Patents by Inventor Hyeon Taek Oh

Hyeon Taek Oh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10419847
    Abstract: The present invention discloses a microspeaker enclosure with porous materials, including a microspeaker, an enclosure with the microspeaker therein, the enclosure defining a resonance space and having an upper casing and a lower casing, porous materials filled in the resonance space of the enclosure, and an anti-noise structure which prevents at least one of a collision between the porous materials, a collision between the porous materials and the enclosure, a collision between the porous materials and the microspeaker, and introduction of the porous materials into the microspeaker.
    Type: Grant
    Filed: June 6, 2017
    Date of Patent: September 17, 2019
    Assignee: EM-TECH. Co., Ltd.
    Inventors: Kyu Dong Choi, Jong Heon Ha, Hyeon Taek Oh
  • Publication number: 20170353785
    Abstract: The present invention discloses a microspeaker enclosure with porous materials, including a microspeaker, an enclosure with the microspeaker therein, the enclosure defining a resonance space and having an upper casing and a lower casing, porous materials filled in the resonance space of the enclosure, and an anti-noise structure which prevents at least one of a collision between the porous materials, a collision between the porous materials and the enclosure, a collision between the porous materials and the microspeaker, and introduction of the porous materials into the microspeaker.
    Type: Application
    Filed: June 6, 2017
    Publication date: December 7, 2017
    Inventors: Kyu Dong Choi, Jong Heon Ha, Hyeon Taek Oh
  • Patent number: 9185477
    Abstract: The present invention relates to a suspension for a sound transducer. The present invention discloses a suspension for a sound transducer, to which a diaphragm and voice coil of the sound transducer are attached and which guides the vibrations of the diaphragm and voice coil, comprising: a central portion to which a voice coil is attached; an outer peripheral portion resting on a frame; and a connecting portion connecting the central portion and the outer peripheral portion, wherein the central portion has a mold portion, which is molded by heat or pressure to take the place of a center diaphragm.
    Type: Grant
    Filed: September 19, 2013
    Date of Patent: November 10, 2015
    Assignee: EM-TECH Co., Ltd.
    Inventors: Ji Hoon Kim, Joong Hak Kwon, Jung Hyung Lee, Hyeon Taek Oh
  • Publication number: 20150208172
    Abstract: The present invention relates to an assembly structure of a diaphragm for a microspeaker. The present invention discloses a bonding structure of a diaphragm for a microspeaker, the boding structure comprising: a suspension including a central portion, an outer peripheral portion, and a connecting portion connecting the central portion and the outer peripheral portion; and a side diaphragm including an inner peripheral portion and an outer peripheral portion, which are attached to the central portion and outer peripheral portion of the suspension, respectively, and a dome portion, which projects between the inner peripheral portion and the outer peripheral portion, wherein the suspension and the side diaphragm are attached by thermal compression.
    Type: Application
    Filed: January 23, 2015
    Publication date: July 23, 2015
    Inventors: Ji Hoon Kim, Joong Hak Kwon, Jung Hyung Lee, Hyeon Taek Oh
  • Patent number: 9027700
    Abstract: The present invention relates to an assembly structure of a diaphragm for a microspeaker. The present invention discloses a bonding structure of a diaphragm for a microspeaker, the boding structure comprising: a suspension including a central portion, an outer peripheral portion, and a connecting portion connecting the central portion and the outer peripheral portion; and a side diaphragm including an inner peripheral portion and an outer peripheral portion, which are attached to the central portion and outer peripheral portion of the suspension, respectively, and a dome portion, which projects between the inner peripheral portion and the outer peripheral portion, wherein the suspension and the side diaphragm are attached by thermal compression.
    Type: Grant
    Filed: September 19, 2013
    Date of Patent: May 12, 2015
    Assignee: Em-Tech. Co., Ltd.
    Inventors: Ji Hoon Kim, Joong Hak Kwon, Jung Hyung Lee, Hyeon Taek Oh
  • Publication number: 20140318885
    Abstract: The present invention relates to an assembly structure of a diaphragm for a microspeaker. The present invention discloses a bonding structure of a diaphragm for a microspeaker, the boding structure comprising: a suspension including a central portion, an outer peripheral portion, and a connecting portion connecting the central portion and the outer peripheral portion; and a side diaphragm including an inner peripheral portion and an outer peripheral portion, which are attached to the central portion and outer peripheral portion of the suspension, respectively, and a dome portion, which projects between the inner peripheral portion and the outer peripheral portion, wherein the suspension and the side diaphragm are attached by thermal compression.
    Type: Application
    Filed: September 19, 2013
    Publication date: October 30, 2014
    Applicant: Em-Tech. Co., LTd.
    Inventors: Ji Hoon Kim, Joong Hak Kwon, Jung Hyung Lee, Hyeon Taek Oh
  • Publication number: 20140321691
    Abstract: The present invention relates to a suspension for a sound transducer. The present invention discloses a suspension for a sound transducer, to which a diaphragm and voice coil of the sound transducer are attached and which guides the vibrations of the diaphragm and voice coil, comprising: a central portion to which a voice coil is attached; an outer peripheral portion resting on a frame; and a connecting portion connecting the central portion and the outer peripheral portion, wherein the central portion has a mold portion, which is molded by heat or pressure to take the place of a center diaphragm.
    Type: Application
    Filed: September 19, 2013
    Publication date: October 30, 2014
    Applicant: Em-Tech. Co., Ltd.
    Inventors: Ji Hoon Kim, Joong Hak Kwon, Jung Hyung Lee, Hyeon Taek Oh
  • Publication number: 20120124175
    Abstract: Provided are an Atom-based really simple syndication (RSS) content reader system and method, and an RSS content providing system and method. The RSS content reader system may include a feed reader module to receive a feed related to a content from a web server for providing a syndication service and to store the feed, and a feed query module to request an updated content to the web server through a query using update information of the feed.
    Type: Application
    Filed: December 17, 2010
    Publication date: May 17, 2012
    Inventors: Jin Hong Yang, Hyeon Taek Oh, Hyo Jin Park, Jun Kyun Choi