Abstract: An electronic device according to various embodiments of the present invention comprises: an infrared filter for passing light in an infrared wavelength band; an image sensor for converting the received light into a video signal and outputting the video signal; an infrared light-emitting unit for emitting the light in the infrared wavelength band; and a processor. The processor can execute a first application, confirm a security level of the first application, and authorize the first application with an authority for controlling at least one of the image sensor, the infrared filter and the infrared light-emitting unit according to the confirmed security level of the first application.

Abstract: A protective film composition includes a polymer having the following formula: each of a, b, and c is a mole fraction; a+b+c=1; 0.05?a/(a+b+c)?0.3; 0.1?b/(a+b+c)?0.6; 0.1?c/(a+b+c)?0.6; each of R1, R2, and R3 is a hydrogen atom or a methyl group; R4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.

Abstract: A method, a system, and a non-transitory computer-readable record medium for a payment link may be provided. A payment link method implemented by a computer system, may include: verifying whether a second payment application is a transaction link target in response to a transaction request, which is received from a first payment application installed on an electronic device, occurring at a payment processing system that uses the second payment application different from the first payment application; and forwarding payment information on the first payment application to a payment server associated with the second payment application and linking a transaction between the first payment application and the second payment application in response to the second payment application corresponding to the transaction link target.

Abstract: A sealable lidding film for discharging gas according to an exemplary embodiment of the present invention may seal an opening of a main body, has a structure in which a first layer and a second layer, which are configured such that gas flows between one surface and the other surface, are stacked, and may include lamination portions which are formed by partially laminating the first layer and the second layer; and gap portions which are regions other than regions of the lamination portions and have spaces formed between the first layer and the second layer so that the gas flows in the spaces. According to the sealable lidding film for discharging gas, the spaces, in which the gas may flow, are formed by partially laminating the first and second layers having the fine bores, and as a result, it is possible to prevent expansion and deformation of the sealable lidding film or the container by smoothly discharging the gas created in the container.

Abstract: A protective film composition includes a polymer having the following formula: each of a, b, and cis amole fraction; a+b+c=1; 0.05?a/(a+b+c)?0.3; 0.1?b/(a+b+c)?0.6; 0.1?c/(a+b+c)?0.6; each of R1, R2, and R3 is a hydrogen atom or a methyl group; R4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.

Abstract: An ice maker provided in a refrigerator is provided. The ice maker includes: first and second ice making units configured to include ice making trays, heaters heating the ice making trays for deicing, and ejectors ejecting made ice from the ice making trays, respectively, wherein a plurality of first ice making grooves are formed in the ice making tray of the first ice making unit, and a plurality of second ice making grooves are formed in the ice making tray of the second ice making unit, the plurality of second ice making grooves having a shape different from that of the plurality of first ice making grooves.

Abstract: A packing sheet for discharging gas according to an exemplary embodiment of the present invention has a structure in which a first layer and a second layer, which are configured such that gas flows between one surface and the other surface, are stacked, and includes: a lamination portion which is formed by partially laminating the first layer and the second layer; and a gap portion which is a region other than a region of the lamination portion and has a space formed between the first layer and the second layer so that the gas flows in the space. According to the packing sheet for discharging gas, a space, in which gas may flow, is formed by partially laminating the first layer having fine bores and the second layer made of a gas-permeable waterproof material, and as a result, it is possible to prevent a liquid leakage while smoothly discharging the gas created in the container.

Abstract: A protective film composition includes a polymer having the following formula: each of a, b, and c is a mole fraction; a+b+c=1; 0.05?a/(a+b+c)?0.3; 0.1?b/(a+b+c)?0.6; 0.1?c/(a+b+c)?0.6; each of R1, R2, and R3 is a hydrogen atom or a methyl group; R4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.

Abstract: An X-ray apparatus includes a collimator comprising a lamp and configured to adjusting an irradiation region of X-rays radiated from an X-ray source; an image acquirer configured to acquire an object image by imaging an object while the lamp is turned on; and a controller configured to acquire an object distance based on the object image and acquire a thickness of the object based on a detector distance and the object distance. The object distance is a distance between the X-ray source and the object, and the detector distance is a distance between the X-ray source and an X-ray detector.

Abstract: A method of and apparatus for cleaning a semiconductor chip, the method including applying a first polar composition to a protection layer on a surface of at least one semiconductor chip to remove a particle from the surface of the at least one semiconductor chip and suspend the particle in the first polar composition; and applying a second polar composition, having a surface tension that is lower than that of the first polar composition, to a central portion of the applied first polar composition to push the first polar composition and the particle toward an outskirt of the at least one semiconductor chip.

Abstract: A sealable lidding film for discharging gas according to an exemplary embodiment of the present invention may seal an opening of a main body, has a structure in which a first layer and a second layer, which are configured such that gas flows between one surface and the other surface, are stacked, and may include lamination portions which are formed by partially laminating the first layer and the second layer; and gap portions which are regions other than regions of the lamination portions and have spaces formed between the first layer and the second layer so that the gas flows in the spaces. According to the sealable lidding film for discharging gas, the spaces, in which the gas may flow, are formed by partially laminating the first and second layers having the fine bores, and as a result, it is possible to prevent expansion and deformation of the sealable lidding film or the container by smoothly discharging the gas created in the container.

