Patents by Inventor Hyeon Ji BAEK

Hyeon Ji BAEK has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor packages and methods of fabricating the same
    Patent number: 9455230
    Abstract: A semiconductor package includes a semiconductor chip electrically connected to a substrate, and a molding part including first molding members and second molding members arranged in an alternating pattern. The first molding members have a first physical flexibility which is different from a second physical flexibility of the second molding members.
    Type: Grant
    Filed: October 8, 2015
    Date of Patent: September 27, 2016
    Assignee: SK hynix Inc.
    Inventors: Yeon Ji Park, Hyeon Ji Baek, Ki Yong Lee, Jong Hyun Kim
  • Semiconductor chip module, semiconductor package having the same and package module
    Patent number: 8736075
    Abstract: A semiconductor module comprising a plurality of semiconductor chips where at least one semiconductor chip is laterally offset with respect to a second semiconductor chip, and substantially aligned with a third semiconductor chip such that an electrical connection can be made between an electrical contact in the first semiconductor chip and an electrical contact in the third semiconductor chip.
    Type: Grant
    Filed: September 30, 2011
    Date of Patent: May 27, 2014
    Assignee: SK Hynix Inc.
    Inventors: Hyung Ju Choi, Mun Aun Hyun, Jong Hyun Kim, Hyeon Ji Baek
  • SEMICONDUCTOR CHIP MODULE, SEMICONDUCTOR PACKAGE HAVING THE SAME AND PACKAGE MODULE
    Publication number: 20120187560
    Abstract: A semiconductor module comprising a plurality of semiconductor chips where at least one semiconductor chip is laterally offset with respect to a second semiconductor chip, and substantially aligned with a third semiconductor chip such that an electrical connection can be made between an electrical contact in the first semiconductor chip and an electrical contact in the third semiconductor chip.
    Type: Application
    Filed: September 30, 2011
    Publication date: July 26, 2012
    Applicant: HYNIX SEMICONDUCTOR INC.
    Inventors: Hyung Ju CHOI, Mun Aun HYUN, Jong Hyun KIM, Hyeon Ji BAEK