Patents by Inventor Hyeon-Woo Chae

Hyeon-Woo Chae has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method of manufacturing LED module
    Patent number: 9374909
    Abstract: The present invention relates to a method of manufacturing an LED module, which enhances heat dissipation efficiency of the LED module through a configuration of installing a plurality of electrically separated conductive electrode plates to be close to each other on a same plane, stacking insulation layers on the top and bottom sides of the electrode plates, forming a plurality of ground holes on one side of the insulation layers to expose the electrode plates, and then grounding both electrodes of LED chips to the separated electrode plates.
    Type: Grant
    Filed: March 3, 2014
    Date of Patent: June 21, 2016
    Assignee: BARDWELL & MCALISTER INC.
    Inventor: Hyeon-Woo Chae
  • METHOD OF MANUFACTURING LED MODULE
    Publication number: 20140259654
    Abstract: The present invention relates to a method of manufacturing an LED module, which enhances heat dissipation efficiency of the LED module through a configuration of installing a plurality of electrically separated conductive electrode plates to be close to each other on a same plane, stacking insulation layers on the top and bottom sides of the electrode plates, forming a plurality of ground holes on one side of the insulation layers to expose the electrode plates, and then grounding both electrodes of LED chips to the separated electrode plates.
    Type: Application
    Filed: March 3, 2014
    Publication date: September 18, 2014
    Applicant: BARDWELL & MCALISTER INC.
    Inventor: Hyeon-Woo Chae