Abstract: A method for fabricating a semiconductor device includes stacking a semiconductor layer, a first sacrificial layer, and a second sacrificial layer, patterning the second sacrificial layer to form a second sacrificial pattern, forming a spacer pattern on both sides of the second sacrificial pattern, wherein a pitch of the spacer pattern is constant, and a width of the spacer pattern is constant, removing the second sacrificial pattern, forming a mask layer that covers the spacer pattern, forming a supporting pattern on the mask layer, wherein a width of the supporting pattern is greater than a width of the spacer pattern, and the supporting pattern is overlapped with the spacer pattern, transferring the supporting pattern and the spacer pattern onto the first sacrificial layer to form gate and supporting patterns, and transferring the gate and supporting patterns onto the semiconductor layer to form a gate and a supporting gate.

Abstract: A packing sheet for discharging gas according to an exemplary embodiment of the present invention has a structure in which a first layer and a second layer, which are configured such that gas flows between one surface and the other surface, are stacked, and includes: a lamination portion which is formed by partially laminating the first layer and the second layer; and a gap portion which is a region other than a region of the lamination portion and has a space formed between the first layer and the second layer so that the gas flows in the space. According to the packing sheet for discharging gas, a space, in which gas may flow, is formed by partially laminating the first layer having fine bores and the second layer made of a gas-permeable waterproof material, and as a result, it is possible to prevent a liquid leakage while smoothly discharging the gas created in the container.

Abstract: An electronic device according to various embodiments of the present invention comprises: an infrared filter for passing light in an infrared wavelength band; an image sensor for converting the received light into a video signal and outputting the video signal; an infrared light-emitting unit for emitting the light in the infrared wavelength band; and a processor. The processor can execute a first application, confirm a security level of the first application, and authorize the first application with an authority for controlling at least one of the image sensor, the infrared filter and the infrared light-emitting unit according to the confirmed security level of the first application.

Abstract: A mask blank includes: a light transmitting substrate; a first layer disposed on the light transmitting substrate, and including a chromium compound that contains chromium and at least one element selected from oxygen, nitrogen, and carbon; and a second layer disposed on the first layer as an outermost layer from among the first and second layers, and including a silicon compound that contains silicon and at least one element selected from oxygen, nitrogen, and carbon, an alloy of a transition metal and silicon, or a transition metal and silicon compound that contains a transition metal, silicon, and at least one element selected from oxygen, nitrogen, and carbon. The thickness of the first layer is 45 nm or less, and the thickness of the second layer is 5 nm or greater. An optical density of a stack composed of the first layer and the second layer is 3 or greater.

Abstract: A protective film composition includes a polymer having the following formula: each of a, b, and c is a mole fraction; a+b+c=1; 0.05?a/(a+b+c)?0.3; 0.1?b/(a+b+c)?0.6; 0.1?c/(a+b+c)?0.6; each of R1, R2, and R3 is a hydrogen atom or a methyl group; R4 is a hydrogen atom, a butyrolactonyl group, or a substituted or unsubstituted C3 to C30 alicyclic hydrocarbon group; and R5 is a substituted or unsubstituted C6 to C30 linear or cyclic hydrocarbon group. A method of manufacturing a semiconductor package includes forming a sawing protective film on a semiconductor structure by using the protective film composition and sawing the sawing protective film and the semiconductor structure from the sawing protective film.

Abstract: An X-ray apparatus includes a collimator comprising a lamp and configured to adjusting an irradiation region of X-rays radiated from an X-ray source; an image acquirer configured to acquire an object image by imaging an object while the lamp is turned on; and a controller configured to acquire an object distance based on the object image and acquire a thickness of the object based on a detector distance and the object distance. The object distance is a distance between the X-ray source and the object, and the detector distance is a distance between the X-ray source and an X-ray detector.

Abstract: An X-ray apparatus includes a collimator comprising a lamp and configured to adjusting an irradiation region of X-rays radiated from an X-ray source; an image acquirer configured to acquire an object image by imaging an object while the lamp is turned on; and a controller configured to acquire an object distance based on the object image and acquire a thickness of the object based on a detector distance and the object distance. The object distance is a distance between the X-ray source and the object, and the detector distance is a distance between the X-ray source and an X-ray detector.

Abstract: An ice maker provided in a refrigerator is provided. The ice maker includes: first and second ice making units configured to include ice making trays, heaters heating the ice making trays for deicing, and ejectors ejecting made ice from the ice making trays, respectively, wherein a plurality of first ice making grooves are formed in the ice making tray of the first ice making unit, and a plurality of second ice making grooves are formed in the ice making tray of the second ice making unit, the plurality of second ice making grooves having a shape different from that of the plurality of first ice making grooves.

Abstract: A thermal desorption system including a chamber including a space in which a substrate is heated; a flow compartment within the chamber, the flow compartment providing a separate gas flow space within the chamber; a substrate support that supports the substrate within the flow compartment; a heater that heats the substrate within the flow compartment; and a gas pipe that introduces a carrier gas into the flow compartment and discharges the carrier gas from the flow compartment.