Patents by Inventor Hyeon Dong SONG

Hyeon Dong SONG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240278437
    Abstract: A substrate processing apparatus includes a body which includes an upper face and side faces, and extends in a first direction, a plurality of robot arms which are installed on the upper face of the body, extend in the first direction, are spaced apart from each other in a second direction perpendicular to the upper face of the body, and are able to grip a wafer, and an alignment jig (JIG) which is installed on the upper face and side faces of the body, and senses positions of the plurality of robot arms, wherein the alignment jig includes, a horizontal frame disposed on the upper face of the body, a vertical frame disposed on the side faces of the body, and a displacement sensor installed on the horizontal frame and the vertical frame to sense coordinates of upper faces of the plurality of robot arms and side faces of the plurality of robot arms, the displacement sensor includes a first sensor and a second sensor which are spaced apart from side faces of the plurality of robot arms in a third direction perpe
    Type: Application
    Filed: January 16, 2024
    Publication date: August 22, 2024
    Inventors: Hyeon Dong SONG, Jun Young MOON, Sang Woo PARK, Un Ki JEONG, Ji Ho UH, Hyun Soo CHUN
  • Patent number: 11648644
    Abstract: A polishing pad conditioning apparatus according to an example embodiment of the present inventive concept includes an apparatus body, a pivot arm provided on the apparatus body and including a housing having an internal space and provided at a distal end portion of the pivot arm and a head unit disposed at the distal end portion of the pivot arm. The head unit includes: a rotary motor provided in the internal space of the housing, the rotary motor including a rotary shaft; a foreign material blocking member connected to the rotary shaft; a disk holder connected to the rotary shaft; and a conditioning disk coupled to the disk holder. The foreign material blocking member includes a fluid flow groove configured to guide a movement of fluid for preventing foreign objects from entering the housing on an outer surface of the foreign material blocking member.
    Type: Grant
    Filed: July 22, 2019
    Date of Patent: May 16, 2023
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun Seok Lee, Ja Eung Koo, Kuen Byul Kim, Jeong Min Na, Chang Gil Ryu, Hyeon Dong Song, Young Seok Jang, Jin Suk Hong
  • Publication number: 20200206870
    Abstract: A polishing pad conditioning apparatus according to an example embodiment of the present inventive concept includes an apparatus body, a pivot arm provided on the apparatus body and including a housing having an internal space and provided at a distal end portion of the pivot arm and a head unit disposed at the distal end portion of the pivot arm. The head unit includes: a rotary motor provided in the internal space of the housing, the rotary motor including a rotary shaft; a foreign material blocking member connected to the rotary shaft; a disk holder connected to the rotary shaft; and a conditioning disk coupled to the disk holder. The foreign material blocking member includes a fluid flow groove configured to guide a movement of fluid for preventing foreign objects from entering the housing on an outer surface of the foreign material blocking member.
    Type: Application
    Filed: July 22, 2019
    Publication date: July 2, 2020
    Applicant: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Eun Seok LEE, Ja Eung KOO, Kuen Byul KIM, Jeong Min NA, Chang Gil RYU, Hyeon Dong SONG, Young Seok JANG, Jin Suk HONG