Abstract: In a method for a thin film forming apparatus, after the deposition of a thin film is completed, a cleaning gas may be introduced repeatedly into an interior of a process chamber for predetermined intervals. The method may be performed without a drastic temperature drop in the process chamber in order to remove a thin film layer left in the chamber. A purge gas may introduced into the chamber continuously or alternatively with the cleaning gas.

Abstract: A mass flow controller includes a leak preventor mechanism having grooves disposed on a valve seat within the gas supply line and/or a particle trap disposed between a control valve and the discharge part configured to prevent particles from being introduced into the control valve in case of backpressure. The mass flow controller further includes a controller body having a flow path for fluid flow, an inlet part for introducing the fluid into the flow path, and a discharge part for discharging the fluid from the flow path. A mass flow sensor is installed adjacent to the inlet part of the controller body and connects to the flow path for measuring a mass flow of the fluid passing through the flow path.

Abstract: Disclosed is a multi-functioned wafer aligner comprising a multi-functioned unit performing a wafer centering operation, a wafer flat zone alignment, and a wafer damage detection, and a main processor deciding positions of the wafer centering operation and the wafer flat zone alignment, and discriminating wafer damage, such as wafer breakage and wafer crack, by calculating an accumulated digital signal inputted from the multi-functioned unit.

Abstract: The present invention provides a secure connection between first and second high capacity electrical terminals. A bolt unit extends through the first and second terminals and supports one side of the first terminal. A connection nut joined with the bolt unit supports a side of the second terminal remote from the first terminal. The side of the first terminal supported by the bolt unit has a surface including a first series of concavities and convexities. The side of the bolt unit in contact with the first terminal includes a second series of concavities and convexities engaged with the first series thereof. Therefore, it is difficult to pivot the joint created between the high capacity electric terminals. The bolt unit also includes a fixing bar that is pivotally supported by the shaft. The fixing bar can be rotated into a locking position to exert a compressive force on the joint.

Abstract: The present invention provides a secure connection between first and second high capacity electrical terminals. A bolt unit extends through the first and second terminals and supports one side of the first terminal. A connection nut joined with the bolt unit supports a side of the second terminal remote from the first terminal. The side of the first terminal supported by the bolt unit has a surface including a first series of concavities and convexities. The side of the bolt unit in contact with the first terminal includes a second series of concavities and convexities engaged with the first series thereof. Therefore, it is difficult to pivot the joint created between the high capacity electric terminals. The bolt unit also includes a fixing bar that is pivotally supported by the shaft. The fixing bar can be rotated into a locking position to exert a compressive force on the joint.

Abstract: Disclosed is a multi-functioned wafer aligner comprising a multi-functioned unit performing a wafer centering operation, a wafer flat zone alignment, and a wafer damage detection, and a main processor deciding positions of the wafer centering operation and the wafer flat zone alignment, and discriminating wafer damage, such as wafer breakage and wafer crack, by calculating an accumulated digital signal inputted from the multi-functioned unit.