Patents by Inventor Hyeon Kyun YOO

Hyeon Kyun YOO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for packaging flexible device using holding wafer, and flexible device manufactured by the same
    Patent number: 10172241
    Abstract: Provided is a flexible device, which includes a flexible substrate, a plurality of electrode lines provided on the flexible substrate and configured to contact the following anisotropic conductive film and then extend to a side of the flexible substrate, an anisotropic conductive film configured to contact the electrode line and laminated on the flexible substrate, a plurality of bumps provided on the anisotropic conductive film, and a circuit board having an electronic device provided at one side thereof and configured to contact the plurality of bumps.
    Type: Grant
    Filed: September 5, 2014
    Date of Patent: January 1, 2019
    Assignee: Korea Advanced Institute of Science and Technology
    Inventors: Kyung Wook Baek, Keon Jae Lee, Geon Tae Hwang, Hyeon Kyun Yoo, Do Hyun Kim, Yoo Sun Kim
  • METHOD FOR PACKAGING FLEXIBLE DEVICE USING HOLDING WAFER, AND FLEXIBLE DEVICE MANUFACTURED BY THE SAME
    Publication number: 20150077949
    Abstract: Provided is a flexible device, which includes a flexible substrate, a plurality of electrode lines provided on the flexible substrate and configured to contact the following anisotropic conductive film and then extend to a side of the flexible substrate, an anisotropic conductive film configured to contact the electrode line and laminated on the flexible substrate, a plurality of bumps provided on the anisotropic conductive film, and a circuit board having an electronic device provided at one side thereof and configured to contact the plurality of bumps.
    Type: Application
    Filed: September 5, 2014
    Publication date: March 19, 2015
    Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY
    Inventors: Kyung Wook Baek, Keon Jae Lee, Geon Tae Hwang, Hyeon Kyun Yoo, Do Hyun Kim, Yoo Sun Kim
  • FLEXIBLE BIOSENSOR AND MANUFACTURING METHOD FOR THE SAME
    Publication number: 20100320086
    Abstract: Provided are a flexible biosensor using a gold binding substance and a method for manufacturing the same. The flexible biosensor includes: a flexible substrate; a silicon substrate which is formed on the flexible substrate and on which source and drain regions doped with a first type impurity are formed with a predetermined gap; and source, drain and gate electrodes which are formed on the silicon substrate and comprise gold, wherein, on the gate electrode, a fused protein which is formed by fusion with a gold binding substance specifically binding to gold is immobilized. Since the biosensor is embodied on a flexible substrate, it may effectively overcome the limitation of the existing biosensor embodied on a silicon substrate.
    Type: Application
    Filed: May 13, 2010
    Publication date: December 23, 2010
    Applicant: KAIST (Korea Advanced Institute of Science and Technology)
    Inventors: Keonjae LEE, Sang Yong LEE, Seung Jun KIM, Hyeon Kyun YOO, Seok Jae LEE, Chi Won AHN, Jae Hong PARK, Tae Jung PARK, Sang Yup LEE