Abstract: A method of providing a video stream based on machine learning in an electronic device according to various example embodiments may include receiving a source video stream which is streamed from a first device to at least one other device, confirming whether an event is detected on the source video stream using a learning model trained through machine learning on the basis of at least one frame of the source video stream, and determining whether to restrict streaming of the source video stream from the first device on the basis of the event detection. In addition to the method, other example embodiments are possible.

Abstract: According to a preferred embodiment of the present disclosure, a project management device includes: a division unit configured to divide a project into n construction work packages (CWPs) based on a construction type constituting the project, a minimum unit area for managing the project, and design information; and a display unit configured to classify the n CWPs according to construction statuses and work front statuses and display the n CWPs in a grid form.

Abstract: Provided is a method for areal selective forming of a thin film according to an exemplary embodiment of the present disclosure including: a substrate preparation step of supplying and stabilizing a substrate including a growth area and a non-growth area into a chamber; a precursor supply step of supplying a metal precursor compound into the chamber and adsorbing the metal precursor compound to the substrate; a purge step of purging the inside of the chamber; and a thin film formation step of supplying a reaction material into the chamber to react with the metal precursor compound and form a thin film, in which the metal precursor compound is a Group 5 metal precursor compound represented by Chemical Formula 1 below:

Abstract: Disclosed are an improved guide device capable of being easily replaced for damage, and a detector having the same. The guide device includes a first plate configured to have a plurality of grooves disposed in one surface thereof; and a second plate configured to be in contact with the first plate, wherein the second plate is in contact with the first plate to separate a plurality of channels, wherein the first plate is configured so that the plurality of microdroplets pass through any one of the plurality of channels, the fluid passes through channels facing each other among the plurality of flow channels, and the microdroplets are regularly spaced apart by the fluid that is discharged from the channels facing each other.

Abstract: A lead frame and a semiconductor package using the lead frame are disclosed in which one lead frame can be used to perform the package process regardless of the size of a chip. The size of the chip can be varied within the limit that the number of bonding pads of the chip does not exceed the number of corresponding inner leads. The lead frame includes a plurality of tie bars extended toward the center from edges of a lead frame body, a die pad supported by the tie bars on which a semiconductor chip can be bonded and a plurality of inner leads disposed around the die pad. The tie bars, the die pad and the inner leads are preferably in the same plane. The inner leads are electrically coupled with bonding pads of the chip. A plurality of outer leads respectively coupled with the inner leads and exposed outside a molded package.