Patents by Inventor Hyeon Jeong

Hyeon Jeong has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240243399
    Abstract: Provided is a fabrication method of a battery module case accommodating a battery cell, the method including: operation (a) of inputting a first base material member and a second base material member included in the case which accommodates the battery cell therein; operation (b) of performing a surface treatment by emitting a laser to a surface region including a joining region formed by contacting the first base material member and the second base material member with each other; and operation (c) of forming a weld joint by emitting the laser to the joining region, thus increasing a recognition rate in operating an auto position alignment (APA) function regardless of a surface condition of the base material of the battery module case.
    Type: Application
    Filed: January 15, 2024
    Publication date: July 18, 2024
    Inventors: Hoemin CHEONG, Hyeong Won KIM, Sung Chel YOON, Ki Dong LEE, Ji Hun KIM, Hyeon Jeong YOU
  • Publication number: 20240230895
    Abstract: An apparatus for determining integrity of a sensor includes a signal transmission unit configured to sequentially operate each of a plurality of ultrasonic sensors mounted on a vehicle to generate respective output signals. The apparatus also includes a signal sensing unit configured to acquire a received value of an adjacent ultrasonic sensor adjacent to each of the plurality of ultrasonic sensors which generate the respective output signals. The apparatus further includes an anomaly determining unit configured to determine whether the received value is abnormal. The apparatus additionally includes a determination-result processing unit configured to perform a response for each of the ultrasonic sensors according to a result of determining anomaly.
    Type: Application
    Filed: October 30, 2023
    Publication date: July 11, 2024
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Chan Mi Seo, Hyeon Jeong Jeon, Seung Hoon Jeon, Dong Hyuk Kim
  • Publication number: 20240219291
    Abstract: The present technology relates to an adhesion strength measurement system for a wet electrode specimen that can evaluate the adhesion strength of an electrode specimen impregnated with an electrolyte solution, and an adhesion strength measurement method for a wet electrode specimen using the same. The adhesion strength measurement system includes: a test substrate; an electrode specimen attached to the test substrate; a fixing jig configured to fix the test substrate so that the electrode specimen attached to the test substrate is immersed in an electrolyte solution; and an adhesion strength measurement unit configured to measure a force at which a mixture layer of the electrode specimen is peeled off by applying a tensile force to the gripped electrode specimen, the adhesion strength measurement unit including a grip part configured to grip one region of the electrode specimen.
    Type: Application
    Filed: March 15, 2022
    Publication date: July 4, 2024
    Applicant: LG ENERGY SOLUTION, LTD.
    Inventors: Hye Jin SIM, Woo Ha KIM, Sung Soo YOON, Je Gwon LEE, Ji Hee YOON, Joo Yong PARK, Hyeon Jeong KANG, Young Seok KIM
  • Publication number: 20240221142
    Abstract: An apparatus for predicting weld quality includes an image sensor acquiring an image of a welding portion of a workpiece, a storage storing a shape detection model, a depth prediction model and a strength prediction model, and a controller configured to acquire shapes of a melt pool and a keyhole by receiving the image and inputting the image to the shape detection model, acquire a penetration depth of the keyhole by inputting the shapes of the melt pool and the keyhole to the depth prediction model, and acquire a tensile strength by inputting one of the shape of the melt pool, the shape of the keyhole and the shapes of the melt pool and the keyhole and the penetration depth of the keyhole to the strength prediction model. The weld quality of all products may be predicted during a welding process.
    Type: Application
    Filed: December 14, 2023
    Publication date: July 4, 2024
    Inventors: Hyeong Won KIM, Jae Hun KIM, Hyeon Jeong YOU, Ki Dong LEE
  • Publication number: 20240198633
    Abstract: Provided is a steel sheet for a hot press formed member having excellent painting adhesion and post-painting corrosion resistance, and a method for manufacturing the same. A steel sheet for hot press forming according to one aspect of the present invention comprises a base steel sheet and a plated layer formed on a surface of the base steel sheet, wherein the ratio of an area occupied by pores to the entire area of a surface layer portion may be 10% or more in a cross section of the surface layer portion observed when the plated layer is cut in a thickness direction thereof.
