Patents by Inventor Hyelim YUN
Hyelim YUN has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20240107726Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.Type: ApplicationFiled: November 20, 2023Publication date: March 28, 2024Inventors: Hyelim YUN, Bongkyu MIN, Dohoon KIM, Taewoo KIM, Jinyong PARK, Jungje BANG, Hyeongju LEE
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Patent number: 11923709Abstract: An electronic device is provided. The electronic device includes a first circuit board, an antenna member disposed to face one surface of the first circuit board, an electronic module disposed between the first circuit board and the antenna member and including a plurality of contact protrusions disposed to face the antenna member, and a plurality of contact members disposed on the antenna member and configured to electrically contact one of the plurality of contact protrusions. As the antenna member generates an induced current in reaction to an external electrical signal or an external electromagnetic field, the electronic module may be configured to supply power using the induced current generated by the antenna member.Type: GrantFiled: December 15, 2021Date of Patent: March 5, 2024Assignee: Samsung Electronics Co., Ltd.Inventors: Sungtae Park, Minki Kim, Kicheol Bae, Yongjae Song, Hyelim Yun, Woosung Jang
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Patent number: 11825639Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.Type: GrantFiled: March 14, 2022Date of Patent: November 21, 2023Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyelim Yun, Bongkyu Min, Dohoon Kim, Taewoo Kim, Jinyong Park, Jungje Bang, Hyeongju Lee
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Patent number: 11812555Abstract: According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical teType: GrantFiled: April 12, 2022Date of Patent: November 7, 2023Assignee: Samsung Electronics Co., Ltd.Inventors: Jinyong Park, Taewoo Kim, Hyeongju Lee, Bongkyu Min, Jungsik Park, Hyelim Yun
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Publication number: 20220302722Abstract: An electronic device is provided. The electronic device includes a first circuit board, an antenna member disposed to face one surface of the first circuit board, an electronic module disposed between the first circuit board and the antenna member and including a plurality of contact protrusions disposed to face the antenna member, and a plurality of contact members disposed on the antenna member and configured to electrically contact one of the plurality of contact protrusions. As the antenna member generates an induced current in reaction to an external electrical signal or an external electromagnetic field, the electronic module may be configured to supply power using the induced current generated by the antenna member.Type: ApplicationFiled: December 15, 2021Publication date: September 22, 2022Inventors: Sungtae PARK, Minki KIM, Kicheol BAE, Yongjae SONG, Hyelim YUN, Woosung JANG
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Publication number: 20220240384Abstract: According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical teType: ApplicationFiled: April 12, 2022Publication date: July 28, 2022Inventors: Jinyong PARK, Taewoo KIM, Hyeongju LEE, Bongkyu MIN, Jungsik PARK, Hyelim YUN
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Patent number: 11388277Abstract: An interposer and an electronic device including an interposer are provided. The interposer includes a multi-conductive member. The multi-conductive member includes an insulation member, a first conductive member that is disposed inside the insulation member and electrically transmits a designated signal or a designated power; and a ground member that surrounds the insulation member.Type: GrantFiled: August 5, 2020Date of Patent: July 12, 2022Inventors: Taewoo Kim, Dui Kang, Bongkyu Min, Bongchoon Park, Sanghoon Park, Jinyong Park, Hyelim Yun, Hyeongju Lee, Younoh Chi
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Publication number: 20220210957Abstract: An example electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.Type: ApplicationFiled: March 14, 2022Publication date: June 30, 2022Inventors: Hyelim YUN, Bongkyu MIN, Dohoon KIM, Taewoo KIM, Jinyong PARK, Jungje BANG, Hyeongju LEE
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Patent number: 11330716Abstract: According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical teType: GrantFiled: December 23, 2020Date of Patent: May 10, 2022Assignee: Samsung Electronics Co., Ltd.Inventors: Jinyong Park, Taewoo Kim, Hyeongju Lee, Bongkyu Min, Jungsik Park, Hyelim Yun
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Publication number: 20220104356Abstract: The disclosure relates to an electronic device including an interposer. The interposer includes a substrate and a plurality of connecting structures disposed on the substrate and electrically connecting a first circuit board and a second circuit board disposed in the electronic device. The plurality of connecting structures includes a plurality of via holes formed in the substrate, a plurality of conductive members disposed in the plurality of via holes, an insulating member disposed between the plurality of conductive members, and a plurality of pads disposed on the outer periphery of the plurality of conductive members. The plurality of conductive members may be separately disposed on the substrate to electrically connect with the first and second circuit boards.Type: ApplicationFiled: September 28, 2021Publication date: March 31, 2022Inventors: Bongkyu MIN, Taewoo KIM, Jinyong PARK, Hyelim YUN, Hyeongju LEE, Sanghoon PARK, Jiseon HAN
