Patents by Inventor Hyeog Soo Shin
Hyeog Soo Shin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 9607753Abstract: Disclosed herein is a multilayer inductor. The multilayer inductor according to an exemplary embodiment of the present invention includes a laminate on which a plurality of body sheets are multilayered; a coil part configured to have internal electrode patterns formed on the body sheet; a first gap made of a non-magnetic material located between the multilayered body sheets; a second gap made of a dielectric material located between the multilayered body sheets and located on a layer different from the first gap; and external electrodes formed on both surfaces of the laminate and electrically connected with both ends of the coil part. By this configuration, the exemplary embodiment of the present invention can remarkably improve DC biased characteristics without reducing breaking strength of the inductor.Type: GrantFiled: July 22, 2015Date of Patent: March 28, 2017Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Jin Jeong, Hyeog Soo Shin
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Patent number: 9397631Abstract: Disclosed herein is a filter chip element including a ferrite substrate, internal coil patterns formed on the ferrite substrate; and a ferrite composite layer filled between the internal coil patterns formed on the ferrite substrate, wherein the ferrite composite layer includes foaming resin, thereby increasing magnetic permeability and a Q value which are important characteristics of a filter chip element for noise prevention among electromagnetic shielding components.Type: GrantFiled: November 12, 2013Date of Patent: July 19, 2016Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yong Suk Kim, Sung Kwon Wi, Hyeog Soo Shin, Sang Moon Lee, Young Seuck Yoo, Sung Jin Park
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Patent number: 9349525Abstract: Disclosed herein is a multilayer inductor. The multilayer inductor according to an exemplary embodiment of the present invention includes a laminate on which a plurality of body sheets are multilayered; a coil part configured to have internal electrode patterns formed on the body sheet; a first gap made of a non-magnetic material located between the multilayered body sheets; a second gap made of a dielectric material located between the multilayered body sheets and located on a layer different from the first gap; and external electrodes formed on both surfaces of the laminate and electrically connected with both ends of the coil part. By this configuration, the exemplary embodiment of the present invention can remarkably improve DC biased characteristics without reducing breaking strength of the inductor.Type: GrantFiled: June 20, 2014Date of Patent: May 24, 2016Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Jin Jeong, Hyeog Soo Shin
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Patent number: 9251943Abstract: There is provided a multilayer type inductor, including: an inductor main body; a coil part having conductive circuits and conductive vias formed in the inductor main body; and external electrodes formed on both ends of the inductor main body, wherein in the inductor main body, at least parts around the conductive circuits and the conductive vias are formed of a ferrite material or a non-magnetic material.Type: GrantFiled: September 14, 2012Date of Patent: February 2, 2016Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Jin Jeong, Hyeog Soo Shin, Jae Wook Lee
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Publication number: 20150325360Abstract: Disclosed herein is a multilayer inductor. The multilayer inductor according to an exemplary embodiment of the present invention includes a laminate on which a plurality of body sheets are multilayered; a coil part configured to have internal electrode patterns formed on the body sheet; a first gap made of a non-magnetic material located between the multilayered body sheets; a second gap made of a dielectric material located between the multilayered body sheets and located on a layer different from the first gap; and external electrodes formed on both surfaces of the laminate and electrically connected with both ends of the coil part. By this configuration, the exemplary embodiment of the present invention can remarkably improve DC biased characteristics without reducing breaking strength of the inductor.Type: ApplicationFiled: July 22, 2015Publication date: November 12, 2015Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Dong Jin JEONG, Hyeog Soo SHIN
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Patent number: 9183979Abstract: The present invention relates to a chip inductor including: a metal-polymer composite in which metal particles and polymer are mixed; a wiring pattern provided inside the metal-polymer composite to form a coil; an external electrode provided in a portion of an outer peripheral surface of the metal-polymer composite; and an insulating portion provided between the metal-polymer composite and the wiring pattern and between the metal-polymer composite and the external electrode, and a method for manufacturing the same.Type: GrantFiled: December 21, 2012Date of Patent: November 10, 2015Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Hye Yeon Cha, Kang Heon Hur, Sung Jin Park, Dong Jin Jeong, Jung Min Park, Hyeog Soo Shin, Sung Yong An, Hwan Soo Lee, Young Do Kweon, Jin Woo Hahn
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Publication number: 20150187487Abstract: A ceramic electronic component may include: a chip body; external electrode forming portions formed on both ends of the chip body in a length direction, on at least one of an upper surface and a lower surface of the chip body, respectively; external electrodes formed on the external electrode forming portions, respectively; and a protective layer formed between the external electrode forming portions and having a thickness greater than that of the external electrodes.Type: ApplicationFiled: September 5, 2014Publication date: July 2, 2015Inventors: Sung Jin PARK, Hyeog Soo SHIN
