Patents by Inventor Hyeon Gil Nam

Hyeon Gil Nam has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10567042
    Abstract: A coil module may include: a board; an input/output terminal unit formed on the board; and a coil for near field communications (NFC) disposed on one, or a plurality of, surface(s) of the board and connected to the input/output terminal unit, wherein the coil for NFC includes a first pattern portion having one end connected to the input/output terminal unit and disposed on the board to rotate or turn in one direction, a second pattern portion connected to the first pattern portion and traversing an internal area of the first pattern portion to divide the internal area of the first pattern portion into at least two portions, and a third pattern portion having one end connected to the second pattern portion and the other end connected to the input/output terminal unit.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: February 18, 2020
    Assignee: WITS Co., Ltd.
    Inventors: Dae Ung Ahn, Si Hyung Kim, Hyeon Gil Nam, Ki Won Chang, Yu Jin Lee, Dae Ki Lim
  • Patent number: 10483767
    Abstract: There are provided a thin film coil and an electronic device having the same, the thin film coil including a substrate; and a coil pattern including a first coil strand and a second coil strand formed on both surfaces of the substrate, respectively, wherein the first coil strand formed on one surface of the substrate includes at least one gyration path that passes through the other surface of the substrate and gyrates.
    Type: Grant
    Filed: September 21, 2015
    Date of Patent: November 19, 2019
    Assignee: WITS Co., Ltd.
    Inventors: Dae Ki Lim, Tae Sung Kim, Hyeon Gil Nam, Chan Gwang An, Hyun Seok Lee, Ki Won Chang, Chang Mok Han, Sang Woo Bae, Sung Eun Cho, Jae Suk Sung
  • Patent number: 10218061
    Abstract: A wireless communications antenna includes a first coil including first conductive patterns disposed on a first layer along a first axis and a second coil including second conductive patterns disposed on a second layer along a second axis having a direction different from a direction of the first axis.
    Type: Grant
    Filed: November 20, 2017
    Date of Patent: February 26, 2019
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Heon Lee, Hyeon Gil Nam, Choon Hee Kim, Hyun Do Park, Dae Seong Jeon, Nam Ki Kim
  • Patent number: 10122183
    Abstract: There are provided a thin film coil and an electronic device having the same, the thin film coil including a substrate; and a coil pattern including a first coil strand and a second coil strand formed on both surfaces of the substrate, respectively, wherein the first coil strand formed on one surface of the substrate includes at least one gyration path that passes through the other surface of the substrate and gyrates.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: November 6, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dae Ki Lim, Tae Sung Kim, Hyeon Gil Nam, Chan Gwang An, Hyun Seok Lee, Ki Won Chang, Chang Mok Han, Sang Woo Bae, Sung Eun Cho, Jae Suk Sung
  • Publication number: 20180301794
    Abstract: A wireless communications antenna includes a first coil including first conductive patterns disposed on a first layer along a first axis and a second coil including second conductive patterns disposed on a second layer along a second axis having a direction different from a direction of the first axis.
    Type: Application
    Filed: November 20, 2017
    Publication date: October 18, 2018
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Tae Heon LEE, Hyeon Gil NAM, Choon Hee KIM, Hyun Do PARK, Dae Seong JEON, Nam Ki KIM
  • Patent number: 10103554
    Abstract: There are provided a thin film coil and an electronic device having the same, the thin film coil including a substrate; and a coil pattern including a first coil strand and a second coil strand formed on both surfaces of the substrate, respectively, wherein the first coil strand formed on one surface of the substrate includes at least one gyration path that passes through the other surface of the substrate and gyrates.
    Type: Grant
    Filed: July 19, 2017
    Date of Patent: October 16, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dae Ki Lim, Tae Sung Kim, Hyeon Gil Nam, Chan Gwang An, Hyun Seok Lee, Ki Won Chang, Chang Mok Han, Sang Woo Bae, Sung Eun Cho, Jae Suk Sung
  • Patent number: 10014588
    Abstract: A near-field antenna apparatus including an antenna element around which a coil is wound configured to create a magnetic field; and a conductive material member, disposed in a path of the magnetic field, configured to generate an eddy current from a magnetic flux in a predetermined region.
    Type: Grant
    Filed: December 1, 2015
    Date of Patent: July 3, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jeong Ki Ryoo, Ju Hyoung Park, Hyeon Gil Nam, Jong Lae Kim, Dae Seong Jeon
  • Publication number: 20180159598
    Abstract: A coil module may include: a board; an input/output terminal unit formed on the board; and a coil for near field communications (NFC) disposed on one, or a plurality of, surface(s) of the board and connected to the input/output terminal unit, wherein the coil for NFC includes a first pattern portion having one end connected to the input/output terminal unit and disposed on the board to rotate or turn in one direction, a second pattern portion connected to the first pattern portion and traversing an internal area of the first pattern portion to divide the internal area of the first pattern portion into at least two portions, and a third pattern portion having one end connected to the second pattern portion and the other end connected to the input/output terminal unit.
