Patents by Inventor Hyelim YUN

Hyelim YUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240107726
    Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.
    Type: Application
    Filed: November 20, 2023
    Publication date: March 28, 2024
    Inventors: Hyelim YUN, Bongkyu MIN, Dohoon KIM, Taewoo KIM, Jinyong PARK, Jungje BANG, Hyeongju LEE
  • Patent number: 11923709
    Abstract: An electronic device is provided. The electronic device includes a first circuit board, an antenna member disposed to face one surface of the first circuit board, an electronic module disposed between the first circuit board and the antenna member and including a plurality of contact protrusions disposed to face the antenna member, and a plurality of contact members disposed on the antenna member and configured to electrically contact one of the plurality of contact protrusions. As the antenna member generates an induced current in reaction to an external electrical signal or an external electromagnetic field, the electronic module may be configured to supply power using the induced current generated by the antenna member.
    Type: Grant
    Filed: December 15, 2021
    Date of Patent: March 5, 2024
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Sungtae Park, Minki Kim, Kicheol Bae, Yongjae Song, Hyelim Yun, Woosung Jang
  • Patent number: 11825639
    Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.
    Type: Grant
    Filed: March 14, 2022
    Date of Patent: November 21, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyelim Yun, Bongkyu Min, Dohoon Kim, Taewoo Kim, Jinyong Park, Jungje Bang, Hyeongju Lee
  • Patent number: 11812555
    Abstract: According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical te
    Type: Grant
    Filed: April 12, 2022
    Date of Patent: November 7, 2023
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jinyong Park, Taewoo Kim, Hyeongju Lee, Bongkyu Min, Jungsik Park, Hyelim Yun
  • Publication number: 20220302722
    Abstract: An electronic device is provided. The electronic device includes a first circuit board, an antenna member disposed to face one surface of the first circuit board, an electronic module disposed between the first circuit board and the antenna member and including a plurality of contact protrusions disposed to face the antenna member, and a plurality of contact members disposed on the antenna member and configured to electrically contact one of the plurality of contact protrusions. As the antenna member generates an induced current in reaction to an external electrical signal or an external electromagnetic field, the electronic module may be configured to supply power using the induced current generated by the antenna member.
    Type: Application
    Filed: December 15, 2021
    Publication date: September 22, 2022
    Inventors: Sungtae PARK, Minki KIM, Kicheol BAE, Yongjae SONG, Hyelim YUN, Woosung JANG
  • Publication number: 20220240384
    Abstract: According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical te
    Type: Application
    Filed: April 12, 2022
    Publication date: July 28, 2022
    Inventors: Jinyong PARK, Taewoo KIM, Hyeongju LEE, Bongkyu MIN, Jungsik PARK, Hyelim YUN
  • Patent number: 11388277
    Abstract: An interposer and an electronic device including an interposer are provided. The interposer includes a multi-conductive member. The multi-conductive member includes an insulation member, a first conductive member that is disposed inside the insulation member and electrically transmits a designated signal or a designated power; and a ground member that surrounds the insulation member.
    Type: Grant
    Filed: August 5, 2020
    Date of Patent: July 12, 2022
    Inventors: Taewoo Kim, Dui Kang, Bongkyu Min, Bongchoon Park, Sanghoon Park, Jinyong Park, Hyelim Yun, Hyeongju Lee, Younoh Chi
  • Publication number: 20220210957
    Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.
    Type: Application
    Filed: March 14, 2022
    Publication date: June 30, 2022
    Inventors: Hyelim YUN, Bongkyu MIN, Dohoon KIM, Taewoo KIM, Jinyong PARK, Jungje BANG, Hyeongju LEE
  • Patent number: 11330716
    Abstract: According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical te
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: May 10, 2022
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Jinyong Park, Taewoo Kim, Hyeongju Lee, Bongkyu Min, Jungsik Park, Hyelim Yun
  • Publication number: 20220104356
    Abstract: The disclosure relates to an electronic device including an interposer. The interposer includes a substrate and a plurality of connecting structures disposed on the substrate and electrically connecting a first circuit board and a second circuit board disposed in the electronic device. The plurality of connecting structures includes a plurality of via holes formed in the substrate, a plurality of conductive members disposed in the plurality of via holes, an insulating member disposed between the plurality of conductive members, and a plurality of pads disposed on the outer periphery of the plurality of conductive members. The plurality of conductive members may be separately disposed on the substrate to electrically connect with the first and second circuit boards.
