Patents by Inventor Hyeon Ung WANG

Hyeon Ung WANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220098434
    Abstract: The present invention relates to a powder coating composition comprising an epoxy resin, a curing agent, a pigment, and a catalyst, wherein the pigment comprises an extender pigment having an average particle size of 1.0 ?m to 8.0 ?m, and the catalyst comprises an aliphatic imidazole compound and an aromatic imidazole compound.
    Type: Application
    Filed: November 20, 2019
    Publication date: March 31, 2022
    Inventors: Jae Jun LEE, Hyeon Ung WANG, Jin Seok LEE
  • Patent number: 11084945
    Abstract: The present invention provides a powder coating composition comprising a diisocyanate-modified bisphenol A epoxy resin, a curing agent, an auxiliary curing agent, an enhancer, and an extender pigment, wherein the auxiliary curing agent comprises an alkanolamine-modified epoxy polyol resin.
    Type: Grant
    Filed: October 10, 2017
    Date of Patent: August 10, 2021
    Assignee: KCC Corporation
    Inventors: Hyeon Ung Wang, Jin Seok Lee, Sung Hwan Yun
  • Publication number: 20190345343
    Abstract: The present invention provides a powder coating composition comprising a diisocyanate-modified bisphenol A epoxy resin, a curing agent, an auxiliary curing agent, an enhancer, and an extender pigment, wherein the auxiliary curing agent comprises an alkanolamine-modified epoxy polyol resin.
    Type: Application
    Filed: October 10, 2017
    Publication date: November 14, 2019
    Inventors: Hyeon Ung WANG, Jin Seok LEE, Sung Hwan YUN