Patents by Inventor Hyeon-Hwa Lee

Hyeon-Hwa Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Three-dimensional reconfigurable machining system
    Patent number: 8899890
    Abstract: Disclosed is a 3D reconfigurable machining system including a support frame spaced apart from the ground, a circular pivoting frame pivotably installed at the support frame, a slide member slidably installed on the circumferential portion of the pivoting frame, and a main spindle installed vertically at the slide member and being rotatable along the pivoting frame, so that a workpiece can be three-dimensionally machined with a considerably simple structure.
    Type: Grant
    Filed: May 12, 2011
    Date of Patent: December 2, 2014
    Assignee: Korea Institute of Machinery & Materials
    Inventors: Jong-Kweon Park, Seung-Kook Ro, Byung-Sub Kim, Gyung-Ho Khim, Sung-Cheul Lee, Hyeon-Hwa Lee, Byung-In Kim
  • THREE-DIMENSIONAL RECONFIGURABLE MACHINING SYSTEM
    Publication number: 20110280680
    Abstract: Disclosed is a 3D reconfigurable machining system including a support frame spaced apart from the ground, a circular pivoting frame pivotably installed at the support frame, a slide member slidably installed on the circumferential portion of the pivoting frame, and a main spindle installed vertically at the slide member and being rotatable along the pivoting frame, so that a workpiece can be three-dimensionally machined with a considerably simple structure.
    Type: Application
    Filed: May 12, 2011
    Publication date: November 17, 2011
    Inventors: Jong-Kweon Park, Seung-Kook Ro, Byung-Sub Kim, Gyung-Ho Khim, Sung-Cheul Lee, Hyeon-Hwa Lee, Byung-In Kim