurality of electric elements provided on one surface or the other surface thereof are stacked and arranged in the front-rear direction, and which is provided so as to enable calibration control by using a connection between the antenna unit and a power supply or a control signal; and at least one connecting card which is provided so as to enable connection of the power supply or the control signal between the antenna unit and the control unit.
    Type: Application
    Filed: January 14, 2022
    Publication date: May 5, 2022
    Applicant: KMW INC.
    Inventors: Kyo Sung JI, Chang Woo YOO, Hye Yeon KIM
  • Patent number: 11324106
    Abstract: A cooling apparatus for an electronic element is provided. The cooling apparatus includes a printed circuit board, a housing main body, an additional cooling part, and a heat transfer part. The printed circuit board includes one surface and another surface. A plurality of electronic elements are provided on the one surface of the printed circuit board. The housing main body includes an inner surface and an outer surface. The another surface of the printed circuit board is attached to the inner surface of the housing main body, and the outer surface of the housing main body has a plurality of first cooling ribs provided to protrude therefrom. The additional cooling part is disposed to be spaced apart from the outer surface of the housing main body, and dissipates heat transferred from the housing main body.
    Type: Grant
    Filed: June 5, 2020
    Date of Patent: May 3, 2022
    Assignee: KMW INC.
    Inventors: Duk Yong Kim, Jun Woo Yang, Jin Soo Yeo, Chang Woo Yoo, Min Sik Park, Hye Yeon Kim
  • Publication number: 20220069476
    Abstract: The present invention relates to an antenna apparatus and, in particular, comprises: a main housing having an inner space formed therein so as to embed a main board and having a plurality of radiating fins provided on an outer surface thereof; a cover housing provided so as to shield the inner space of the main housing and having a plurality of radiating fins provided on an outer surface thereof; and a plurality of unit antenna blocks detachably coupled so as to occupy a portion of the outer surface of the cover housing, and having an antenna substrate embedded therein, the antenna substrate having one or more antenna elements and one or more antenna filters combined thereto, wherein the plurality of unit antenna blocks are signal-connected to the main board via at least one connecting card, thereby providing an advantage that dual banding can be realized as well as enabling effective heat dissipation.
    Type: Application
    Filed: November 10, 2021
    Publication date: March 3, 2022
    Applicant: KMW INC.
    Inventors: Chang Woo YOO, Kyo Sung JI, Min Seon YUN, Hye Yeon KIM
  • Patent number: 11266041
    Abstract: A printed circuit board includes one surface on which a plurality of electronic elements are mounted, at least one of the plurality of electronic elements generating heat during its operation, a board case which accommodates the printed circuit board, a cooling cover which has an inner surface and an outer surface, and a plurality of radial cooling bodies each formed to extend from the outer surface of the cooling cover so as to be inclined upward and configured to receive the heat generated from the printed circuit board to dissipate the heat externally. The inner surface of the cooling cover is in close contact with another surface of the printed circuit board while covering the board case. Each of the plurality of radial cooling bodies includes a unit heat pipe.
    Type: Grant
    Filed: June 4, 2020
    Date of Patent: March 1, 2022
    Assignee: KMW INC.
    Inventors: Duk Yong Kim, Jun Woo Yang, Jin Soo Yeo, Chang Woo Yoo, Min Sik Park, Hye Yeon Kim
  • Publication number: 20220033003
    Abstract: A vehicle front structure includes: a front side member; a fender apron member having a front end portion connected to a front end portion of the front side member; a subframe mounting bracket assembly mounted to the front end portion of the front side member and the front end portion of the fender apron member; and a first subframe disposed under the front side member. In particular, the front end portion of the front side member and the front end portion of the fender apron member are connected side-by-side in a width direction of a vehicle.
    Type: Application
    Filed: November 16, 2020
    Publication date: February 3, 2022
    Applicants: HYUNDAI MOTOR COMPANY, KIA MOTORS CORPORATION
    Inventors: Hye Yeon KIM, Yong Kew KIM
  • Patent number: 11233308
    Abstract: The present disclosure relates to a multiple-input and multiple-output antenna apparatus, and particularly, includes a housing, a ray dome which is coupled to the top of one side of the housing in a longitudinal direction, and has an antenna assembly disposed between the ray dome and the housing, a PCB assembly which is disposed at the bottom of the antenna assembly, a top cooling part which is coupled to the top of the other side of the housing in the longitudinal direction, has a battery and an FPGA assembly disposed between the top cooling part and the housing, and dissipates upward the heat discharged from the FPGA assembly, and a side cooling part which is coupled to protrude to one side in a width direction between the housing and the top cooling part and the other side in the width direction therebetween, and moves and dissipates the heat generated from the FPGA assembly to one side and the other side of the housing in the width direction, thereby improving cooling performance.
    Type: Grant
    Filed: June 3, 2020
    Date of Patent: January 25, 2022
    Assignee: KMW INC.
    Inventors: Duk Yong Kim, Jun Woo Yang, Jin Soo Yeo, Chang Woo Yoo, Min Sik Park, Hye Yeon Kim
  • Publication number: 20210388101
    Abstract: Provided herein is a method for producing an antibody with improved productivity while maintaining its titer by causing at least one hydroxyamino acid contained in the light chain of the antibody to undergo O-linked glycosylation. Also provided is an antibody so produced.
    Type: Application
    Filed: October 4, 2019
    Publication date: December 16, 2021
    Applicant: INDUSTRY-ACADEMIC COOPERATION FOUNDATION, YONSEI UNIVERSITY
    Inventors: Joo Young Kim, Jinu Lee, Hye Yeon Kim
  • Publication number: 20200305308
    Abstract: The present disclosure relates to a cooling apparatus for an electronic element, and includes a printed circuit board which has a plurality of electronic elements mounted on one surface, at least one of the plurality of electronic elements generating heat at operation, a board case which accommodates the printed circuit board, a cooling cover which has the inner surface in close contact with the other surface of the printed circuit board while covering the board case, and a plurality of radial cooling bodies which have at least one provided to protrude from the outer surface of the cooling cover, are each formed to extend to be inclined upward, and receive heat generated from the printed circuit board to dissipate the heat outward, thereby increasing an effective cooling area on a limited cooling portion to largely improve cooling performance.
    Type: Application
    Filed: June 4, 2020
    Publication date: September 24, 2020
    Applicant: KMW INC.
    Inventors: Duk Yong Kim, Jun Woo Yang, Jin Soo Yeo, Chang Woo Yoo, Min Sik Park, Hye Yeon Kim
  • Patent number: D966240
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: October 11, 2022
    Assignee: KMW INC.
    Inventors: Duk Yong Kim, Kyu Chul Choi, In Hwa Choi, Youn Jun Cho, Jae Hyun Park, Kyo Sung Ji, Hye Yeon Kim, Chi Back Ryu, Jeong Hyun Choi
  • Patent number: D966241
    Type: Grant
    Filed: October 19, 2020
    Date of Patent: October 11, 2022
    Assignee: KMW INC.
    Inventors: Duk Yong Kim, Kyu Chul Choi, In Hwa Choi, Youn Jun Cho, Jae Hyun Park, Kyo Sung Ji, Hye Yeon Kim, Chi Back Ryu, Jeong Hyun Choi