Patents by Inventor Hyeon Kwang KIM

Hyeon Kwang KIM has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ENCAPSULANT PREVENTING LEAD LEAKAGE ON PEROVSKITE, METHOD FOR ENCAPSULATING PEROVSKITE TO PREVENT LEAD LEAKAGE AND PEROVESKITE PHOTOSENSITIVE DEVICE COMPRISING THE SAME
    Publication number: 20240032423
    Abstract: An encapsulant for encapsulating perovskite to prevent lead leakage therefrom, a method for encapsulating perovskite to prevent lead leakage therefrom, and a perovskite photoactive device including the encapsulant are disclosed. The encapsulant for encapsulating perovskite may contain a crown ether-based compound having a benzene ring substituted with an alkyl group. The perovskite encapsulating method may include coating, on a perovskite layer, a solution in which a crown ether-based compound having a benzene ring substituted with an alkyl group is dissolved in an organic solvent. The perovskite photoactive device includes an encapsulant encapsulating the perovskite layer to prevent the lead leakage therefrom.
    Type: Application
    Filed: July 20, 2023
    Publication date: January 25, 2024
    Applicant: PUKYONG NATIONAL UNIVERSITY INDUSTRY-UNIVERSITY COOPERATION FOUNDATION
    Inventors: Junghwan KIM, Na Hyun KIM, Su Min OH, Hyeon Kwang KIM, Sung Heum PARK