Patents by Inventor Hyeok Yong KWON

Hyeok Yong KWON has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Resin composition for encapsulating optical element
    Patent number: 9593241
    Abstract: The present invention relates to a resin composition for encapsulating an optical device and more particularly, the resin composition for encapsulating optical device of the invention comprising a polyhedral oligomeric silsesquioxane (POSS) of which the compatibility with resins is enhanced by its cross-linking ability and an organic polysilazane compound has excellent mechanical properties, and enhanced adhesive strengths to a base material and barrier properties against moisture or oxygen by having excellent solubility with siloxane resins and significantly improved outgassing phenomenon, thus being able to be applied to encapsulation process for various optical devices, especially the encapsulation process of thick films.
    Type: Grant
    Filed: February 24, 2014
    Date of Patent: March 14, 2017
    Assignee: DONGJIN SEMICHEM CO., LTD.
    Inventors: Han Bok Joo, Sun Sik Song, Hyeok Yong Kwon, Eun Ju Park, Jae Hyun Kim, Young Je Kwark, Hee Chun Eun, Hee Eun Im
  • RESIN COMPOSITION FOR ENCAPSULATING OPTICAL ELEMENT
    Publication number: 20150376407
    Abstract: The present invention relates to a resin composition for encapsulating an optical device and more particularly, the resin composition for encapsulating optical device of the invention comprising a polyhedral oligomeric silsesquioxane (POSS) of which the compatibility with resins is enhanced by its cross-linking ability and an organic polysilazane compound has excellent mechanical properties, and enhanced adhesive strengths to a base material and barrier properties against moisture or oxygen by having excellent solubility with siloxane resins and significantly improved outgassing phenomenon, thus being able to be applied to encapsulation process for various optical devices, especially the encapsulation process of thick films.
    Type: Application
    Filed: February 24, 2014
    Publication date: December 31, 2015
    Applicant: DONGJIN SEMICHEM CO., LTD.
    Inventors: Han Bok JOO, Sun Sik SONG, Hyeok Yong KWON, Eun Ju PARK, Jae Hyun KIM, Young Je KWARK, Hee Chun EUN, Hee Eun IM