Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.

Abstract: A semiconductor device includes first and second external dummy areas, and a circuit area between the first and second external dummy areas. The circuit area includes circuit active regions and circuit gate lines. Each external dummy area includes an external dummy active region and external dummy gate lines overlapping the external dummy active region and spaced apart from the circuit gate lines. The external dummy active region has a linear shape extending in a first horizontal direction or a shape including active portions isolated from direct contact with each other and extending sequentially in the first horizontal direction. The circuit active regions are between the first and second external dummy active regions and include a first plurality of circuit active regions extending sequentially in the first horizontal direction and a second plurality of circuit active regions extending sequentially in a second horizontal direction perpendicular to the first horizontal direction.

Abstract: A semiconductor device includes a plurality of active patterns respectively extending on a substrate in a first direction, a separation pattern extending on the substrate in a second direction, and dividing each of the plurality of active patterns into first and second active patterns, the separation pattern including a first separation pattern and a second separation pattern, the second separation pattern being shifted from the first separation pattern in the first direction to partially overlap the first separation pattern in the second direction, first and second dummy gate structures on first and second sides of the separation pattern, respectively, and extending along corresponding end portions of the first and second active patterns in the second direction, respectively, and a plurality of first and second gate structures crossing portions of the first and second active patterns, respectively, and extending in the second direction.

Abstract: A semiconductor device includes first and second external dummy areas, and a circuit area between the first and second external dummy areas. The circuit area includes circuit active regions and circuit gate lines. Each external dummy area includes an external dummy active region and external dummy gate lines overlapping the external dummy active region and spaced apart from the circuit gate lines. The external dummy active region has a linear shape extending in a first horizontal direction or a shape including active portions isolated from direct contact with each other and extending sequentially in the first horizontal direction. The circuit active regions are between the first and second external dummy active regions and include a first plurality of circuit active regions extending sequentially in the first horizontal direction and a second plurality of circuit active regions extending sequentially in a second horizontal direction perpendicular to the first horizontal direction.

Abstract: A semiconductor device includes first and second external dummy areas, and a circuit area between the first and second external dummy areas. The circuit area includes circuit active regions and circuit gate lines. Each external dummy area includes an external dummy active region and external dummy gate lines overlapping the external dummy active region and spaced apart from the circuit gate lines. The external dummy active region has a linear shape extending in a first horizontal direction or a shape including active portions isolated from direct contact with each other and extending sequentially in the first horizontal direction. The circuit active regions are between the first and second external dummy active regions and include a first plurality of circuit active regions extending sequentially in the first horizontal direction and a second plurality of circuit active regions extending sequentially in a second horizontal direction perpendicular to the first horizontal direction.

Abstract: A semiconductor device includes first and second external dummy areas, and a circuit area between the first and second external dummy areas. The circuit area includes circuit active regions and circuit gate lines. Each external dummy area includes an external dummy active region and external dummy gate lines overlapping the external dummy active region and spaced apart from the circuit gate lines. The external dummy active region has a linear shape extending in a first horizontal direction or a shape including active portions isolated from direct contact with each other and extending sequentially in the first horizontal direction. The circuit active regions are between the first and second external dummy active regions and include a first plurality of circuit active regions extending sequentially in the first horizontal direction and a second plurality of circuit active regions extending sequentially in a second horizontal direction perpendicular to the first horizontal direction.

Abstract: A semiconductor device includes first and second external dummy areas, and a circuit area between the first and second external dummy areas. The circuit area includes circuit active regions and circuit gate lines. Each external dummy area includes an external dummy active region and external dummy gate lines overlapping the external dummy active region and spaced apart from the circuit gate lines. The external dummy active region has a linear shape extending in a first horizontal direction or a shape including active portions isolated from direct contact with each other and extending sequentially in the first horizontal direction. The circuit active regions are between the first and second external dummy active regions and include a first plurality of circuit active regions extending sequentially in the first horizontal direction and a second plurality of circuit active regions extending sequentially in a second horizontal direction perpendicular to the first horizontal direction.