    Type: Application
    Filed: November 8, 2017
    Publication date: June 7, 2018
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dae Ung AHN, Si Hyung KIM, Hyeon Gil NAM, Ki Won CHANG, Yu Jin LEE, Dae Ki LIM
  • Patent number: 9882268
    Abstract: A radiator frame having an antenna radiator formed on a surface thereof and a method of manufacturing the same are provided. The radiator frame includes: a radiator including an antenna pattern portion configured to transmit or receive a signal, and a connection terminal portion configured to electrically connect the antenna pattern portion and a circuit board; and a molding frame connected to the radiator such that the antenna pattern portion is exposed at one surface of the molding frame and the connection terminal portion is exposed at another surface of the molding frame opposing the one surface of the molding frame. The connection terminal portion may include a plated layer exposed at the other surface of the molding frame to contact the circuit board.
    Type: Grant
    Filed: August 19, 2015
    Date of Patent: January 30, 2018
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Jun Seung Yi, Ye Ji Park, Sun Hee Lee, Hyeon Gil Nam, Nam Ki Kim, Su Hyun Kim, Ha Ryong Hong, Sung Eun Cho, Dae Seong Jeon, Ho Jin Lee
  • Publication number: 20170317506
    Abstract: There are provided a thin film coil and an electronic device having the same, the thin film coil including a substrate; and a coil pattern including a first coil strand and a second coil strand formed on both surfaces of the substrate, respectively, wherein the first coil strand formed on one surface of the substrate includes at least one gyration path that passes through the other surface of the substrate and gyrates.
    Type: Application
    Filed: July 19, 2017
    Publication date: November 2, 2017
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dae Ki LIM, Tae Sung KIM, Hyeon Gil NAM, Chan Gwang AN, Hyun Seok LEE, Ki Won CHANG, Chang Mok HAN, Sang Woo BAE, Sung Eun CHO, Jae Suk SUNG
  • Publication number: 20170317505
    Abstract: There are provided a thin film coil and an electronic device having the same, the thin film coil including a substrate; and a coil pattern including a first coil strand and a second coil strand formed on both surfaces of the substrate, respectively, wherein the first coil strand formed on one surface of the substrate includes at least one gyration path that passes through the other surface of the substrate and gyrates.
    Type: Application
    Filed: July 19, 2017
    Publication date: November 2, 2017
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Dae Ki LIM, Tae Sung KIM, Hyeon Gil NAM, Chan Gwang AN, Hyun Seok LEE, Ki Won CHANG, Chang Mok HAN, Sang Woo BAE, Sung Eun CHO, Jae Suk SUNG
  • Patent number: 9673513
    Abstract: A radiator frame includes: a main radiator including an antenna pattern part configured to transmit or receive a signal, an internal terminal part provided on one end of the antenna pattern part and configured to electrically connect the antenna pattern part and a circuit substrate, and an external terminal part provided on another end of the antenna pattern part and configured to be connected to an auxiliary radiator to improve radiation performance of the antenna pattern part; and a molded frame molded around the radiator, the molded frame allowing the internal terminal part to be exposed at a first surface of the molded frame, and allowing the external terminal part to be exposed at a second surface of the molded frame.
    Type: Grant
    Filed: August 24, 2015
    Date of Patent: June 6, 2017
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Ha Ryong Hong, Sun Hee Lee, Chan Gwang An, Dae Ki Lim, Hyeon Gil Nam, Sung Eun Cho, Dae Kyu Lee, Dae Seong Jeon, Hyun Do Park
  • Publication number: 20160329626
    Abstract: A radiator frame includes a molded frame; a connection terminal extending from one surface of the molded frame and through another surface thereof; an extension frame substantially surrounding the molded frame; and an antenna pattern extending from the one surface of the molded frame to one surface of the extension frame and electrically connected to the connection terminal.
    Type: Application
    Filed: February 10, 2016
    Publication date: November 10, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dae Seong JEON, Hyun Sam MUN, Sung Eun CHO, Hyeon Gil NAM
  • Publication number: 20160261027
    Abstract: Disclosed is a radiator frame and a method of manufacturing the radiator frame. The radiator frame includes a radiator comprising an antenna pattern configured to transmit or receive a signal and a terminal connection configured to electrically connect the antenna pattern to a circuit board, and a molding frame configured to embed the radiator, wherein the antenna pattern is embedded in a first surface of the molding frame, and the terminal connection is exposed to a second surface of the molding frame.