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Patent number: 11277949Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.Type: GrantFiled: July 6, 2020Date of Patent: March 15, 2022Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyelim Yun, Bongkyu Min, Dohoon Kim, Taewoo Kim, Jinyong Park, Jungje Bang, Hyeongju Lee
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Publication number: 20210112659Abstract: According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical teType: ApplicationFiled: December 23, 2020Publication date: April 15, 2021Inventors: Jinyong PARK, Taewoo KIM, Hyeongju LEE, Bongkyu MIN, Jungsik PARK, Hyelim YUN
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Publication number: 20210099560Abstract: An interposer and an electronic device including an interposer are provided. The interposer includes a multi-conductive member. The multi-conductive member includes an insulation member, a first conductive member that is disposed inside the insulation member and electrically transmits a designated signal or a designated power; and a ground member that surrounds the insulation member.Type: ApplicationFiled: August 5, 2020Publication date: April 1, 2021Inventors: Taewoo KIM, Dui KANG, Bongkyu MIN, Bongchoon PARK, Sanghoon PARK, Jinyong PARK, Hyelim YUN, Hyeongju LEE, Younoh CHI
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Publication number: 20200337188Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.Type: ApplicationFiled: July 6, 2020Publication date: October 22, 2020Inventors: Hyelim YUN, Bongkyu MIN, Dohoon KIM, Taewoo KIM, Jinyong PARK, Jungje BANG, Hyeongju LEE
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Patent number: 10709043Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.Type: GrantFiled: September 19, 2019Date of Patent: July 7, 2020Assignee: SAMSUNG ELECTRONICS CO., LTD.Inventors: Hyelim Yun, Bongkyu Min, Dohoon Kim, Taewoo Kim, Jinyong Park, Jungje Bang, Hyeongju Lee
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Publication number: 20200093040Abstract: Disclosed is an electronic device. The electronic device includes a printed circuit board on which one or more circuit components are disposed, and an interposer surrounding at least some circuit components of the one or more circuit components and including an inner surface adjacent to the at least some circuit components and an outer surface facing away from the inner surface and having a plurality of through holes. The interposer is disposed on the printed circuit board such that one or more through holes of the plurality of through holes are electrically connected with a ground of the printed circuit board.Type: ApplicationFiled: September 19, 2019Publication date: March 19, 2020Inventors: Hyelim YUN, Bongkyu MIN, Dohoon KIM, Taewoo KIM, Jinyong PARK, Jungje BANG, Hyeongju LEE
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Publication number: 20190373729Abstract: According to an embodiment of the disclosure, an electronic device comprises a first printed circuit board including a first electrical terminal exposed on one face of a first area, a second electrical terminal exposed on the one face of a second area and insulated from the first electrical terminal, and a first ground terminal exposed on the one face of a third area formed between the first area and the second area, the third area having a width narrower than a width of the first area or the width of the second area; and a second printed circuit board including a third electrical terminal exposed on one face of a fourth area, a fourth electrical terminal exposed on the one face of a fifth area and electrically connected to the third electrical terminal, and a second ground terminal exposed on the one face of a sixth area located between the fourth area and the fifth area, wherein the second printed circuit board is disposed on the first printed circuit board to overlap the third area, the first electrical teType: ApplicationFiled: May 16, 2019Publication date: December 5, 2019Inventors: Jinyong PARK, Taewoo KIM, Hyeongju LEE, Bongkyu MIN, Jungsik PARK, Hyelim YUN
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Publication number: 20190319381Abstract: An electronic device includes a housing, a first board disposed inside the housing and including a first signal line and a first ground, a second board disposed on the first board and including a second signal line and a second ground, a plurality of connectors interposed between the first board and the second board, and a first electronic component disposed inside a space defined by the first board, the second board, and the plurality of connectors. Each of the plurality of connectors includes an insulating member, at least one conductive pin having at least a portion surrounded by the insulating member, and a metal plate electrically connecting the first ground of the first board with the second ground of the second board and formed on an outer sidewall of the insulating member. A first signal pin of conductive pins included in the plurality of connectors electrically connects the first signal line of the first board and the second signal line of the second board with the first electronic component.Type: ApplicationFiled: April 15, 2019Publication date: October 17, 2019Inventors: Jungje BANG, Seungju KIM, Taewoo KIM, Bongkyu MIN, Bongchoon PARK, Jonggu PARK, Jonghan PARK, Jinyong PARK, Hoyeon SEO, Jaeheung YE, Hyelim YUN, Hyeongju LEE, Hyoungsoo JUNG