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Publication number: 20140300441Abstract: Disclosed herein is a multilayer inductor. The multilayer inductor according to an exemplary embodiment of the present invention includes a laminate on which a plurality of body sheets are multilayered; a coil part configured to have internal electrode patterns formed on the body sheet; a first gap made of a non-magnetic material located between the multilayered body sheets; a second gap made of a dielectric material located between the multilayered body sheets and located on a layer different from the first gap; and external electrodes formed on both surfaces of the laminate and electrically connected with both ends of the coil part. By this configuration, the exemplary embodiment of the present invention can remarkably improve DC biased characteristics without reducing breaking strength of the inductor.Type: ApplicationFiled: June 20, 2014Publication date: October 9, 2014Inventors: Dong Jin JEONG, Hyeog Soo SHIN
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Publication number: 20140132366Abstract: Disclosed herein is a filter chip element including a ferrite substrate, internal coil patterns formed on the ferrite substrate; and a ferrite composite layer filled between the internal coil patterns formed on the ferrite substrate, wherein the ferrite composite layer includes foaming resin, thereby increasing magnetic permeability and a Q value which are important characteristics of a filter chip element for noise prevention among electromagnetic shielding components.Type: ApplicationFiled: November 12, 2013Publication date: May 15, 2014Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.Inventors: Yong Suk KIM, Sung Kwon WI, Hyeog Soo SHIN, Sang Moon LEE, Young Seuck YOO, Sung Jin PARK
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Publication number: 20130113593Abstract: There is provided a multilayer type inductor, incluing: an inductor main body; a coil part having conductive circuits and conductive vias formed in the inductor main body; and external electrodes formed on both ends of the inductor main body, wherein in the inductor main body, at least parts around the conductive circuits and the conductive vias are formed of a ferrite material or a non-magnetic material.Type: ApplicationFiled: September 14, 2012Publication date: May 9, 2013Inventors: Dong Jin JEONG, Hyeog Soo Shin, Jae Wook Lee
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Patent number: 7817007Abstract: There is provided a laminated inductor including: a body where a plurality of magnetic layers are laminated; a coil part formed on the magnetic layers, the coil part including a plurality of conductor patterns and a plurality of conductive vias; first and second external electrodes formed on an outer surface of the body to connect to both ends of the coil part, respectively; and a non-magnetic conductor formed on at least one of the magnetic layers so as to relax magnetic saturation caused by direct current flowing through the coil part. The laminated inductor employs the non-magnetic conductor as a non-magnetic gap to be simplified in a manufacturing process and effectively improved in DC superposition characteristics.Type: GrantFiled: August 20, 2008Date of Patent: October 19, 2010Assignee: Sumitomo Electro-Mechanics Co., Ltd.Inventors: Byoung Hwa Lee, Sung Kwon Wi, Hyeog Soo Shin, Dong Seok Park, Sang Soo Park, Min Cheol Park
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Publication number: 20090051474Abstract: There is provided a laminated inductor including: a body where a plurality of magnetic layers are laminated; a coil part formed on the magnetic layers, the coil part including a plurality of conductor patterns and a plurality of conductive vias; first and second external electrodes formed on an outer surface of the body to connect to both ends of the coil part, respectively; and a non-magnetic conductor formed on at least one of the magnetic layers so as to relax magnetic saturation caused by direct current flowing through the coil part. The laminated inductor employs the non-magnetic conductor as a non-magnetic gap to be simplified in a manufacturing process and effectively improved in DC superposition characteristics.Type: ApplicationFiled: August 20, 2008Publication date: February 26, 2009Inventors: Byoung Hwa LEE, Sung Kwon Wi, Hyeog Soo Shin, Dong Seok Park, Sang Soo Park, Min Cheol Park
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Patent number: 5775810Abstract: A ferrite device for sensing temperature is disclosed, which is useful for apparatuses such as hot water vessels, fire alarms, and general electronic apparatuses. More specifically, the ferrite device for sensing temperature is manufactured by stack-printing two or more ferrite layers having different Curie temperatures (Tc). Therefore, a mass production is possible with a low manufacturing cost, and control of the process conditions is easy. The temperature sensing ferrite device includes: upper and lower layers composed of a single ferrite material; a plurality of stacked layers stacked between the upper and lower layers and consisting of two or more ferrite subregions; each of the ferrite subregions of one of the plurality of stacked layers has a composition and a shape that are the same as a ferrite subregion in another of the plurality of stacked layers screw type electrodes provided on the respective ferrite subregions.Type: GrantFiled: August 1, 1996Date of Patent: July 7, 1998Assignee: Samsung Electric-Mechanics Co. Ltd.Inventor: Hyeog-Soo Shin