Patents by Inventor Hyeok-Jin JEONG

Hyeok-Jin JEONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Printed Circuit Board and Vehicle Having the Same
    Publication number: 20210360798
    Abstract: A printed circuit board includes a rigid part including a central insulating layer for insulation, inner copper foil layers including a first conductive circuit portion, outer insulating layers for insulation, and outer copper foil layers including a second conductive circuit portion, wherein ones of the inner copper foil layers, the outer insulating layers, and the outer copper foil layers are symmetrically positioned on opposite sides of the central insulating layer and are sequentially laminated, and a flexible part formed by selectively removing a portion of the rigid part up to one side of the central insulating layer.
    Type: Application
    Filed: February 19, 2021
    Publication date: November 18, 2021
    Inventors: SeungWoo Choi, Seong-Rae Cho, Seoung-Won Kim, Hyeok-Jin Jeong
  • Semiconductor devices including capacitors and methods of manufacturing the same
    Patent number: 10879248
    Abstract: A semiconductor device includes a substrate, a conductive pattern on the substrate, a lower electrode electrically connected to the conductive pattern, a dielectric layer covering a surface of the lower electrode, a first upper electrode on the dielectric layer, a diffusion barrier on an upper surface of the first upper electrode, and a second upper electrode covering the diffusion barrier, the second upper electrode including a different material from that of the first upper electrode.
    Type: Grant
    Filed: February 21, 2019
    Date of Patent: December 29, 2020
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Hoon-Sang Choi, Hyeok-Jin Jeong, Jung-Kun Lim, Young-Mo Tak, Sung-Kil Han
  • SEMICONDUCTOR DEVICES INCLUDING CAPACITORS AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20190189615
    Abstract: A semiconductor device includes a substrate, a conductive pattern on the substrate, a lower electrode electrically connected to the conductive pattern, a dielectric layer covering a surface of the lower electrode, a first upper electrode on the dielectric layer, a diffusion barrier on an upper surface of the first upper electrode, and a second upper electrode covering the diffusion barrier, the second upper electrode including a different material from that of the first upper electrode.
    Type: Application
    Filed: February 21, 2019
    Publication date: June 20, 2019
    Inventors: Hoon-Sang CHOI, Hyeok-Jin JEONG, Jung-Kun LIM, Young-Mo TAK, Sung-Kil HAN
  • SEMICONDUCTOR DEVICES INCLUDING CAPACITORS AND METHODS OF MANUFACTURING THE SAME
    Publication number: 20170186752
    Abstract: A semiconductor device includes a substrate, a conductive pattern on the substrate, a lower electrode electrically connected to the conductive pattern, a dielectric layer covering a surface of the lower electrode, a first upper electrode on the dielectric layer, a diffusion barrier on an upper surface of the first upper electrode, and a second upper electrode covering the diffusion barrier, the second upper electrode including a different material from that of the first upper electrode.
    Type: Application
    Filed: December 23, 2016
    Publication date: June 29, 2017
    Inventors: Hoon-Sang CHOI, Hyeok-Jin JEONG, Jung-Kun LIM, Young-Mo TAK, Sung-Kil HAN