    Type: Application
    Filed: December 17, 2015
    Publication date: September 8, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Hyun Do PARK, Ye Ji PARK, Jun Seung YI, Chan Gwang AN, Hyeon Gil NAM, Ha Ryong HONG, Sung Eun CHO, Dae Kyu LEE, Dae Seong JEON, Dae Ki LIM
  • Publication number: 20160240915
    Abstract: An in-mold antenna include a first antenna pattern having a first surface and a second surface, interposed between the first and second surface, a second antenna pattern that is attached to the first surface of the first antenna pattern and through which current passes from the first antenna pattern, and a cut section provided by cutting the first antenna pattern at the second surface. By controlling the shape of the cut section, it is possible to affect resonance characteristics of the antenna, and a corresponding apparatus and method do so.
    Type: Application
    Filed: December 15, 2015
    Publication date: August 18, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Hyeon Gil NAM, Dae Seong JEON, Hyun Sam MUN
  • Publication number: 20160164188
    Abstract: A near-field antenna apparatus including an antenna element around which a coil is wound configured to create a magnetic field; and a conductive material member, disposed in a path of the magnetic field, configured to generate an eddy current from a magnetic flux in a predetermined region.
    Type: Application
    Filed: December 1, 2015
    Publication date: June 9, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jeong Ki RYOO, Ju Hyoung PARK, Hyeon Gil NAM, Jong Lae KIM, Dae Seong JEON
  • Patent number: 9355766
    Abstract: There are provided a coil for cordless charging, which may be formed as a thin coil in spite of the presence of a plurality of coils included therein, and a cordless charging apparatus using the same. The cordless charging apparatus includes: a coil unit including coil substrates having a coil pattern and a connection substrate having one end interposed between the coil substrates and electrically connected to the coil pattern and the other end electrically connected to the outside; and a case accommodating the coil unit therein.
    Type: Grant
    Filed: March 11, 2013
    Date of Patent: May 31, 2016
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Chang Mok Han, Hyeon Gil Nam, Jae Suk Sung, Hyung Wook Cho, Ki Won Chang, Sung Heum Park, Sung Eun Cho, Dae Seong Jeon
  • Publication number: 20160134011
    Abstract: An antenna module includes: a circuit board including a connector; a metal frame including an antenna pattern part configured to transmit or receive a signal, and a connection terminal part electrically connecting the antenna pattern part and the circuit board to each other; and a molding frame disposed around the metal frame such that the connection terminal part is exposed to one surface of the molding frame, wherein the connector is disposed between the metal frame and the circuit board.
    Type: Application
    Filed: October 19, 2015
    Publication date: May 12, 2016
    Applicant: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Nam Ki KIM, Chan Gwang AN, Dae Ki LIM, Hyeon Gil NAM, Sang Woo BAE, Ha Ryong HONG, Sung Eun CHO, Dae Kyu LEE, Dae Seong JEON, Hyun Do PARK
  • Publication number: 20160056529
    Abstract: A radiator frame having an antenna radiator formed on a surface thereof and a method of manufacturing the same are provided. The radiator frame includes: a radiator including an antenna pattern portion configured to transmit or receive a signal, and a connection terminal portion configured to electrically connect the antenna pattern portion and a circuit board; and a molding frame connected to the radiator such that the antenna pattern portion is exposed at one surface of the molding frame and the connection terminal portion is exposed at another surface of the molding frame opposing the one surface of the molding frame. The connection terminal portion may include a plated layer exposed at the other surface of the molding frame to contact the circuit board.
    Type: Application
    Filed: August 19, 2015
    Publication date: February 25, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Jun Seung YI, Ye Ji PARK, Sun Hee LEE, Hyeon Gil NAM, Nam Ki KIM, Su Hyun KIM, Ha Ryong HONG, Sung Eun CHO, Dae Seong JEON, Ho Jin LEE
  • Publication number: 20160056532
    Abstract: A radiator frame includes: a main radiator including an antenna pattern part configured to transmit or receive a signal, an internal terminal part provided on one end of the antenna pattern part and configured to electrically connect the antenna pattern part and a circuit substrate, and an external terminal part provided on another end of the antenna pattern part and configured to be connected to an auxiliary radiator to improve radiation performance of the antenna pattern part; and a molded frame molded around the radiator, the molded frame allowing the internal terminal part to be exposed at a first surface of the molded frame, and allowing the external terminal part to be exposed at a second surface of the molded frame.
    Type: Application
    Filed: August 24, 2015
    Publication date: February 25, 2016
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Ha Ryong HONG, Sun Hee LEE, Chan Gwang AN, Dae Ki LIM, Hyeon Gil NAM, Sung Eun CHO, Dae Kyu LEE, Dae Seong JEON, Hyun Do PARK