Abstract: A semiconductor device includes first and second external dummy areas, and a circuit area between the first and second external dummy areas. The circuit area includes circuit active regions and circuit gate lines. Each external dummy area includes an external dummy active region and external dummy gate lines overlapping the external dummy active region and spaced apart from the circuit gate lines. The external dummy active region has a linear shape extending in a first horizontal direction or a shape including active portions isolated from direct contact with each other and extending sequentially in the first horizontal direction. The circuit active regions are between the first and second external dummy active regions and include a first plurality of circuit active regions extending sequentially in the first horizontal direction and a second plurality of circuit active regions extending sequentially in a second horizontal direction perpendicular to the first horizontal direction.

Abstract: A semiconductor device including first and second active regions extending in a first direction; a field region between the first and second active regions; a gate structure including an upper gate electrode overlapping the first active region and extending in a second direction crossing the first direction, and a lower gate electrode overlapping the second active region, extending in the second direction, and on a same line as the upper gate electrode; a gate isolation layer between the upper and lower gate electrodes; source/drain regions on respective sides of the upper gate electrode; a contact jumper crossing the upper gate electrode in the first active region and electrically connecting the source/drain regions; and a first upper contact extending in the second direction in the field region and overlapping the lower gate electrode and the gate isolation layer, wherein the upper gate electrode is a dummy gate electrode.

Abstract: A semiconductor device including first and second active regions extending in a first direction; a field region between the first and second active regions; a gate structure including an upper gate electrode overlapping the first active region and extending in a second direction crossing the first direction, and a lower gate electrode overlapping the second active region, extending in the second direction, and on a same line as the upper gate electrode; a gate isolation layer between the upper and lower gate electrodes; source/drain regions on respective sides of the upper gate electrode; a contact jumper crossing the upper gate electrode in the second active region and electrically connecting the source/drain regions; and a first upper contact extending in the second direction in the field region and overlapping the lower gate electrode and the gate isolation layer, wherein the upper gate electrode is a dummy gate electrode.

Abstract: An exemplary embodiment of the present invention discloses a voltage generation circuit of a display apparatus, including at least one resistor, a memory configured to store a resistance value set signal, a controller changing a resistance value of the resistor referring to the resistance value set stored in the memory, and a voltage generator connected to one end of the resistor and is configured to receive an input current corresponding to the resistance value of the resistor and generate a gate-on voltage corresponding to the input current.

Abstract: Provided is a method for improving thermal stability of polypropylene carbonate and, more particularly, a method of end capping a molecular chain of polypropylene carbonate using a urethane group by adding isocyanates or diisocyanates to a polypropylene carbonate resin, which may optionally be a mixture containing tertiary polyol, so as to delay thermal degradation of the polypropylene carbonate at a high temperature, thereby securing desired thermal stability. Especially, the method capable of being easily applied to reactive extrusion after preparing the polypropylene carbonate has been proposed, thus simplifying production processes and ensuring economical advantages. Moreover, the above method does not deteriorate transparency and specific smoke density characteristics at combustion, which are advantages of the polypropylene carbonate.

Abstract: An exemplary embodiment of the present invention discloses a voltage generation circuit of a display apparatus, including at least one resistor, a memory configured to store a resistance value set signal, a controller changing a resistance value of the resistor referring to the resistance value set stored in the memory, and a voltage generator connected to one end of the resistor and is configured to receive an input current corresponding to the resistance value of the resistor and generate a gate-on voltage corresponding to the input current.

Abstract: Provided is a method for improving thermal stability of polypropylene carbonate and, more particularly, a method of end capping a molecular chain of polypropylene carbonate using a urethane group by adding isocyanates or diisocyanates to a polypropylene carbonate resin, which may optionally be a mixture containing tertiary polyol, so as to delay thermal degradation of the polypropylene carbonate at a high temperature, thereby securing desired thermal stability. Especially, the method capable of being easily applied to reactive extrusion after preparing the polypropylene carbonate has been proposed, thus simplifying production processes and ensuring economical advantages. Moreover, the above method does not deteriorate transparency and specific smoke density characteristics at combustion, which are advantages of the polypropylene carbonate.