    Type: Application
    Filed: February 23, 2024
    Publication date: June 20, 2024
    Applicant: POSCO CO., LTD
    Inventors: Jin-Keun OH, Seong-Woo KIM, Hyeon-Jeong SHIN, A-Ra CHO
  • Publication number: 20240203854
    Abstract: A semiconductor package an interposer disposed on a substrate, a recess recessed from an upper surface of the interposer, a connection structure disposed inside the recess, a first post disposed on the upper surface of the interposer and electrically connected to the interposer, a second post disposed on an upper surface of the connection structure and electrically connected to the connection structure, a first lower semiconductor chip disposed between the first and second posts and disposed on the upper surface of the interposer and the upper surface of the connection structure. The first lower semiconductor chip is electrically connected to the second post through the connection structure, and a first upper semiconductor chip is disposed on an upper surface of the first lower semiconductor chip. The first upper semiconductor chip is electrically connected to the first lower semiconductor chip through the second post and the connection structure.
    Type: Application
    Filed: July 31, 2023
    Publication date: June 20, 2024
    Inventors: Hyeon Jeong HWANG, Geun Woo KIM
  • Publication number: 20240190810
    Abstract: A novel compound for a capping layer, and an organic light-emitting device containing the same are disclosed.
    Type: Application
    Filed: December 29, 2023
    Publication date: June 13, 2024
    Inventors: Ho Wan HAM, Hyun Cheol AN, Hee Joo KIM, Dong Jun KIM, Jeong Woo HAN, Hyung Jin LEE, Ja Eun ANN, Dong Yuel KWON, Ill Hun CHO, Bo Ra LEE, Yeong Rong PARK, Il Soo OH, Dae Woong LEE, Hyeon Jeong IM
  • Publication number: 20240190811
    Abstract: A novel compound for a capping layer, and an organic light-emitting device containing the same are disclosed.
    Type: Application
    Filed: December 29, 2023
    Publication date: June 13, 2024
    Inventors: Ho Wan HAM, Hyun Cheol AN, Byung Cheol MIN, Hee Joo KIM, Dong Jun KIM, Hyung Jin LEE, Ja Eun ANN, Dong Yuel KWON, Yeong Rong PARK, Dae Woong LEE, Il Soo OH, Bo Ra LEE, Hyeon Jeong IM, Ill Hun CHO
  • Publication number: 20240191329
    Abstract: Provided is an Al—Fe-alloy plated steel sheet for hot forming, having excellent TWB welding characteristics since excellent hardness uniformity of a TWB weld zone after hot forming is obtained by suitably controlling a batch annealing condition, after plating Al, such that an Al—Fe-alloy layer is formed; a hot forming member; and manufacturing methods therefor.
    Type: Application
    Filed: February 16, 2024
    Publication date: June 13, 2024
    Applicant: POSCO CO., LTD
    Inventors: Seong-Woo KIM, Jin-Keun OH, Yeol-Rae CHO, Hyeon-Jeong SHIN
  • Patent number: 12007669
    Abstract: A camera module includes a housing accommodating a lens module, a driving unit including a magnet disposed on the lens module and a coil disposed to face the magnet, a yoke generating attractive force with the magnet, a first ball member accommodated in a first receiving space disposed between the lens module and the housing, and pressed by the attractive force, and a second ball member accommodated in a second receiving space disposed between the lens module and the housing, and pressed by the attractive force. A length of the first receiving space in an optical axis direction is different from a length of the second receiving space in the optical axis direction.
    Type: Grant
    Filed: June 26, 2023
    Date of Patent: June 11, 2024
    Assignee: Samsung Electro-Mechanics Co., Ltd.
    Inventors: Seung Hyeon Jeong, Nam Ki Park, Yeun Ho Jung, Young Bok Yoon, Sung Hoon Kim, Yoo Chang Kim, Jae Hyuk Kim
  • Publication number: 20240158338
    Abstract: A novel compound for a capping layer, and an organic light-emitting device containing the same are disclosed.
    Type: Application
    Filed: December 29, 2023
    Publication date: May 16, 2024
    Inventors: Ho Wan HAM, Hyun Cheol AN, Hee Joo KIM, Dong Jun KIM, Ja Eun ANN, Dong Yuel KWON, Sung Kyu LEE, Hwan Il JE, Bo Ra LEE, Yeong Rong PARK, Il Soo OH, Dae Woong LEE, Hyeon Jeong IM, Ill Hun CHO
  • Publication number: 20240164138
    Abstract: A novel compound for a capping layer, and an organic light-emitting device containing the same are disclosed.
