Abstract: A semiconductor package includes a substrate having first and second sides, pads disposed on the substrate and including first and second bonding pads adjacent to the first and second sides, respectively, and upper pads between the first and second bonding pads, a passivation layer disposed on the substrate and exposing the first and second bonding pads, a solder resist layer disposed on the passivation layer, a first chip structure on the solder resist layer, adjacent to the first side and electrically connected to the first bonding pads, a second chip structure on the solder resist layer, adjacent to the second side and electrically connected to the second bonding pads, a controller on the solder resist layer between the first and the second chip structure, and a connection structure penetrating the passivation layer and the solder resist layer and electrically connecting the controller and the upper pads.

Abstract: A carbon dioxide separation and recovery system includes an exhaust gas sensible heat recovery part which recovers sensible heat of exhaust gas and generates electric energy by using the sensible heat of the recovered exhaust gas; a moisture removal part which is connected to the exhaust gas sensible heat recovery part and removes moisture contained in the sensible heat recovery exhaust gas from which the sensible heat is recovered by using the electric energy generated in the exhaust gas sensible heat recovery part; and a separation part which is connected to the moisture removal part to receive the sensible heat recovery exhaust gas from which moisture is removed by the moisture removal part, and separates solid carbon dioxide from the sensible heat recovery exhaust gas from which moisture is removed.

Abstract: A method of marking a semiconductor package includes preparing a semiconductor package including a semiconductor chip and a package molding layer surrounding semiconductor chip, attaching a dry film to a top surface of the package molding layer, the dry film being attached to a carrier substrate, forming an ink spot by liquefying a portion of the dry film by radiating laser light to the carrier substrate, forming an ink marking pattern by solidifying the ink spot corresponding to the liquefied portion of the dry film, and removing a remaining portion of the dry film from the top surface of the package molding layer, the remaining portion of the dry film having not been liquefied, wherein the ink marking pattern includes information about storage capacity or information for identifying a producer of a product.

Abstract: A ball attach tool may include a housing a valve module. The housing may include a plurality of pick-up holes configured to pick up balls when a reduced pressure is applied thereto. The valve module may control a reduced pressure applied to the pick-up holes.

Abstract: One embodiment of the present disclosure provides an extracellular matrix-based hybrid ink for 3D printing, the hybrid ink including an extracellular matrix having an amine group and a modified hyaluronic acid introduced with an ethylenically unsaturated bond functional group, in which the extracellular matrix and the modified hyaluronic acid are in a crosslinked state by a chemical bond formed between at least some of amine groups present in the extracellular matrix and the ethylenically unsaturated bond functional group present in the modified hyaluronic acid. According to an embodiment of the present disclosure, the hybrid ink has mechanical properties suitable for 3D printing through chemical crosslinking between the extracellular matrix and modified hyaluronic acid as constituents, and can control the drug release rate by adjusting the chemical crosslinking density.

Abstract: A chuck table includes a support part receiving a package substrate. The package substrate includes a package area having semiconductor packages arranged thereon and a scrap area surrounding the package area. A package pad part is between the support part and the package substrate and directly contacts the package area. A scrap pad part is disposed between the support part and the package substrate and directly contacts the scrap area. A vacuum pipe extends through the package pad part and extends into the support part. The vacuum pipe has vacuum pressure applied thereto and has the vacuum pressure released therefrom. A fixing device is connected to the vacuum pipe. The fixing device moves closer to an upper surface of the scrap area as the vacuum pressure is applied to the vacuum pipe, and moves away from the upper surface of the scrap area as the vacuum pressure is released.

Abstract: A semiconductor package includes a substrate, a first semiconductor chip on the substrate, a heat-dissipating structure on the first semiconductor chip, an adhesive layer between the first semiconductor chip and the heat-dissipating structure, a second semiconductor chip on the heat-dissipating structure, a molding film on the substrate and covering at least portions of the first semiconductor chip, the heat-dissipating structure, and the second semiconductor chip, and a shield layer on an upper surface and sidewalls of the molding film, wherein the shield layer includes a first portion extending into a first hole and contacting an upper surface of the first semiconductor chip, and the first hole may penetrate the molding film, the heat-dissipating structure, and the adhesive layer.

Abstract: Provided is an insulator ring assembly and a substrate processing apparatus, and more particularly an insulator ring assembly and a substrate processing apparatus, for reducing a deviation of an extinction coefficient K between an edge and a central part of a substrate when a process is performed on the substrate.

Abstract: Provided is an optical integrated circuit device. The device includes a substrate, a buffer layer provided on the substrate, an optical waveguide layer provided on the buffer layer and including a signal waveguide and a resonant waveguide adjacent to an input terminal and output terminal of the signal waveguide, and a plurality of signal electrodes provided on one side of the resonant waveguide and on the optical waveguide layer of both sides of the signal waveguide.

