Patents by Inventor Hyeon Lee

Hyeon Lee has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250149111
    Abstract: A method may include applying a protein sequence computation model to generate, based on an input protein sequence, a plurality of proposed protein sequences. A set of possible amino acid residues for each position in at least a portion of an output protein sequence may be identified based on the plurality of proposed protein sequences. A first protein structure having the output protein sequence may be generated by applying a protein structure computation model to select, for each position in at least the portion of the output protein sequence, an amino acid residue from a corresponding set of possible amino acid residues. The protein structure computation model may further determine the conformation of the amino acid residues selected for inclusion in the output protein sequence. In some cases, the first protein structure may be grafted onto a second protein structure to form a third protein structure.
    Type: Application
    Filed: January 7, 2025
    Publication date: May 8, 2025
    Inventors: Simon Paul KELOW, Daniel Joseph BERENBERG, Santrupti NERLI, Andrew Philip LEAVER-FAY, Jack Barton MAGUIRE, Michael Florian CHUNGYOUN, Andrew Martin WATKINS, Jae Hyeon LEE, Stephen Robert RA, Henri Vincent DWYER, Minji Maria LEE, Kyunghyun CHO, Richard A. BONNEAU, Vladimir GLIGORIJEVIC
  • Publication number: 20250149429
    Abstract: In one example, an electronic device comprises a substrate defining an opening between interior sidewalls. An electronic component is disposed in the opening. A lid is disposed beneath the substrate and a first side of the electronic component, and the lid is thermally coupled to the electronic component. Component interconnects can be coupled to a second side of the electronic component opposite the first side. An antenna structure is disposed over the electronic component and electronically coupled to electronic component through the component interconnects. Other examples and related methods are also disclosed herein.
    Type: Application
    Filed: November 8, 2023
    Publication date: May 8, 2025
    Applicant: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Kyoung Yeon Lee, Byong Jin Kim, Sang Hyeon Lee
  • Publication number: 20250141242
    Abstract: A charging and discharging device according to the present disclosure includes: a switching portion electrically connecting or blocking a first channel electrically connected to a first battery and a second channel electrically connected to a second battery; and a mainboard controlling a current supplied to the first channel according to a current value of a first charging and discharging recipe and controlling a current supplied to the second channel according to a current value of a second charging and discharging recipe, and when a current value of the first charging and discharging recipe exceeds a maximum value of a current supplied to the first channel, the mainboard controls the switching portion to electrically connect the first channel and the second channel to supply a current to the first battery through the first channel and the second channel.
    Type: Application
    Filed: October 23, 2024
    Publication date: May 1, 2025
    Inventors: Chang Mook HWANG, Hyun Ji KIM, Jae Woo PARK, Ji Hyeon LEE
  • Publication number: 20250136580
    Abstract: The present disclosure relates to indolinone compounds, compositions, and methods for the inhibition of maternal embryonic leucine zipper kinase (MELK). The present disclosure further relates to indolinone compounds, compositions, and methods for the treatment or prevention of a cancer (for example, triple negative breast cancer).
    Type: Application
    Filed: November 12, 2024
    Publication date: May 1, 2025
    Inventors: Kevin N. Dalby, Ramakrishna Edupuganti, Juliana Taliaferro, Ju Hyeon Lee
  • Publication number: 20250131557
    Abstract: Various embodiments provide an apparatus for analyzing natural killer (NK) cell activity using a lens-free shadow imaging technique and a method therefor. The apparatus for analyzing NK cell activity according to various embodiments has a dedicated algorithm configured to analyze the activity of NK cells on the basis of a lens-free shadow image of the NK cells. According to various embodiments, the dedicated algorithm detects at least one shadow parameter from at least a partial region of the lens-free shadow image, and uses the shadow parameter to analyze the activity of the NK cells. The shadow parameters include at least one of the peak-to-peak distances (PPD) indicating the distances between peaks in the region, the width of secondary maxima (WSM) indicating the width of the maximum brightness in the region, the standard deviation of the WSM (WSM_SD) indicating the standard deviation of the WSM, or the minima of the WSM (WSM_Min) indicating the minimum value of the WSM.
    Type: Application
    Filed: June 13, 2022
    Publication date: April 24, 2025
    Inventors: Sungkyo SEO, A-hyeon LEE, Inha LEE
  • Patent number: 12282459
    Abstract: Provided are a terminal and method for storing and parsing log data. The method includes collecting log data on the basis of a file path of the log data, storing metadata including the file path and log data paired with the metadata in a database (DB), classifying the log data on the basis of the metadata, acquiring type information of a parser related to the log data, and parsing the log data through the parser having the type information.
