Abstract: A wafer storage container includes a shell body including a first side body and a second side body that face, an upper body connected with upper parts of the first side body and the second side body, a rear body connected with an end of one side of each of the first side body and the second side body, and a lower body connected with lower parts of the first side body and the second side body, and configured to define an internal space together with the first side body, the second side body, the upper body, and the rear body.

Abstract: A wafer container includes a base, a guide, a cover, a locking member and a sealing member. The base includes an installing surface thereon. The guide is disposed on the installing surface of the base. The guide is configured to confine a plurality of wafers horizontally stacked upon the installing surface of the base. The cover is configured to cover the installing surface. The locking member is configured to lock the cover to the base. The sealing member is configured to create an air-tight seal between the locking member and the guide.

Abstract: A wafer storage container includes a shell body including a first side body and a second side body that face, an upper body connected with upper parts of the first side body and the second side body, a rear body connected with an end of one side of each of the first side body and the second side body, and a lower body connected with lower parts of the first side body and the second side body, and configured to define an internal space together with the first side body, the second side body, the upper body, and the rear body.

Abstract: A wafer holding apparatus including a container body having a space to receive a wafer and a front opening, a door disposed at the front opening, and a first supporting part disposed on an inner wall of the door may be provided. For example, the first supporting part may include a frame coupled to the inner wall of the door, a plurality of elastic ribs protruding from the frame, a support structure coupled to the plurality of elastic ribs and defining a plurality of grooves, which is spaced apart from the door by the elastic ribs and configured to receive a peripheral portion of the wafer.

Abstract: A substrate processing apparatus for processing substrates prevents the substrates from contaminating as they are transferred. The apparatus includes a container, like a FOUP, for containing substrates, at least one processing chamber where the substrates are processed, a substrate transferring module including a substrate transfer chamber and at least one load port for supporting a container, and a contamination controlling system for the substrate transfer chamber. The contamination controlling system includes a purge gas supply inlet connected to the substrate transfer chamber, and a gas circulating tube for recycling the purging gas to circulate through the chamber. The substrate transfer chamber is purged using the purging gas to remove moisture and contaminating materials from the substrate transfer chamber. The formation of particles on the substrate otherwise caused by a reaction between the moisture and contaminating materials while the substrate is standing by in the container can be prevented.

Abstract: An improved wafer transfer apparatus is provided that allows the ambient atmosphere within a modified front open unified pod (“FOUP”) while the FOUP is positioned on a loading stage provided on an equipment front end module (“EFEM”). In particular, the wafer transfer apparatus includes both an injection assembly and an exhaust assembly that will be engaged when the door of the FOUP is docked to a door holder provided on the EFEM. The injection assembly may include a mass flow controller (“MFC”) for controlling the injection of purge gas(es) into the container. Similarly, the exhaust assembly may include a MFC for controlling the removal of fluid from the container. While the door is docked to the door holder, inert or less reactive gases may be introduced into the container, thereby reducing the likelihood of oxidation or contamination of the wafers therein.

Abstract: A substrate processing apparatus for processing substrates prevents the substrates from contaminating as they are transferred. The apparatus includes a container, like a FOUP, for containing substrates, at least one processing chamber where the substrates are processed, a substrate transferring module including a substrate transfer chamber and at least one load port for supporting a container, and a contamination controlling system for the substrate transfer chamber. The contamination controlling system includes a purge gas supply inlet connected to the substrate transfer chamber, and a gas circulating tube for recycling the purging gas to circulate through the chamber. The substrate transfer chamber is purged using the purging gas to remove moisture and contaminating materials from the substrate transfer chamber. The formation of particles on the substrate otherwise caused by a reaction between the moisture and contaminating materials while the substrate is standing by in the container can be prevented.

Abstract: A cassette table on which a wafer cassette is supported allows static electricity to be discharged from the cassette and hence, form the wafers disposed in the cassette. The cassette table includes a top plate, a cassette supporter that is mounted on the top plate and supports the cassette. At least part of the cassette supporter is made of a material that allows static electricity to be discharged to ground therethrough.

Abstract: A dustproof fabric for use in manufacturing a smock to be worn in a clean room of a semiconductor fabrication facility includes an inner layer of a knitted fabric, an intermediate layer attached to the inner layer and formed of a non-micro porous polyurethane resin film possessing a high degree of moisture absorbency, and an outer layer attached to the intermediate layer and formed of a high density polyester woven fabric containing conductive yarn in the warp and weft.

Abstract: A dust-proof fabric is disclosed. The fabric comprises an inner knit fabric layer, an intermediate layer of a moisture absorbent polyurethane film and a high density woven polyester fabric outer layer. The outer layer contains a first set of spaced apart conductive yarns aligned with one another in the warp direction and a second set of spaced apart conductive yarns aligned in the weft direction.