Abstract: The present invention relates to polymer nanodiscs comprising a lipid bilayer and an amphiphilic polymer, and to a pharmaceutical composition comprising the polymer nanodiscs. The polymer nanodiscs of the present invention, comprising the lipid bilayer and the amphiphilic polymer, exhibit an antivirus effect when used, and thus may be used for preventing or treating virus infections.

Abstract: The present invention relates to a method of preparing a vanadium electrolyte solution and a battery including the vanadium electrolyte solution. According to the present invention, the present invention has an effect of providing a method of preparing a vanadium electrolyte solution that allows control of the reduction reaction rate of a vanadium compound, provides an effect of omitting separation and recovery processes by not generating by-products, and provides reproducibility of a single manufacturing process and a battery including the vanadium electrolyte solution.

Abstract: Disclosed herein are an adhesive protective film, an optical member including the same, and an optical display including the same. An adhesive protective film is formed of a composition including a (meth)acrylic binder derived from a monomer mixture including: an alkyl group-containing (meth)acrylic monomer; and at least one selected from among a hydroxyl group-containing (meth)acrylic monomer, a carboxyl group-containing (meth)acrylic monomer, and a polysiloxane (meth)acrylate, the adhesive protective film having an initial peel strength of about 100 gf/inch or less and a peel strength decrease rate of about 50% or less, as calculated according to Equation 1.

Abstract: An apparatus for predicting performance of a wheel in a vehicle: includes a learning device that generates a latent space for a plurality of two-dimensional (2D) wheel images based on a convolutional autoencoder (CAE), extracts a predetermined number of the plurality of 2D wheel images from the latent space, and learns a dataset having the plurality of 2D wheel images and performance values corresponding to the plurality of 2D wheel images; and a controller that predicts performance for the plurality of 2D wheel images based on a performance prediction model obtained by the learning device.

Abstract: A semiconductor package includes a package substrate; a plurality of lower chip structures on the package substrate; an upper chip structure on the plurality of lower chip structures and covering portions of upper surfaces of the plurality of lower chip structures; a non-conductive adhesive layer on a lower surface of the upper chip structure and receiving upper portions of the plurality of lower chip structures; and a molded member on the plurality of lower chip structures and the upper chip structure.

Abstract: Provided are an adhesive film and an optical member comprising same, the adhesive film comprising at least two types of (meth)acrylic monomers for a (meth)acrylic prepolymer, and (meth)acrylate containing silicon, wherein the release force of the adhesive film with respect to a polyimide film is approximately 0.5 gf/in to 5 gf/in.

Abstract: The present invention relates to a method for etching lithium niobate, the method including a process of etching lithium niobate using a mask pattern as a physical dry etching method using Ar plasma produced in a chamber through Ar gas, wherein in the process of etching lithium niobate, a process pressure of the chamber is maintained at 1 mTorr to 20 mTorr, and a method for forming a lithium niobate pattern using the same.

Abstract: Disclosed is an unmanned robot for water quality management. An unmanned robot for water quality management according to the present disclosure includes a traveling unit provided with a pair of caterpillar treads mounted on both side surfaces of a body and including floating bodies having their own buoyancy, a drive motor that drives the traveling unit, a water quality measurement sensor that measures water quality of a water surface on which the unmanned robot for water quality management is operated, and a processor that controls the traveling unit so that the unmanned robot travels on the water surface to collect water quality data measured by the water quality measurement sensor.

Abstract: An adhesive film, an optical member including the same, and an optical display apparatus including the same are provided. An adhesive film is formed of an adhesive composition including a (meth)acrylic copolymer, a curing agent, a mono- or higher functional monomer, a light-to-heat conversion material, and an initiator, and has a peel strength increase rate of 5.0 or more, as calculated according to Equation 1 herein.

Abstract: The disclosure provides a portable terminal including an electronic device and a case disposed thereon that provides water resistant, dust resistant, and insulation for the electronic device by proper positioning of an aperture of the electronic device that uses an area of the case as an antenna. The case includes a body part that comprises a main body with a metallic portion formed of a metallic material, and an auxiliary body disposed adjacent to the metallic portion, and at least a portion of the auxiliary body is used as an antenna for transmission and reception of signals. An insulation member is disposed between the at least a portion of the auxiliary body and the main body, and a bonding layer is disposed in at least one of an area between the insulation member and at least one area of the main body, or between the insulation member and the auxiliary body.

Abstract: The disclosure provides a portable terminal including an electronic device and a case disposed thereon that provides water resistant, dust resistant, and insulation for the electronic device by proper positioning of an aperture of the electronic device that uses an area of the case as an antenna. The case includes a body part that comprises a main body with a metallic portion formed of a metallic material, and an auxiliary body disposed adjacent to the metallic portion, and at least a portion of the auxiliary body is used as an antenna for transmission and reception of signals. An insulation member is disposed between the at least a portion of the auxiliary body and the main body, and a bonding layer is disposed in at least one of an area between the insulation member and at least one area of the main body, or between the insulation member and the auxiliary body.