    Type: Grant
    Filed: January 17, 2023
    Date of Patent: April 22, 2025
    Assignee: S2W INC.
    Inventors: Ji Su Park, Seung Hyeon Lee, Hye Mi Kim
  • Publication number: 20250125096
    Abstract: A multilayer electronic component of the present disclosure may include: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; a connection portion disposed in an end of the internal electrode; an interface plating layer disposed to contact at least a portion of an end of the dielectric layer disposed between the internal electrodes and to cover the connection portion; and an external electrode disposed on the interface plating layer, wherein the connection portion may have a different crystal structure from the internal electrode.
    Type: Application
    Filed: August 28, 2024
    Publication date: April 17, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Seung Min AHN, Hyung Duk YUN, Dong Hyeon LEE, Byung Jun JEON, Chae Min PARK, Joon Hwan KWAG, Hong Seok KIM
  • Publication number: 20250122601
    Abstract: A cam ring and plate module for vehicle vacuum pumps in which, when an oxide layer formed through steam treatment comes into contact with a carbon or graphite material, a uniform carbon layer is stacked on the oxide layer so as to improve corrosion resistance, wear resistance, hardness and seal resistance.
    Type: Application
    Filed: January 25, 2024
    Publication date: April 17, 2025
    Inventors: Hak Soo Kim, Go Woon Jung, Jin Hyeon Lee, Seung Yong Shin, Seung Woo Lee, O Su Jang
  • Patent number: 12278154
    Abstract: In one example, a semiconductor package comprises a substrate having a top surface and a bottom surface, an electronic device mounted on the top surface of the substrate and coupled to one or more interconnects on the bottom surface of the substrate, a cover over the electronic device, a casing around a periphery of the cover, and an encapsulant between the cover and the casing and the substrate.
    Type: Grant
    Filed: April 26, 2023
    Date of Patent: April 15, 2025
    Assignee: Amkor Technology Singapore Holding Pte. Ltd.
    Inventors: Se Man Oh, Kyoung Yeon Lee, Sang Hyeon Lee, Min Cheol Shin
  • Patent number: 12278187
    Abstract: An integrated structure according to a preferred embodiment may include a silicon or silicon-on-insulator (SOI) substrate, a conductive layer spaced apart from the substrate and including a metal or a metal compound, and a diffusion barrier layer provided therebetween. The substrate and the diffusion barrier layer may directly contact and form a van der Waals junction. Since the diffusion barrier layer may block diffusion of metal atoms into the substrate lattice by blocking movement of materials (atoms) between the substrate and the conductive layer and may also control injection of holes from the conductive layer toward the substrate, defects at the metal-semiconductor interface may be controlled to overcome the limitations of ultra-fine and highly integrated semiconductors.
    Type: Grant
    Filed: November 1, 2024
    Date of Patent: April 15, 2025
    Assignee: INDUSTRY-ACADEMIC COOPERATION FOUNDATION GYEONGSANG NATIONAL UNIVERSITY
    Inventors: Jun Hong Park, Do Hyeon Lee, Su Yeon Cho
  • Publication number: 20250117087
    Abstract: A tactile ultrasonic device and a method of processing a user input by using the same. The tactile ultrasonic device may include a plurality of ultrasonic elements including a first ultrasonic element and a second ultrasonic element, which are placed such that beam axes are not parallel to each other. The tactile ultrasonic device may also include a processor that controls vibrations of the ultrasonic elements. A first focus of the first ultrasonic element and a second focus of the second ultrasonic element may be formed within a specific range of a tactile sensing area.
    Type: Application
    Filed: February 26, 2024
    Publication date: April 10, 2025
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Dong Gu Kim, Hyun Soo Kim, Jang Hyeon Lee, Il Seon Yoo, Dae Sung Kwon
  • Publication number: 20250118496
    Abstract: A multilayer electronic component may include: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer; an interface plating layer disposed on an end of the internal electrode; and an external electrode disposed to contact at least a portion of an end of the dielectric layer disposed between the internal electrodes and to cover the interface plating layer, and including a conductive resin layer including a conductive metal and a resin.
    Type: Application
    Filed: September 3, 2024
    Publication date: April 10, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Dong Hyeon LEE, Seung Min AHN, Hyung Duk YUN, Chae Min PARK, Joon Hwan KWAG, Byung Jun JEON, Hong Seok KIM
  • Patent number: 12253505
    Abstract: An embodiment contact combustion type hydrogen sensor includes a substrate including silicon, lamination layers disposed over a top surface of the substrate and including a first thin oxide layer and a first thin nitride layer, a heater over the lamination layers, the heater including a connecting part electrically connected to a predetermined part and a heating part configured to be heated in response to power being applied, insulating layers covering a top surface of the heater and configured to perform an insulating operation, the insulating layers including a second thin oxide layer and a second thin nitride layer, a platinum catalyst over the insulating layers and configured to be heated by the heater to perform a hydrogen reaction, and a slit outside the heating part and passing through the substrate and the lamination layers.