Abstract: Provided is a method for improving thermal stability of polypropylene carbonate and, more particularly, a method of end capping a molecular chain of polypropylene carbonate using a urethane group by adding isocyanates or diisocyanates to a polypropylene carbonate resin, which may optionally be a mixture containing tertiary polyol, so as to delay thermal degradation of the polypropylene carbonate at a high temperature, thereby securing desired thermal stability. Especially, the method capable of being easily applied to reactive extrusion after preparing the polypropylene carbonate has been proposed, thus simplifying production processes and ensuring economical advantages. Moreover, the above method does not deteriorate transparency and specific smoke density characteristics at combustion, which are advantages of the polypropylene carbonate.

Abstract: Provided is a resin composition based on polyalkylene carbonate for use as an adhesive film composition for glass lamination, and more particularly, to a resin composition in which a plasticizer and isocyanate are added to polypropylene carbonate or polyethylene carbonate as polyalkylene carbonate to introduce a urethane group. As such, the resin composition of the present invention can improve an adhesive strength by addition of isocyanate, and secure flexibility by using the plasticizer. In particular, an adhesive sheet based on polyalkylene carbonate can decompose a polymer laminate layer through simple heat treatment to fully collect glass when defects of glass lamination are generated, thereby reducing the loss of glass due to process failure, be stable to moisture so that transport, storage, and use thereof are not limited, and perform lamination even at a lower process temperature.

Abstract: Provided is a polypropylene carbonate (hereinafter, PPC) paint composition, and more particularly, a pre-coated metal (PCM) paint composition for coil coating, which is mainly applied to cases for home appliances requiring high hardness, such as cases of a refrigerator. The composition can be used to provide a PCM paint, which has very low smoke density at the time of burning and emits remarkably low amounts of combustion gas and poisonous gas due to combustion at the time of firing, as compared with the existing laminate steel plate and a high-gloss film. In addition, the composition exhibits excellent adhesion to metal materials and excellent durability so that it can be usefully used for a PCM print steel plate applied to home appliances.

Abstract: Provided is a polypropylene carbonate based resin composition used as a hot melt adhesive. In detail, the present invention is to provide a composition of the hot melt adhesive having high adhesion to a polar surface of the polypropylene carbonate resin based hot melt adhesive and adhesion to a non-polar surface. The composition of hot melt adhesive according to the present invention has excellent compatibility between raw materials so as to have a completely uniform phase, thereby increasing cohesive energy as the adhesive and having the excellent adhesion to the polar or non-polar surface.

Abstract: Provided is an eco-friendly rotogravure hot melt ink composition. More specifically, the present invention provides the rotogravure hot melt ink composition meeting requirements of a carbon footprint system by using, as a vehicle, poly propylene carbonate prepared using carbon dioxide as a raw material. The rotogravure hot melt ink prepared by the composition of the present invention has a higher printing density and more easily performs printing at low temperature than a poly vinyl acetate based hot melt ink according to the related art.

Abstract: Provided is a method for improving thermal stability of polypropylene carbonate and, more particularly, a method of end capping a molecular chain of polypropylene carbonate using a urethane group by adding isocyanates or diisocyanates to a polypropylene carbonate resin, which may optionally be a mixture containing tertiary polyol, so as to delay thermal degradation of the polypropylene carbonate at a high temperature, thereby securing desired thermal stability. Especially, the method capable of being easily applied to reactive extrusion after preparing the polypropylene carbonate has been proposed, thus simplifying production processes and ensuring economical advantages. Moreover, the above method does not deteriorate transparency and specific smoke density characteristics at combustion, which are advantages of the polypropylene carbonate.