Abstract: A semiconductor package transferring apparatus is disclosed. The apparatus includes a tray that includes a front side and a rear side opposite the front side, the rear side including a plurality of package covering portions that each correspond to the shape of a semiconductor package and that are arranged to align with corresponding package loading portions on a front side of another tray. Each package covering portion has a surface configured to cover a semiconductor chip disposed below the surface. The apparatus further includes an anti-attachment portion disposed on the surface of one or more of the package covering portions. For each package covering portion on which an anti-attachment portion is disposed, the anti-attachment portion protrudes beyond the surface of the package covering portion.

Abstract: A semiconductor package transferring apparatus is disclosed. The apparatus includes a tray that includes a front side and a rear side opposite the front side, the rear side including a plurality of package covering portions that each correspond to the shape of a semiconductor package and that are arranged to align with corresponding package loading portions on a front side of another tray. Each package covering portion has a surface configured to cover a semiconductor chip disposed below the surface. The apparatus further includes an anti-attachment portion disposed on the surface of one or more of the package covering portions. For each package covering portion on which an anti-attachment portion is disposed, the anti-attachment portion protrudes beyond the surface of the package covering portion.

Abstract: Provided is a semiconductor device and method of manufacturing the same. The semiconductor device may include a base material and a compound layer on the base material including a mixture of a non-adhesive organic material and a non-oxidizing metal material.

Abstract: An apparatus includes a test board for testing electrical characteristics of the semiconductor chip; socket pins vertically disposed on the test board to electrically connect the test board, and external terminals of the semiconductor chip; socket springs interposed between the socket pins and the test board and making the socket pins vertically elastic; a plurality of laser beam transmitters vertically penetrating the socket pins, the socket springs, and the test board; and a laser beam source supplying laser beams to the laser beam transmitters.

Abstract: An insert for loading a semiconductor package having external connection terminals may have a support plate. The support plate may have an upper surface with first contact pads and a lower surface with second contact pads. The first contact pads may be electrically connected to the external connection terminals of the semiconductor package and the second contact pads may be electrically connected to test connection terminals of a test socket.

Abstract: A POGO pin that can measure low frequency products as well as RF products and also have a long life span, and a test socket including the POGO pin are provided. The POGO pin includes a metal plunger formed of a conductive metal so as to electrically contact the semiconductor package, and a rubber contact pin connected with the metal plunger and formed of a conductive rubber so as to electrically contact the test board.

Abstract: In an example embodiment, an insert having an independently movable latch mechanism for loading a semiconductor package may include an insert body having a pocket, latch units installed at opposite sides of the pocket, and a press plate elastically installed above the insert body. The latch units prevent a loaded semiconductor package from escaping out of the pocket. The press plate may operate the latch unit by movement relative to an upper surface of the insert body. Each latch may be movably connected to the insert body such that a first end of the latch is rotatable around a fixed shaft pin. A second end of the latch may be movable into and out of the pocket. The latch may have a front surface slanted downwards towards the center of the pocket and have a guide hole near the back surface, opposite the front surface.

Abstract: A socket pin for a test apparatus. The socket pin may have self-cleaning function and may include a main body of a socket, a bottom contact tip at a lower portion of the main body, a first spring in the main body and connected to the bottom contact tip, a top contact tip at an upper portion of the main body, and a conductive contact ball at end of the top contact tip.

Abstract: In an example embodiment, an insert having an independently movable latch mechanism for loading a semiconductor package may include an insert body having a pocket, latch units installed at opposite sides of the pocket, and a press plate elastically installed above the insert body. The latch units prevent a loaded semiconductor package from escaping out of the pocket. The press plate may operate the latch unit by movement relative to an upper surface of the insert body. Each latch may be movably connected to the insert body such that a first end of the latch is rotatable around a fixed shaft pin. A second end of the latch may be movable into and out of the pocket. The latch may have a front surface slanted downwards towards the center of the pocket and have a guide hole near the back surface, opposite the front surface.

Abstract: Provided is electrical test equipment and method for testing semiconductor packages in an in-tray state. The equipment may include a loading site configured to receive a customer tray having a plurality of semiconductor packages therein, a test site configured to align the customer tray, and also configured to test all the plurality of semiconductor packages in the customer tray in-situ, a sorting site configured to sort the tested plurality of semiconductor packages in the customer tray, and an unloading site configured to unload the sorted plurality of semiconductor packages in the customer tray.

Abstract: A POGO pin that can measure low frequency products as well as RF products and also have a long life span, and a test socket including the POGO pin are provided. The POGO pin includes a metal plunger formed of a conductive metal so as to electrically contact the semiconductor package, and a rubber contact pin connected with the metal plunger and formed of a conductive rubber so as to electrically contact the test board.

Abstract: An apparatus includes a test board for testing electrical characteristics of the semiconductor chip; socket pins vertically disposed on the test board to electrically connect the test board, and external terminals of the semiconductor chip; socket springs interposed between the socket pins and the test board and making the socket pins vertically elastic; a plurality of laser beam transmitters vertically penetrating the socket pins, the socket springs, and the test board; and a laser beam source supplying laser beams to the laser beam transmitters.