    Type: Grant
    Filed: May 12, 2022
    Date of Patent: March 18, 2025
    Assignees: Hyundai Motor Company, Kia Corporation
    Inventors: Il Seon Yoo, Hyun Soo Kim, Jang Hyeon Lee, Dong Gu Kim, Dae Sung Kwon
  • Publication number: 20250086311
    Abstract: A data processing estimating method for privacy protection using a statistical estimation block design and a system for performing the method is disclosed. A data processing estimating system for privacy protection includes a block design unit for designing block designs for statistical estimation shared between data providers and data users; a modification data generating unit for generating modification data in a random manner along a conditional distribution for the original data of the above statistical estimation block design; and a data distribution estimating unit for estimating the distribution of the original data using an estimation function based on the statistical estimation block design.
    Type: Application
    Filed: April 29, 2024
    Publication date: March 13, 2025
    Applicant: Korea Advanced Institute of Science and Technology
    Inventors: Si-Hyeon LEE, Hyunyoung PARK, Seung-Hyun NAM
  • Patent number: 12249716
    Abstract: A binder for a lithium-sulfur secondary battery cathode, a composition containing the same, and an acrylic binder capable of forming a cross-linked network and a use thereof. The binder contains a polar functional group capable of strongly interacting with sulfur.
    Type: Grant
    Filed: September 26, 2017
    Date of Patent: March 11, 2025
    Assignee: LG ENERGY SOLUTION, LTD.
    Inventors: Jeong Ae Yoon, Yu Mi Kim, Choong Hyeon Lee, Doo Kyung Yang, Sung Soo Yoon
  • Publication number: 20250081343
    Abstract: The present disclosure relates to a printed circuit board including: an insulating layer, a through-hole penetrating the insulating layer from an upper surface to a lower surface of the insulating layer and having an inclined wall surface; a metal ball disposed within the through-hole and in contact with the inclined wall surface; and a metal via filling the through-hole and surrounding the metal ball.
    Type: Application
    Filed: February 7, 2024
    Publication date: March 6, 2025
    Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
    Inventors: Chi Hyeon JEONG, Seok Hwan KIM, Dong Hyeon LEE, Hyun Sang KWAK
  • Publication number: 20250060275
    Abstract: A shock fatigue testing device for a powertrain mount includes: a main frame having a guide support vertically extending from a base plate and a mounting plate coupled to the guide support; a first mount jig mounted to the mounting plate and configured to support the upper portion of a mount member; a second mount jig mounted to a lower portion of the mount member and configured to support the lower portion of the mount member; a weight portion fixed to the second mount jig and configured to apply a load to the mount member; and a vibration portion configured to continuously provide vibration to the base plate to vibrate the weight portion using the main frame, the first mount jig, and the second mount jig as media.
    Type: Application
    Filed: January 11, 2024
    Publication date: February 20, 2025
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION
    Inventors: Woon Ki Cho, Jung Ho Park, Jong Hwan Jang, Ji Hyeon Lee, Hee Sung Lee, Moon Joon Kim, Soon Ju Kim, Jin Young Lee
  • Patent number: 12225725
    Abstract: A semiconductor device includes a vertical stack of gate electrodes. The gate electrodes extend in different lengths to provide contact regions. The gate electrodes have a conductive region and an insulating region. Contact plugs fills contact holes that pass through the stack of gate electrodes in the contact regions. The contact plugs are connected to the gate electrodes. The contact plugs pass through a conductive region of one gate electrode and are electrically connected to the one gate electrode and pass through the insulating region of other gate electrodes in the contact region. The insulating region is disposed outside of the contact holes in a region in which the gate electrodes intersect the contact plugs.
    Type: Grant
    Filed: February 11, 2022
    Date of Patent: February 11, 2025
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventor: So Hyeon Lee
  • Patent number: D1070917
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: April 15, 2025
    Assignee: Shinhan Card Co., Ltd.
    Inventor: Seong Hyeon Lee
  • Patent number: D1073689
    Type: Grant
    Filed: April 29, 2022
    Date of Patent: May 6, 2025
    Assignee: Shinhan Card Co., Ltd.
    Inventor: Seong Hyeon Lee