    Type: Application
    Filed: December 29, 2023
    Publication date: May 16, 2024
    Inventors: Ho Wan HAM, Hyun Cheol AN, Hee Joo KIM, Dong Jun KIM, Ja Eun ANN, Dong Yuel KWON, Sung Kyu LEE, Tae Jin LEE, Bo Ra LEE, Yeong Rong PARK, Il Soo OH, Dae Woong LEE, Hyeon Jeong IM, Ill Hun CHO
  • Patent number: 11970579
    Abstract: Provided are a polyamic acid resin derived from an aromatic diamine, an aromatic dianhydride, a cycloaliphatic dianhydride and an aromatic diacid dichloride, and a polyamideimide film including polyamideimide derived from an aromatic diamine, an aromatic dianhydride, a cycloaliphatic dianhydride and an aromatic diacid dichloride.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: April 30, 2024
    Assignees: SK Innovation Co., Ltd., SK Geo Centric Co., Ltd., SK ie technology Co., Ltd.
    Inventors: Hyeon Jeong Kim, Sang Yoon Park, Tae Sug Jang, Jin Hyung Park
  • Publication number: 20240126396
    Abstract: An electronic apparatus includes an electronic panel including a plurality of sensing groups spaced apart from each other, and an electronic module overlapping with the electronic panel in a plan view. Each of the sensing groups includes a first sensing electrode extending in a second direction, and second sensing electrodes spaced apart from each other in the second direction, located on the same layer as the first sensing electrode, and face the first sensing electrode in a first direction. An opening overlapping with the electronic module and penetrating a first sensing group of the sensing groups is defined in the electronic panel, and at least one selected from the first sensing electrode and the second sensing electrodes of the first sensing group extends along an edge of the opening.
    Type: Application
    Filed: December 11, 2023
    Publication date: April 18, 2024
    Inventors: Joo-Hyeon JEONG, Taejoon KIM, Hyun-Wook CHO, Jaewoo CHOI
  • Patent number: 11960159
    Abstract: Provided are a polyamideimide film, a window cover film, and a display panel including the same. More specifically, a polyamideimide film including an amideimide structure derived from a dianhydride, a diamine, and an aromatic diacid dichloride is provided, wherein a chlorine content in the film is 5 to 33 ppm and a yellow index change amount ?YI is 5 or less, the yellow index change amount being measured in accordance with ASTM E313 after repeating a process of irradiating 0.55 W/m2 of UVA at 340 nm at 40° C. for 20 hours and then blocking UVA for 4 hours three times.
    Type: Grant
    Filed: April 19, 2021
    Date of Patent: April 16, 2024
    Assignees: SK Innovation Co., Ltd., SK ie technology Co., Ltd.
    Inventors: Hyeon Jeong Kim, Hye Ri Kim, Se Rah Moon, Sang Yoon Park, Hyo Shin Kwak
  • Patent number: 11939651
    Abstract: Provided is an Al—Fe-alloy plated steel sheet for hot forming, having excellent TWB welding characteristics since excellent hardness uniformity of a TWB weld zone after hot forming is obtained by suitably controlling a batch annealing condition, after plating Al, such that an Al—Fe-alloy layer is formed; a hot forming member; and manufacturing methods therefor.
    Type: Grant
    Filed: May 31, 2018
    Date of Patent: March 26, 2024
    Assignee: POSCO CO., LTD
    Inventors: Seong-Woo Kim, Jin-Keun Oh, Yeol-Rae Cho, Hyeon-Jeong Shin
  • Patent number: D1025167
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: April 30, 2024
    Inventors: Han Wool Choi, Jun Hwan Park, Seok Young Youn, Hun Keon Ko, Ho Seong Kang, Hyeon Jeong An, Gyu Jong Hwang, Soo Kyoung Kang, Dong Jin Hyun, Geun Sang Yu
  • Patent number: D1025168
    Type: Grant
    Filed: April 28, 2023
    Date of Patent: April 30, 2024
    Inventors: Han Wool Choi, Jun Hwan Park, Seok Young Youn, Hun Keon Ko, Ho Seong Kang, Hyeon Jeong An, Gyu Jong Hwang, Soo Kyoung Kang, Dong Jin Hyun, Geun Sang Yu
  • Patent number: D1035596
    Type: Grant
    Filed: February 7, 2022
    Date of Patent: July 16, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Hyeon Jeong An, Hyun Seop Lim, Seok Young Youn, Ju Young Yoon, Kyu Jung Kim, Ho Jun Kim, Dong Jin Hyun, Sang In Park
  • Patent number: D1035887
    Type: Grant
    Filed: February 7, 2022
    Date of Patent: July 16, 2024
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Hyeon Jeong An, Hyun Seop Lim, Seok Young Youn, Ju Young Yoon, Kyu Jung Kim, Ho Jun Kim, Dong Jin Hyun, Sang In Park