    Type: Application
    Filed: September 28, 2021
    Publication date: March 31, 2022
    Inventors: Bongkyu MIN, Taewoo KIM, Jinyong PARK, Hyelim YUN, Hyeongju LEE, Sanghoon PARK, Jiseon HAN
  • Patent number: 11277949
    Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.
    Type: Grant
    Filed: July 6, 2020
    Date of Patent: March 15, 2022
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyelim Yun, Bongkyu Min, Dohoon Kim, Taewoo Kim, Jinyong Park, Jungje Bang, Hyeongju Lee
  • Publication number: 20210112659
    Abstract: According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical te
    Type: Application
    Filed: December 23, 2020
    Publication date: April 15, 2021
    Inventors: Jinyong PARK, Taewoo KIM, Hyeongju LEE, Bongkyu MIN, Jungsik PARK, Hyelim YUN
  • Publication number: 20210099560
    Abstract: An interposer and an electronic device including an interposer are provided. The interposer includes a multi-conductive member. The multi-conductive member includes an insulation member, a first conductive member that is disposed inside the insulation member and electrically transmits a designated signal or a designated power; and a ground member that surrounds the insulation member.
    Type: Application
    Filed: August 5, 2020
    Publication date: April 1, 2021
    Inventors: Taewoo KIM, Dui KANG, Bongkyu MIN, Bongchoon PARK, Sanghoon PARK, Jinyong PARK, Hyelim YUN, Hyeongju LEE, Younoh CHI
  • Publication number: 20200337188
    Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.
    Type: Application
    Filed: July 6, 2020
    Publication date: October 22, 2020
    Inventors: Hyelim YUN, Bongkyu MIN, Dohoon KIM, Taewoo KIM, Jinyong PARK, Jungje BANG, Hyeongju LEE
  • Patent number: 10709043
    Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: July 7, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hyelim Yun, Bongkyu Min, Dohoon Kim, Taewoo Kim, Jinyong Park, Jungje Bang, Hyeongju Lee
  • Publication number: 20200093040
    Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.
    Type: Application
    Filed: September 19, 2019
    Publication date: March 19, 2020
    Inventors: Hyelim YUN, Bongkyu MIN, Dohoon KIM, Taewoo KIM, Jinyong PARK, Jungje BANG, Hyeongju LEE
  • Publication number: 20190373729
    Abstract: According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical te
    Type: Application
    Filed: May 16, 2019
    Publication date: December 5, 2019
    Inventors: Jinyong PARK, Taewoo KIM, Hyeongju LEE, Bongkyu MIN, Jungsik PARK, Hyelim YUN
  • Publication number: 20190319381
    Abstract: An electronic device includes a housing, a first board disposed inside the housing and including a first signal line and a first ground, a second board disposed on the first board and including a second signal line and a second ground, a plurality of connectors interposed between the first board and the second board, and a first electronic component disposed inside a space defined by the first board, the second board, and the plurality of connectors. Each of the plurality of connectors includes an insulating member, at least one conductive pin having at least a portion surrounded by the insulating member, and a metal plate electrically connecting the first ground of the first board with the second ground of the second board and formed on an outer sidewall of the insulating member. A first signal pin of conductive pins included in the plurality of connectors electrically connects the first signal line of the first board and the second signal line of the second board with the first electronic component.
    Type: Application
    Filed: April 15, 2019
    Publication date: October 17, 2019
    Inventors: Jungje BANG, Seungju KIM, Taewoo KIM, Bongkyu MIN, Bongchoon PARK, Jonggu PARK, Jonghan PARK, Jinyong PARK, Hoyeon SEO, Jaeheung YE, Hyelim YUN, Hyeongju LEE, Hyoungsoo JUNG