Patents by Inventor Hyeok Jin JEON

Hyeok Jin JEON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10840161
    Abstract: A method of manufacturing a semiconductor package substrate includes forming a trench in one surface of a base substrate formed of a conductive material, performing a first filling operation of filling the trench with resin, performing a first curing operation of semi-curing the resin filled in the first filling operation, performing a second filling operation of additionally filling resin on a semi-cured resin, performing a second curing operation of fully curing the resin, removing the resin exposed from the trench, and etching an opposite surface of the base substrate to expose at least part of the resin filling the trench.
    Type: Grant
    Filed: December 5, 2016
    Date of Patent: November 17, 2020
    Assignee: HAESUNG DS CO., LTD.
    Inventors: In Seob Bae, Hyeok Jin Jeon
  • Publication number: 20200168521
    Abstract: A method of manufacturing a semiconductor package substrate includes forming a trench in one surface of a base substrate formed of a conductive material, performing a first filling operation of filling the trench with resin, performing a first curing operation of semi-curing the resin filled in the first filling operation, performing a second filling operation of additionally filling resin on a semi-cured resin, performing a second curing operation of fully curing the resin, removing the resin exposed from the trench, and etching an opposite surface of the base substrate to expose at least part of the resin filling the trench.
    Type: Application
    Filed: December 5, 2016
    Publication date: May 28, 2020
    Inventors: In Seob BAE, Hyeok Jin JEON